摘要:
A Light Emitting Diode (LED) fluorescent cover comprises the following components by weight: 90-96% of single-component solid silicone rubber, 3-8% of fluorescent powder and 1-2% of vulcanizer; and the preparation method includes the following steps: step 1): using mixed compound of the single-component solid silicone rubber, as well as the fluorescent powder and the vulcanizer as raw material to mix, standing for 2-4 h after mixing with open mill or internal mixer; step 2): controlling temperature, pressure and vulcanization time of vulcanizing machine according to size of the fluorescent cover mould, using the vulcanizing machine to carry out first vulcanization to the raw material that is obtained from the step 1) and placed in the fluorescent cover mould; step 3): with combined action of blower gun, taking the fluorescent cover out slowly; step 4): baking the semi-finished product in a closed space at a temperature of 150-200° C. for 1-2 h.
摘要:
A Light Emitting Diode (LED) fluorescent cover comprises the following components by weight: 90-96% of single-component solid silicone rubber, 3-8% of fluorescent powder and 1-2% of vulcanizer; and the preparation method includes the following steps: step 1): using mixed compound of the single-component solid silicone rubber, as well as the fluorescent powder and the vulcanizer as raw material to mix, standing for 2-4 h after mixing with open mill or internal mixer; step 2): controlling temperature, pressure and vulcanization time of vulcanizing machine according to size of the fluorescent cover mould, using the vulcanizing machine to carry out first vulcanization to the raw material that is obtained from the step 1) and placed in the fluorescent cover mould; step 3): with combined action of blower gun, taking the fluorescent cover out slowly; step 4): baking the semi-finished product in a closed space at a temperature of 150-200° C. for 1-2 h.
摘要:
The present invention relates to the technical field of LED packaging, in particular to an easily-assembled COB lamp bead, a support for the lamp bead, a method for manufacturing the lamp bead and an easily-assembled LED module using the lamp bead. For the LED lamp bead provided by the present invention, as a first metal welding layer is provided on the bottom surface, it is just required to directly weld the lamp bead in a heat sink during assembling. Due to a power-taking slot formed of a positive plate and a negative plate in a matched manner, it is just required to insert one end of a driving circuit board, having a conductive terminal, into the slot during assembling. Hence, the whole assembling process is very simple, and both the efficiency and quality of assembling are effectively improved.