公开(公告)号：US20170064818A1

公开(公告)日：2017-03-02

申请号：US15197736

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu KIM ,  Hyun LEE ,  Dong-han KIM

IPC: H05K1/02 ,  H05K3/00 ,  H01L21/48 ,  H05K1/03 ,  H01L23/498

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.

Abstract translation: 封装板包括包括电路层和纤维层的堆叠结构。 纤维层包括沿第一方向延伸并且是无纺纤维的至少一个第一纤维。 此外，预浸料坯包括作为无纺纤维的第一纤维; 与第一纤维间隔开并且是编织纤维的多个第二纤维; 以及填充第一纤维和多个第二纤维之间的间隙的绝缘层。