公开(公告)号：US20170221835A1

公开(公告)日：2017-08-03

申请号：US15267233

申请日：2016-09-16

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Do Jae YOO ,  Hee Jung JUNG ,  Jong In RYU ,  Ki Joo SIM

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/4817 ,  H01L21/486 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/15159 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

公开(公告)号：US20160315027A1

公开(公告)日：2016-10-27

申请号：US15003473

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In RYU ,  Ki Joo SIM ,  Do Jae YOO ,  Ki Ju LEE ,  Jin Su KIM

IPC: H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/768 ,  H01L23/538 ,  H01L21/268

CPC classification number: H01L23/3121 ,  H01L21/4846 ,  H01L21/565 ,  H01L23/16 ,  H01L23/293 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Abstract translation: 半导体封装及其制造方法包括安装在基板的上表面，下表面或两者上的芯片构件。 半导体封装及其制造方法还包括堆叠嵌入芯片部件的模具部件，设置在模具部件的中心部分的连接部件和形成在连接部件的一部分上的焊接部件。