公开(公告)号：US20130170154A1

公开(公告)日：2013-07-04

申请号：US13734546

申请日：2013-01-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Hwan LEE ,  Jong In RYU ,  Jin Won LEE ,  Moon Il KIM

IPC: H05K3/32 ,  H05K1/16

CPC classification number: H05K3/32 ,  H05K1/162 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/4913

Abstract: Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate.

Abstract translation: 提供了一种印刷电路板，其具有包括至少一个片状电容器的嵌入式电容器，被配置为覆盖片状电容器的绝缘材料以及安装在绝缘材料中以平行布置在片材的一侧的电容器装置 形电容器，提高了基板的可靠性。

公开(公告)号：US20160315027A1

公开(公告)日：2016-10-27

申请号：US15003473

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In RYU ,  Ki Joo SIM ,  Do Jae YOO ,  Ki Ju LEE ,  Jin Su KIM

IPC: H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/768 ,  H01L23/538 ,  H01L21/268

CPC classification number: H01L23/3121 ,  H01L21/4846 ,  H01L21/565 ,  H01L23/16 ,  H01L23/293 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Abstract translation: 半导体封装及其制造方法包括安装在基板的上表面，下表面或两者上的芯片构件。 半导体封装及其制造方法还包括堆叠嵌入芯片部件的模具部件，设置在模具部件的中心部分的连接部件和形成在连接部件的一部分上的焊接部件。

公开(公告)号：US20170018540A1

公开(公告)日：2017-01-19

申请号：US15075824

申请日：2016-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun LIM ,  Jong In RYU ,  Sung Ho KIM ,  Jin Su KIM

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L25/16 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01R23/68 ,  H01R23/6886 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/049 ,  H01L2924/014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099

Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

Abstract translation: 在一个一般方面，电子设备模块包括第一板，安装在第一板的第一表面上的第一装置，设置在第一板下方的第二板，以及设置在第一板和第二板之间的多个第二装置 其中，所述多个第二装置的表面结合到所述第一板的第二表面，并且所述第二装置中的每一个的另一表面结合到所述第二板。

公开(公告)号：US20160035678A1

公开(公告)日：2016-02-04

申请号：US14810947

申请日：2015-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Kyu Hwan OH ,  Jong In RYU ,  Jae Hyun LIM

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L23/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: The semiconductor package includes: a substrate having at least one circuit layer; at least one electronic component mounted on at least one surface of the substrate; a molded part formed on the surface of the substrate to enclose the electronic component; at least one via formed in the molded part to be electrically connected to the circuit layer of the substrate; and a semiconductive pattern connected to one end of a plated tail connected to the circuit layer connected to the via and exposed to the exterior of the substrate.

Abstract translation: 半导体封装包括：具有至少一个电路层的衬底; 安装在所述基板的至少一个表面上的至少一个电子部件; 形成在所述基板的表面上以包围所述电子部件的模制部件; 形成在所述模制部件中的至少一个通孔与所述基板的电路层电连接; 以及连接到连接到连接到通孔并暴露于衬底的外部的电路层的电镀尾部的一端的半导体图案。

公开(公告)号：US20150289392A1

公开(公告)日：2015-10-08

申请号：US14676745

申请日：2015-04-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Jae Hyun LIM ,  Kyu Hwan OH ,  Jong In RYU

IPC: H05K5/00 ,  H05K1/18

CPC classification number: H05K1/181 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09436 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/2072 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.

Abstract translation: 一种电子设备模块，包括：一个包括外部连接电极和安装电极的板; 安装在所述安装电极上的电子装置; 密封电子设备的模制部分; 连接导体，其端部与外部连接电极接合并穿透模制部分; 和连接导体的另一端的外部端子。

公开(公告)号：US20200098699A1

公开(公告)日：2020-03-26

申请号：US16695597

申请日：2019-11-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In RYU ,  Suk Youn HONG ,  Gi Su CHI ,  Seung Hyun HONG ,  Ki Chan KIM

IPC: H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01L21/56 ,  H01L25/00 ,  H01L23/538 ,  H01L23/31

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

公开(公告)号：US20190310687A1

公开(公告)日：2019-10-10

申请号：US16181485

申请日：2018-11-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Suk Youn HONG ,  Jong In RYU ,  Seung Hyun HONG ,  Jang Hyun KIM

IPC: G06F1/16 ,  H01L23/31 ,  H01L23/10

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

公开(公告)号：US20170221835A1

公开(公告)日：2017-08-03

申请号：US15267233

申请日：2016-09-16

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Do Jae YOO ,  Hee Jung JUNG ,  Jong In RYU ,  Ki Joo SIM

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/4817 ,  H01L21/486 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/15159 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

公开(公告)号：US20160021737A1

公开(公告)日：2016-01-21

申请号：US14724740

申请日：2015-05-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyu Hwan OH ,  Do Jae YOO ,  Jong In RYU ,  Jae Hyun LIM

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/28 ,  H05K3/18 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/284 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19106 ,  H05K3/188 ,  H05K3/242 ,  H05K3/4007 ,  H05K2201/09781 ,  H05K2201/10977 ,  H05K2203/0723 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electronic device module includes a board including one or more external connection electrodes and plating lines extending from the external connection electrodes by a predetermined distance; one or more electronic devices mounted on the board; a molded part sealing the electronic devices; and a plurality of connective conductors extending from the external connection electrodes and penetrating through the molded part to be disposed within the molded part.

Abstract translation: 电子设备模块包括：板，包括一个或多个外部连接电极和从外部连接电极延伸预定距离的电镀线; 安装在板上的一个或多个电子装置; 密封电子设备的模制部件; 以及从外部连接电极延伸并穿过模制部件以设置在模制部件内的多个连接导体。

公开(公告)号：US20160007463A1

公开(公告)日：2016-01-07

申请号：US14732550

申请日：2015-06-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Jae Hyun LIM ,  Jong In RYU ,  Kyu Hwan OH ,  Ki Ju LEE

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30 ,  H05K3/40 ,  H05K3/18 ,  H05K1/11 ,  H05K3/28

CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K3/28 ,  H05K3/4007 ,  H05K2203/0723 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

Abstract translation: 电子设备模块包括：板，其包括至少一个安装电极和至少一个外部连接电极，并具有设置在其外表面上的保护绝缘层; 安装在所述安装电极上的至少一个电子装置; 密封电子设备的模制部件; 以及至少一个连接导体，其一端接合到所述基板的外部连接电极并且穿过所述模制部件以设置在所述模制部件中，其中所述保护绝缘层设置成与所述连接导体间隔开 。