公开(公告)号：US20150336207A1

公开(公告)日：2015-11-26

申请号：US14817554

申请日：2015-08-04

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Allesandro Finocchiaro ,  Giovanni Girlando

IPC: B23K26/00 ,  H01L49/02 ,  B23K26/30 ,  H01L21/268 ,  H01L21/67 ,  H01Q1/22 ,  H01L21/66 ,  H01L23/66

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  G06K19/07775 ,  G06K19/07779 ,  H01L21/268 ,  H01L21/67115 ,  H01L21/67253 ,  H01L22/26 ,  H01L22/34 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/66 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01Q1/526 ,  Y10T29/49004 ,  H01L2924/00

Abstract: An electronic communications device includes a body of semiconductor material with an integrated electronic circuit, an inductive element, and a capacitive element. The capacitive element is formed by a first electrode and a second electrode positioned between the inductive element and the integrated electronic circuit. Tuning of the device circuitry is accomplished by energizing the inductive/capacitive elements, determining resonance frequency, and using a laser trimming operation to alter the structure of one or more of the first electrode, second electrode or inductive element and change the resonance frequency.

Abstract translation: 电子通信设备包括具有集成电子电路的半导体材料体，电感元件和电容元件。 电容元件由位于感应元件和集成电子电路之间的第一电极和第二电极形成。 通过激励感应/电容元件，确定谐振频率以及使用激光修整操作来改变第一电极，第二电极或电感元件中的一个或多个的结构并改变谐振频率来实现器件电路的调谐。

公开(公告)号：US20170092625A1

公开(公告)日：2017-03-30

申请号：US15376485

申请日：2016-12-12

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/48 ,  H01Q1/38 ,  H01L23/522 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/36 ,  H01L23/64 ,  H01L49/02

CPC classification number: H01L25/0657 ,  G01R1/07314 ,  G01R31/3025 ,  H01L23/48 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L28/10 ,  H01L29/82 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/207 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

公开(公告)号：US09887165B2

公开(公告)日：2018-02-06

申请号：US14565934

申请日：2014-12-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando ,  Federico Giovanni Ziglioli ,  Alessandro Finocchiaro

IPC: H01L23/00 ,  H01L23/58 ,  G01R31/28 ,  H01L21/66

CPC classification number: H01L23/562 ,  G01R31/2872 ,  H01L21/76224 ,  H01L22/14 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An IC may include a semiconductor substrate having circuitry formed in the substrate, an interconnect layer above the semiconductor substrate and having an antenna coupled to the circuitry, and a seal ring around a periphery of the interconnect layer. The IC may include an electrically insulating trench extending vertically into the semiconductor substrate and extending laterally across the semiconductor substrate from adjacent one side to adjacent another side.

公开(公告)号：US09728837B2

公开(公告)日：2017-08-08

申请号：US14817554

申请日：2015-08-04

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Alessandro Finocchiaro ,  Giovanni Girlando

IPC: G08B21/00 ,  H01Q1/22 ,  H01L21/66 ,  H01L49/02 ,  H01L23/66 ,  H01L21/268 ,  H01L21/67 ,  G06K19/077 ,  H01Q1/52 ,  H01L23/522

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  G06K19/07775 ,  G06K19/07779 ,  H01L21/268 ,  H01L21/67115 ,  H01L21/67253 ,  H01L22/26 ,  H01L22/34 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/66 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01Q1/526 ,  Y10T29/49004 ,  H01L2924/00

Abstract: An electronic communications device includes a body of semiconductor material with an integrated electronic circuit, an inductive element, and a capacitive element. The capacitive element is formed by a first electrode and a second electrode positioned between the inductive element and the integrated electronic circuit. Tuning of the device circuitry is accomplished by energizing the inductive/capacitive elements, determining resonance frequency, and using a laser trimming operation to alter the structure of one or more of the first electrode, second electrode or inductive element and change the resonance frequency.

公开(公告)号：US09076883B2

公开(公告)日：2015-07-07

申请号：US14079976

申请日：2013-11-14

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L29/82 ,  H01L23/48 ,  H01L23/64 ,  H01L23/66 ,  H01L25/065 ,  H01L25/10 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q7/00 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L25/0657 ,  G01R1/07314 ,  G01R31/3025 ,  H01L23/48 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L28/10 ,  H01L29/82 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/207 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

Abstract translation: 具有至少部分由半导体材料制成且具有顶表面，底表面和侧表面的主体的集成电子设备的实施例和集成在主体中并且能够进行磁耦合或电磁耦合的第一天线 具有另外的天线的集成电子设备。 集成电子设备还具有由磁性材料制成的耦合区域，其在使用中提供第一天线和另外的天线之间的通信信道。

公开(公告)号：US08976010B2

公开(公告)日：2015-03-10

申请号：US13763707

申请日：2013-02-10

Applicant: STMicroelectronics S.R.L.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: G06K7/00 ,  G06K7/10 ,  G06K19/02 ,  G06K19/07 ,  G06K19/073 ,  G06K19/077

CPC classification number: G06K7/00 ,  G06K7/10178 ,  G06K19/025 ,  G06K19/072 ,  G06K19/07327 ,  G06K19/07336 ,  G06K19/07735 ,  G06K19/07756 ,  G06K19/07771 ,  G06K19/07775 ,  G06K19/07779

Abstract: A security system includes an integrated circuit and a transceiver/transponder circuit. The integrated circuit includes an antenna for communicating with the transceiver/transponder circuit. An inhibiting element is associated with the integrated circuit for inhibiting communications with the transceiver/transponder circuit and for securing the data contained in the integrated circuit. The inhibiting element is an electromagnetic inhibiting element. The security system further includes a coupling element associated with the antenna of the integrated circuit for temporarily deactivating the electromagnetic inhibiting element to allow communications between the integrated circuit and the transceiver/transponder circuit.

Abstract translation: 安全系统包括集成电路和收发器/应答器电路。 集成电路包括用于与收发器/应答器电路进行通信的天线。 禁止元件与用于禁止与收发器/应答器电路的通信并用于保护集成电路中包含的数据的集成电路相关联。 抑制元件是电磁抑制元件。 安全系统还包括与集成电路的天线相关联的耦合元件，用于暂时停用电磁抑制元件以允许集成电路和收发器/应答器电路之间的通信。

公开(公告)号：US10964646B2

公开(公告)日：2021-03-30

申请号：US15854456

申请日：2017-12-26

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando ,  Federico Giovanni Ziglioli ,  Alessandro Finocchiaro

IPC: H01L23/00 ,  G01R31/28 ,  H01L21/762 ,  H01L23/58 ,  H01L21/66 ,  H02J50/20

Abstract: A method of making an integrated circuit (IC) includes forming circuitry over a top surface of a semiconductor substrate having the top surface and an opposite bottom surface. An antenna is formed in an interconnect layer formed above the semiconductor substrate, where the antenna is coupled to circuitry. A seal ring is formed around a periphery of the interconnect layer. The seal ring is disposed around the antenna and the circuitry. A trench with a solid-state insulating material is formed. The trench extends vertically into the semiconductor substrate and extends laterally across the IC.

公开(公告)号：US09678027B2

公开(公告)日：2017-06-13

申请号：US14670613

申请日：2015-03-27

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Giovanni Girlando ,  Michele Calabretta ,  Francesco Pappalardo

IPC: G01N27/20 ,  G01N27/00 ,  G01M5/00 ,  H04Q9/00

CPC classification number: G01N27/02 ,  G01M5/0033 ,  G01M5/0083 ,  G01N27/00 ,  H04Q9/00 ,  H04Q2209/88

Abstract: A monitoring device is for a block of building material. The monitoring device may include an electric supply line configured to be buried in the block of building material and having a flexible main cable, and flexible jumper cables coupled to the flexible main cable and extending outwardly. The monitoring device may include sensor devices configured to be buried in the block of building material and coupled to respective ones of the flexible jumper cables. Each sensor device may include a primary inductor coupled to the electric supply line at a position based upon peaks of a stationary waveform when the electric supply line is alternating current (AC) powered, and a monitoring circuit. The monitoring circuit may include an integrated sensor, and a secondary inductor magnetically coupled to the primary inductor and configured to supply the integrated sensor, and communicate through the electric supply line.

公开(公告)号：US10366969B2

公开(公告)日：2019-07-30

申请号：US15783710

申请日：2017-10-13

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L25/065 ,  H01L29/82 ,  H01L23/48 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66 ,  H01L23/00 ,  H01L25/10 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q7/00 ,  H01L49/02 ,  H01Q1/38 ,  H01L25/16 ,  G01R1/073 ,  G01R31/302

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

公开(公告)号：US20180040591A1

公开(公告)日：2018-02-08

申请号：US15783710

申请日：2017-10-13

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L25/065 ,  H01L29/82 ,  H01L23/48 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/36 ,  H01L23/00 ,  H01Q1/38 ,  H01L25/10 ,  H01Q7/00 ,  H01L49/02 ,  H01Q1/22 ,  G01R1/073 ,  H01L25/16 ,  G01R31/302

CPC classification number: H01L25/0657 ,  G01R1/07314 ,  G01R31/3025 ,  H01L23/48 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L28/10 ,  H01L29/82 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/207 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.