公开(公告)号：US20210183757A1

公开(公告)日：2021-06-17

申请号：US17017638

申请日：2020-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI HWANG KIM ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

公开(公告)号：US11131568B2

公开(公告)日：2021-09-28

申请号：US17002071

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngshin Kwon ,  Minjin Kim ,  Woonbae Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Inho Choi

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US10760930B2

公开(公告)日：2020-09-01

申请号：US16131467

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngshin Kwon ,  Minjin Kim ,  Woonbae Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Inho Choi

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US11125734B2

公开(公告)日：2021-09-21

申请号：US16109758

申请日：2018-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inho Choi ,  Minjin Kim ,  Sungwoo Park ,  Youngdoo Jung ,  Eunhee Jung ,  Sungeun Jo

IPC: G01N33/00 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/10 ,  H01L23/552

Abstract: Disclosed is a gas sensor package. The gas sensor package comprises a package substrate, a controller on the package substrate, a plurality of gas sensors on the controller, and a lid on the package substrate and the lid comprising a hole extending between a first surface and a second surface of the lid, the first surface of the lid facing away the package substrate and the second surface of the lid facing toward the package substrate. The gas sensors sense different types of gases.

公开(公告)号：US11067554B2

公开(公告)日：2021-07-20

申请号：US16124385

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjin Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Sungeun Jo ,  Inho Choi

IPC: G01N33/00 ,  G01N27/12 ,  G01N27/407 ,  G01N27/04 ,  H01L23/31 ,  H05K1/03 ,  H01L23/00 ,  H01L23/498 ,  H01L27/02 ,  H01L23/02

Abstract: A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.

公开(公告)号：US12062605B2

公开(公告)日：2024-08-13

申请号：US18308433

申请日：2023-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hwang Kim ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/45 ,  H01L25/0657

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

公开(公告)号：US11658107B2

公开(公告)日：2023-05-23

申请号：US17807894

申请日：2022-06-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hwang Kim ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/45 ,  H01L25/0657

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

公开(公告)号：US11367679B2

公开(公告)日：2022-06-21

申请号：US17017638

申请日：2020-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hwang Kim ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

公开(公告)号：US10923428B2

公开(公告)日：2021-02-16

申请号：US16432551

申请日：2019-06-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hwang Kim ,  Kilsoo Kim ,  Jongbo Shim ,  Jangwoo Lee ,  Eunhee Jung

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/498

Abstract: A semiconductor package includes a substrate, a semiconductor chip mounted on the substrate, an interposer chip on the semiconductor chip and including a redistribution pattern, a first pad on the interposer chip, a second pad on the interposer chip and spaced apart from the first pad, and a bonding wire electrically connected to the second pad and the first substrate. The second pad is electrically connected through the redistribution pattern to the first pad. The footprint of the interposer chip is greater than the footprint of the first semiconductor chip.