公开(公告)号：US20170040293A1

公开(公告)日：2017-02-09

申请号：US15215583

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu KIM ,  Ji-sun HONG ,  Su-jung HYUNG ,  Hyun-ki KIM ,  Hyun LEE

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/498 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/14 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.

Abstract translation: 提供了一种印刷电路板（PCB），其能够在模制过程中阻止杂质的引入，以减少半导体封装的损坏，制造PCB的方法，以及通过使用PCB制造半导体封装的方法。 一个实施例包括一种装置，包括：衬底主体，包括在有源区的外部部分上的有源区和虚拟区，衬底主体沿第一方向纵向延伸; 安装在有源区上的多个半导体单元; 以及形成在所述虚拟区域上的屏障，其中所述屏障沿所述第一方向延伸。

公开(公告)号：US20210320043A1

公开(公告)日：2021-10-14

申请号：US17355831

申请日：2021-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young OH ,  Hyun-ki KIM ,  Sang-soo KIM ,  Seung-hwan KIM ,  Yong-kwan LEE

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.

公开(公告)号：US20170249010A1

公开(公告)日：2017-08-31

申请号：US15396942

申请日：2017-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-ki JUNG ,  Hyun-ki KIM ,  Jae-min MOON ,  Chi-yul YOON ,  Sang-min LEE ,  Seong-hyun JANG

IPC: G06F3/01 ,  A61N1/36

CPC classification number: G06F3/015 ,  A61N1/36 ,  A61N1/36036 ,  G06F3/011 ,  G06F3/012 ,  G06F3/016 ,  G06F3/017

Abstract: A video display apparatus includes a display configured to reproduce a video, a processor configured to generate a signal for applying an electrical stimulus to a user, based on a motion depicted in the video, and a communication unit configured to transmit the signal to an electrical stimulation apparatus.

公开(公告)号：US20200043820A1

公开(公告)日：2020-02-06

申请号：US16357732

申请日：2019-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young OH ,  Hyun-ki KIM ,  Sang-soo KIM ,  Seung-hwan KIM ,  Yong-kwan LEE

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/528

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.

公开(公告)号：US20190295917A1

公开(公告)日：2019-09-26

申请号：US16190825

申请日：2018-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kil-soo KIM ,  Yong-hoon KIM ,  Hyun-ki KIM ,  Kyung-suk OH

IPC: H01L23/367 ,  H01L23/31 ,  H01L25/065 ,  H01L23/552 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, a heat emission member on the lower semiconductor chip, the heat emission member having a horizontal unit and a vertical unit connected to the horizontal unit, a first semiconductor chip stack and a second semiconductor chip stack on the horizontal unit, and a molding member that surrounds the lower semiconductor chip, the first and second semiconductor chip stacks, and the heat emission member. The vertical unit may be arranged between the first semiconductor chip stack and the second semiconductor chip stack, and an upper surface of the vertical unit may be exposed in the molding member.

公开(公告)号：US20170125119A1

公开(公告)日：2017-05-04

申请号：US15232586

申请日：2016-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yang-gyoon LOH ,  Je-min RYU ,  Hyun-ki KIM ,  Yoon-jae JEONG

IPC: G11C17/18 ,  G11C17/16 ,  G11C29/12

CPC classification number: G11C17/18 ,  G11C8/12 ,  G11C17/16 ,  G11C29/1201 ,  G11C29/88 ,  G11C2029/4402

Abstract: Provided is a semiconductor device including chip identification (ID) generation circuits. The semiconductor device may be a multi-chip package including a plurality of memory chips, and each of the memory chips includes a chip ID generation circuit configured to selectively modify a chip ID of a corresponding memory chip. The chip ID generation circuit determines the chip ID of the memory chip by testing the chip ID of the memory chip by using a mode register, and selectively programs the chip ID of the memory chip by using at least two fuse sets. The chip ID generation circuit may block an output of the chip ID of the memory chip when the memory chip is determined as a defective chip or is selected to stop its use.

公开(公告)号：US20150205458A1

公开(公告)日：2015-07-23

申请号：US14522725

申请日：2014-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-ki KIM ,  Yong-hwan KWON

IPC: G06F3/0482 ,  G06F3/0481

CPC classification number: H04N21/485 ,  H04N21/4312 ,  H04N21/4532 ,  H04N21/4755

Abstract: A controlling method for arranging a content list of a display apparatus is provided. The method includes storing at least one content selected by a user, displaying a content list including the at least one content, and in response to a location fixation command related to one of the at least one content included in the content list being input, fixing a location of the selected at least one content on the content list. Accordingly, the content list can be arranged efficiently.

Abstract translation: 提供一种用于布置显示装置的内容列表的控制方法。 该方法包括存储由用户选择的至少一个内容，显示包括至少一个内容的内容列表，以及响应于与输入的内容列表中包括的至少一个内容中的一个相关的位置固定命令，固定 该内容列表上所选择的至少一个内容的位置。 因此，可以有效地布置内容列表。