Bitline precharge system for a semiconductor memory device

    公开(公告)号:US11776623B2

    公开(公告)日:2023-10-03

    申请号:US17815003

    申请日:2022-07-26

    CPC classification number: G11C11/419

    Abstract: A bitline precharge system is provided for a semiconductor memory device. The bitline precharge system comprises a voltage comparator circuit to output a reference voltage signal based on an input wordline voltage supply level (VDDWL), and a periphery power supply voltage (VDDP) level. A voltage control circuit is electrically coupled to a periphery power supply and the voltage comparator circuit to output a precharge voltage (VDDM) level based on the reference voltage signal and the periphery power supply voltage (VDDP) level. A bitline precharge circuit is electrically coupled to the voltage control circuit and a plurality of bitlines of the memory device to precharge the plurality of bitlines based on the precharge voltage (VDDM) level in response to a precharge enable signal during one of a read operation to read data from the memory device and a write operation to write data from the memory device. Further, the at least one bitline is discharged from the precharge voltage (VDDM) level during at least one of the read operation or the write operation.

    Bitline precharge system for a semiconductor memory device

    公开(公告)号:US11410720B2

    公开(公告)日:2022-08-09

    申请号:US16952712

    申请日:2020-11-19

    Abstract: A bitline precharge system is provided for a semiconductor memory device. The bitline precharge system comprises a voltage comparator circuit to output a reference voltage signal based on an input wordline voltage supply level (VDDWL), and a periphery power supply voltage (VDDP) level. A voltage control circuit is electrically coupled to a periphery power supply and the voltage comparator circuit to output a precharge voltage (VDDM) level based on the reference voltage signal and the periphery power supply voltage (VDDP) level. A bitline precharge circuit is electrically coupled to the voltage control circuit and a plurality of bitlines of the memory device to precharge the plurality of bitlines based on the precharge voltage (VDDM) level in response to a precharge enable signal during one of a read operation to read data from the memory device and a write operation to write data from the memory device. Further, the at least one bitline is discharged from the precharge voltage (VDDM) level during at least one of the read operation or the write operation.

    Level shifter circuits
    5.
    发明授权

    公开(公告)号:US11290092B1

    公开(公告)日:2022-03-29

    申请号:US17175818

    申请日:2021-02-15

    Abstract: An apparatus includes a NMOS transistor having a drain, a first PMOS transistor having a drain connected to the drain of the NMOS transistor, a level shifter having an input and an output, the input of the level shifter being connected to the drain of the NMOS transistor and the drain of the first PMOS transistor, a first digital logic circuit having a drain and a gate, a first inverter having an input connected to the Aoutput of the level shifter and the drain of the first digital logic circuit, and a second digital logic circuit having an output connected to the gate of the first digital logic circuit, at least one condition being set in the apparatus during a read operation.

    Methods and apparatuses to reduce power dissipation in a static random access memory (SRAM) device

    公开(公告)号:US10522218B2

    公开(公告)日:2019-12-31

    申请号:US16190278

    申请日:2018-11-14

    Abstract: Embodiments herein provide a method for reducing power dissipation in a Static Random Access Memory (SRAM) device. The method includes determining, by the tracking circuit, whether at least one SRAM Bit-Cell discharges power from at least one BL exceeding a pre-defined voltage level required for a sense amplifier to perform a read operation. Furthermore, the method includes reducing, by the WL driver, the power discharged from the at least one BL by controlling a WL voltage power supply switch of the WL driver using a SAE signal and adjusting a pulse width of the at least one WL to pull down the at least one WL using a NMOS circuit when the at least one SRAM Bit-Cell discharges the power from the at least one BL exceeding the pre-defined voltage level.

    METHOD FOR HIGH PERFORMANCE STANDARD CELL DESIGN TECHNIQUES IN FINFET BASED LIBRARY USING LOCAL LAYOUT EFFECTS (LLE)

    公开(公告)号:US20190006388A1

    公开(公告)日:2019-01-03

    申请号:US16124946

    申请日:2018-09-07

    Abstract: Inventive concepts describe a method for high performance standard cell design techniques in FinFET based library using LLE. Inventive concepts describe a fabrication process using a standard FinFET cell layout having double diffusion breaks (DDBs) and single diffusion breaks (SDBs). According to one example embodiment, the method comprises of removing one or more fingers of a P-type FinFet (PFET) from a standard FinFET cell layout. After removing the one or more fingers, a Half-Double Diffusion Break (Half-DDB) is introduced on a N-type FinFET (NFET) side inside a cell boundary using a cut-poly layer. The cut-poly layer not only isolates the PFET and NFET gates and also becomes an integral part of hybrid structure. Further, the removed one or more fingers of PFET gates are converted to two floating PFET gates by shorting a drain terminal and a source terminal of the PFET gate to a common power net.

    Method for high performance standard cell design techniques in finFET based library using local layout effects (LLE)

    公开(公告)号:US10103172B2

    公开(公告)日:2018-10-16

    申请号:US15613712

    申请日:2017-06-05

    Abstract: Inventive concepts describe a method for high performance standard cell design techniques in FinFET based library using LLE. Inventive concepts describe a fabrication process using a standard FinFET cell layout having double diffusion breaks (DDBs) and single diffusion breaks (SDBs). According to one example embodiment, the method comprises of removing one or more fingers of a P-type FinFet (PFET) from a standard FinFET cell layout. After removing the one or more fingers, a Half-Double Diffusion Break (Half-DDB) is introduced on a N-type FinFET (NFET) side inside a cell boundary using a cut-poly layer. The cut-poly layer not only isolates the PFET and NFET gates and also becomes an integral part of hybrid structure. Further, the removed one or more fingers of PFET gates are converted to two floating PFET gates by shorting a drain terminal and a source terminal of the PFET gate to a common power net.

    BITLINE PRECHARGE SYSTEM FOR A SEMICONDUCTOR MEMORY DEVICE

    公开(公告)号:US20220366970A1

    公开(公告)日:2022-11-17

    申请号:US17815003

    申请日:2022-07-26

    Abstract: A bitline precharge system is provided for a semiconductor memory device. The bitline precharge system comprises a voltage comparator circuit to output a reference voltage signal based on an input wordline voltage supply level (VDDWL), and a periphery power supply voltage (VDDP) level. A voltage control circuit is electrically coupled to a periphery power supply and the voltage comparator circuit to output a precharge voltage (VDDM) level based on the reference voltage signal and the periphery power supply voltage (VDDP) level. A bitline precharge circuit is electrically coupled to the voltage control circuit and a plurality of bitlines of the memory device to precharge the plurality of bitlines based on the precharge voltage (VDDM) level in response to a precharge enable signal during one of a read operation to read data from the memory device and a write operation to write data from the memory device. Further, the at least one bitline is discharged from the precharge voltage (VDDM) level during at least one of the read operation or the write operation.

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