摘要:
A method for additive manufacturing includes forming an object including depositing a first material including a first coloring component and a second material including a second coloring component, wherein both the first material and the second material further include a corresponding fluorescent component, scanning the object, including causing an emission of an optical signal from the object, wherein the emission of the optical signal is caused at least in part by an emission from the fluorescent components interacting with the first coloring component and the second coloring component as it passes from the fluorescent components to the surface of the object, sensing the emission of the optical signal, and determining presence of the first material and the second material based at least in part on the sensed emission of the optical signal.
摘要:
At least one microneedle comprises a hydrogel material that includes a substance that fluoresces when the substance interacts with an analyte. A magnitude of the fluorescence varies as a function of the concentration of the analyte. During use, the hydrogel material is illuminated with illumination light in a first wavelength range while the hydrogel material interfaces with the dermal interstitial fluid layer of a subject, and a photosensor generates an output that corresponds to an amount of light received in a second wavelength range.
摘要:
The invention pertains to the use of sophisticated chemical formulation and spectroscopic design methods to select taggants compatible with the 3D print medium that are easily detected spectroscopically but otherwise compatible with the product, structural integrity and stability, and aesthetics. A spectral pattern employs a different chemical or combination of chemicals to alter the formulation of all or some portion of the printed object so that its authenticity can be monitored later using a spectrometer.
摘要:
A radiation imaging device includes a radiation source and a micro structured detector comprising a material defining a surface that faces the radiation source. The material includes a plurality of discreet cavities having openings in the surface. The detector also includes a plurality of quantum dots disclosed in the cavities. The quantum dots are configured to interact with radiation from the radiation source, and to emit visible photons that indicate the presence of radiation. A digital camera and optics may be used to capture images formed by the detector in response to exposure to radiation.
摘要:
A scintillator includes an activated scintillator region formed in an isotropic shape and configured to generate isotropic emissions of photons and neutrons resulting from fission, and a non-activated scintillator stop region on a surface of the activated scintillator region.
摘要:
A Light Emitting Diode (LED) fluorescent cover comprises the following components by weight: 90-96% of single-component solid silicone rubber, 3-8% of fluorescent powder and 1-2% of vulcanizer; and the preparation method includes the following steps: step 1): using mixed compound of the single-component solid silicone rubber, as well as the fluorescent powder and the vulcanizer as raw material to mix, standing for 2-4 h after mixing with open mill or internal mixer; step 2): controlling temperature, pressure and vulcanization time of vulcanizing machine according to size of the fluorescent cover mould, using the vulcanizing machine to carry out first vulcanization to the raw material that is obtained from the step 1) and placed in the fluorescent cover mould; step 3): with combined action of blower gun, taking the fluorescent cover out slowly; step 4): baking the semi-finished product in a closed space at a temperature of 150-200° C. for 1-2 h.
摘要:
A method for producing an escape route marking in a heatable and malleable support mold is described. The escape route marking has a transparent covering, a supporting element and a photoluminescent material. The method includes procuring the heatable and malleable support mold, inserting a supporting element into the support mold, arranging the photoluminescent material on the supporting element, arranging the transparent covering on the supporting element, heating and deforming the escape route marking in the support mold and solidifying the escape route marking in the support mold in a predetermined position. The resulting escape route marking is also described.
摘要:
A method comprising injection molding a plastic part from a polymer formulation comprising an injection moldable thermoplastic and a fluorescent compound, wherein the fluorescent compound has a decomposition temperature that establishes a maximum processing temperature for the polymer formulation. The fluorescent compound will thermally decompose to generate gaseous products causing visible bubble formation in the surface of the plastic part in response to exposure to a processing temperature that exceeds the decomposition temperature of the fluorescent compound. If the plastic part was processed without exposure to a processing temperature that exceeds the decomposition temperature of the fluorescent compound, then any fluorescent compound within the plastic part will cause the plastic part to fluoresce in response to exposure to black light. A suitable fluorescent compound may be, for example, selected from oxalates, carbamic acids, carbonic acids, diazocarbonyl compounds, and combinations thereof. A preferred fluorescent compound is bis(2,4,6-trichlorophenyl)oxalate.
摘要:
A method of bonding at least two substrates, each substrate having at least one surface that includes a layer of SU8, said method comprising soft baking at least a portion of the layer of SU8 of the first and second substrates, exposing at least the portion of the layer of SU8 of the first and second substrates to ultraviolet (UV) radiation to cross-link at least the portion of the layer of SU8 of the second substrate to a suitable degree, post exposure baking at least the portion of the layer of SU8 of the first substrate at a temperature greater than or equal to 20 degree Celsius (° C.) and less than or equal to 50 degree Celsius (° C.) to cross-link at least the portion of the layer of SU8 of the first substrate to a suitable degree. The method also includes compressing the portion of the cross-linked layer of SU8 of the first substrate against the portion of the cross-linked layer of SU8 of the second substrate at a suitable starting temperature (Ts) for a suitable time period (tcomp). In addition, the method also includes elevating the temperature during compression from Ts to a suitable elevated temperature (Te), thereby bonding the first and second substrates.