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公开(公告)号：US11125734B2
公开(公告)日：2021-09-21
申请号：US16109758
申请日：2018-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Inho Choi , Minjin Kim , Sungwoo Park , Youngdoo Jung , Eunhee Jung , Sungeun Jo
IPC: G01N33/00 , H01L23/31 , H01L23/00 , H01L23/498 , H01L23/10 , H01L23/552
Abstract: Disclosed is a gas sensor package. The gas sensor package comprises a package substrate, a controller on the package substrate, a plurality of gas sensors on the controller, and a lid on the package substrate and the lid comprising a hole extending between a first surface and a second surface of the lid, the first surface of the lid facing away the package substrate and the second surface of the lid facing toward the package substrate. The gas sensors sense different types of gases.
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公开(公告)号：US11067554B2
公开(公告)日：2021-07-20
申请号：US16124385
申请日：2018-09-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minjin Kim , Youngdoo Jung , Eunhee Jung , Sungeun Jo , Inho Choi
IPC: G01N33/00 , G01N27/12 , G01N27/407 , G01N27/04 , H01L23/31 , H05K1/03 , H01L23/00 , H01L23/498 , H01L27/02 , H01L23/02
Abstract: A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.
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Patent Agency Ranking
公开(公告)号：US20250038090A1
公开(公告)日：2025-01-30
申请号：US18615675
申请日：2024-03-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Minjin Kim , Seongho Shin
IPC: H01L23/498 , H01L23/00 , H01L25/065 , H01L25/18
Abstract: The present disclosure relates to semiconductor packages. An example semiconductor package comprises a package substrate that includes a signal pad and a ground pad, an interposer substrate on the package substrate, a semiconductor chip on the interposer substrate, a plurality of signal lines on a top surface of the package substrate, and a first connection terminal between the package substrate and the interposer substrate. Each signal line of the plurality of signal lines extends in a first direction. The plurality of signal lines and the signal pad are spaced apart in a second direction that intersects the first direction. The plurality of signal lines, the signal pad, and the ground pad are in contact with the top surface of the package substrate. The first connection terminal overlaps at least a portion of the plurality of signal lines in a plan view.
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4.发明授权公开(公告)号：US11131568B2
公开(公告)日：2021-09-28
申请号：US17002071
申请日：2020-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungeun Jo , Youngshin Kwon , Minjin Kim , Woonbae Kim , Youngdoo Jung , Eunhee Jung , Inho Choi
Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.
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5.发明授权公开(公告)号：US10760930B2
公开(公告)日：2020-09-01
申请号：US16131467
申请日：2018-09-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungeun Jo , Youngshin Kwon , Minjin Kim , Woonbae Kim , Youngdoo Jung , Eunhee Jung , Inho Choi
Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.
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公开(公告)号：US09547922B2
公开(公告)日：2017-01-17
申请号：US14601809
申请日：2015-01-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinyoung Choi , Minjin Kim , Jangseong Kim
CPC classification number: G06T11/001 , H04N9/643 , H04N9/68
Abstract: A method and apparatus for color compensation in an electronic device is provided. The method includes determining, in response to a playback request for content, whether to compensate color data of the content according to color compensation information; compensating, when it is determined to compensate the color data of the content according to the color compensation information, the color data of the content according to the color compensation information; and displaying the content of which the color data is compensated.
Abstract translation: 提供了一种用于电子设备中的颜色补偿的方法和装置。 该方法包括：响应于内容的重放请求，确定是否根据颜色补偿信息补偿内容的颜色数据; 当确定根据颜色补偿信息补偿内容的颜色数据时，根据颜色补偿信息来补偿内容的颜色数据; 并显示补偿了彩色数据的内容。
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公开(公告)号：US20150213628A1
公开(公告)日：2015-07-30
申请号：US14601809
申请日：2015-01-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinyoung CHOI , Minjin Kim , Jangseong Kim
CPC classification number: G06T11/001 , H04N9/643 , H04N9/68
Abstract: A method and apparatus for color compensation in an electronic device is provided. The method includes determining, in response to a playback request for content, whether to compensate color data of the content according to color compensation information; compensating, when it is determined to compensate the color data of the content according to the color compensation information, the color data of the content according to the color compensation information; and displaying the content of which the color data is compensated.
Abstract translation: 提供了一种用于电子设备中的颜色补偿的方法和装置。 该方法包括：响应于内容的重放请求，确定是否根据颜色补偿信息补偿内容的颜色数据; 当确定根据颜色补偿信息补偿内容的颜色数据时，根据颜色补偿信息来补偿内容的颜色数据; 并显示补偿了彩色数据的内容。
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