公开(公告)号：US20170040293A1

公开(公告)日：2017-02-09

申请号：US15215583

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu KIM ,  Ji-sun HONG ,  Su-jung HYUNG ,  Hyun-ki KIM ,  Hyun LEE

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/498 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/14 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.

Abstract translation: 提供了一种印刷电路板（PCB），其能够在模制过程中阻止杂质的引入，以减少半导体封装的损坏，制造PCB的方法，以及通过使用PCB制造半导体封装的方法。 一个实施例包括一种装置，包括：衬底主体，包括在有源区的外部部分上的有源区和虚拟区，衬底主体沿第一方向纵向延伸; 安装在有源区上的多个半导体单元; 以及形成在所述虚拟区域上的屏障，其中所述屏障沿所述第一方向延伸。

公开(公告)号：US20170064818A1

公开(公告)日：2017-03-02

申请号：US15197736

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu KIM ,  Hyun LEE ,  Dong-han KIM

IPC: H05K1/02 ,  H05K3/00 ,  H01L21/48 ,  H05K1/03 ,  H01L23/498

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.

Abstract translation: 封装板包括包括电路层和纤维层的堆叠结构。 纤维层包括沿第一方向延伸并且是无纺纤维的至少一个第一纤维。 此外，预浸料坯包括作为无纺纤维的第一纤维; 与第一纤维间隔开并且是编织纤维的多个第二纤维; 以及填充第一纤维和多个第二纤维之间的间隙的绝缘层。