公开(公告)号：US10282587B2

公开(公告)日：2019-05-07

申请号：US15395623

申请日：2016-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho Choi ,  Youngdoo Jung ,  Woonbae Kim ,  Jungwoo Kim ,  Ji-Yong Park ,  Kyoungsuk Yang ,  Jeong-Kyu Ha

IPC: G06K9/20 ,  G06K9/00

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

公开(公告)号：US11131568B2

公开(公告)日：2021-09-28

申请号：US17002071

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngshin Kwon ,  Minjin Kim ,  Woonbae Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Inho Choi

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US10760930B2

公开(公告)日：2020-09-01

申请号：US16131467

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngshin Kwon ,  Minjin Kim ,  Woonbae Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Inho Choi

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US11125734B2

公开(公告)日：2021-09-21

申请号：US16109758

申请日：2018-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inho Choi ,  Minjin Kim ,  Sungwoo Park ,  Youngdoo Jung ,  Eunhee Jung ,  Sungeun Jo

IPC: G01N33/00 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/10 ,  H01L23/552

Abstract: Disclosed is a gas sensor package. The gas sensor package comprises a package substrate, a controller on the package substrate, a plurality of gas sensors on the controller, and a lid on the package substrate and the lid comprising a hole extending between a first surface and a second surface of the lid, the first surface of the lid facing away the package substrate and the second surface of the lid facing toward the package substrate. The gas sensors sense different types of gases.

公开(公告)号：US11067554B2

公开(公告)日：2021-07-20

申请号：US16124385

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjin Kim ,  Youngdoo Jung ,  Eunhee Jung ,  Sungeun Jo ,  Inho Choi

IPC: G01N33/00 ,  G01N27/12 ,  G01N27/407 ,  G01N27/04 ,  H01L23/31 ,  H05K1/03 ,  H01L23/00 ,  H01L23/498 ,  H01L27/02 ,  H01L23/02

Abstract: A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.