公开(公告)号：US20230352411A1

公开(公告)日：2023-11-02

申请号：US18090856

申请日：2022-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunseok Choi ,  Jongbo Shim ,  Heeyoub Kang ,  Sungeun Jo

IPC: H01L23/538 ,  H01L25/16 ,  H01L23/12 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/538 ,  H01L25/16 ,  H01L23/12 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01L23/3157 ,  H01L2223/6672 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/16237

Abstract: A semiconductor package includes a package substrate with first and second mounting regions at a top surface of the package substrate, a first semiconductor chip disposed on the first mounting region, a second semiconductor chip disposed on the second mounting region, an interposer substrate disposed on the second mounting region and covering the second semiconductor chip, a plurality of conductive connectors extending from a bottom surface of the interposer substrate to the top surface of the package substrate and laterally spaced apart from the second semiconductor chip, and a third semiconductor chip on a top surface of the interposer substrate. A first distance between a top surface of the first semiconductor chip and the top surface of the package substrate is greater than a second distance between the top surface of the interposer substrate and the top surface of the package substrate.

公开(公告)号：US11131568B2

公开(公告)日：2021-09-28

申请号：US17002071

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngshin Kwon ,  Minjin Kim ,  Woonbae Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Inho Choi

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US10760930B2

公开(公告)日：2020-09-01

申请号：US16131467

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngshin Kwon ,  Minjin Kim ,  Woonbae Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Inho Choi

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US20230063886A1

公开(公告)日：2023-03-02

申请号：US17844395

申请日：2022-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngdeuk Kim ,  Jaechoon Kim ,  Taehwan Kim ,  Kyungsuk Oh

IPC: H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip stacked on the first semiconductor chip, and a plurality of third semiconductor chips sequentially stacked on the second semiconductor chip, in which a horizontal width of each of the first semiconductor chip and the second semiconductor chip is greater than a horizontal width of each of the plurality of third semiconductor chips, and the first semiconductor chip and the second semiconductor chip are connected to each other through direct contact of a bonding pad.

公开(公告)号：US10776601B2

公开(公告)日：2020-09-15

申请号：US16027620

申请日：2018-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woonbae Kim ,  Jikho Song ,  Sungeun Jo ,  Ji-Yong Park ,  Jeong-Kyu Ha

IPC: G06K9/28 ,  G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US11125734B2

公开(公告)日：2021-09-21

申请号：US16109758

申请日：2018-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inho Choi ,  Minjin Kim ,  Sungwoo Park ,  Youngdoo Jung ,  Eunhee Jung ,  Sungeun Jo

IPC: G01N33/00 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/10 ,  H01L23/552

Abstract: Disclosed is a gas sensor package. The gas sensor package comprises a package substrate, a controller on the package substrate, a plurality of gas sensors on the controller, and a lid on the package substrate and the lid comprising a hole extending between a first surface and a second surface of the lid, the first surface of the lid facing away the package substrate and the second surface of the lid facing toward the package substrate. The gas sensors sense different types of gases.

公开(公告)号：US11067554B2

公开(公告)日：2021-07-20

申请号：US16124385

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjin Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Sungeun Jo ,  Inho Choi

IPC: G01N33/00 ,  G01N27/12 ,  G01N27/407 ,  G01N27/04 ,  H01L23/31 ,  H05K1/03 ,  H01L23/00 ,  H01L23/498 ,  H01L27/02 ,  H01L23/02

Abstract: A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.