公开(公告)号：US20150263225A1

公开(公告)日：2015-09-17

申请号：US14492594

申请日：2014-09-22

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA PHOTONICS TECHNOLOGY INSTITUTE

Inventor： Jae-soong LEE ,  Young-ho SONG ,  Seong-ran JEON ,  Seung-hwan KIM

IPC: H01L33/06 ,  H01L33/50 ,  H01L33/32 ,  H01L33/24 ,  H01L33/00

CPC classification number: H01L33/06 ,  H01L33/0025 ,  H01L33/0075 ,  H01L33/18 ,  H01L33/24 ,  H01L33/28 ,  H01L33/32 ,  H01L33/502 ,  H01L2933/0041

Abstract: Devices having nitride quantum dots and methods of manufacturing the same are provided. The device includes a nitride group material substrate, a plurality of nanorods that are formed on the nitride group material layer and are separated from each other, and a nitride quantum dot on each of the nanorods. A pyramid-shaped layer may be further formed between each of the nanorods and the nitride quantum dot. The nanorods and the nitride quantum dot are covered by an upper contact layer. A plurality of nitride quantum dots may be formed on each of the nanorods and the respective nitride quantum dots may have different sizes.

Abstract translation: 提供了具有氮化物量子点的器件及其制造方法。 该装置包括氮化物基材料基板，形成在氮化物基材料层上并彼此分离的多个纳米棒，以及每个纳米棒上的氮化物量子点。 可以在每个纳米棒和氮化物量子点之间进一步形成金字塔形层。 纳米棒和氮化物量子点被上接触层覆盖。 可以在每个纳米棒上形成多个氮化物量子点，并且各个氮化物量子点可以具有不同的尺寸。

公开(公告)号：US20200043820A1

公开(公告)日：2020-02-06

申请号：US16357732

申请日：2019-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young OH ,  Hyun-ki KIM ,  Sang-soo KIM ,  Seung-hwan KIM ,  Yong-kwan LEE

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/528

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.

公开(公告)号：US20210320043A1

公开(公告)日：2021-10-14

申请号：US17355831

申请日：2021-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young OH ,  Hyun-ki KIM ,  Sang-soo KIM ,  Seung-hwan KIM ,  Yong-kwan LEE

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.