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    Fingerprint sensor package and smartcard including the same
    2.
    发明授权
    Fingerprint sensor package and smartcard including the same 有权

    公开(公告)号：US11538268B2

    公开(公告)日：2022-12-27

    申请号：US17500434

    申请日：2021-10-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaehyun Lim ,  Younghwan Park ,  Kwangjin Lee ,  Inho Choi ,  Hyuntaek Choi

    IPC: G06V40/13

    Abstract: A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.

    Fingerprint sensor package and smart card having the same
    4.
    发明授权
    Fingerprint sensor package and smart card having the same 有权

    公开(公告)号：US12294000B2

    公开(公告)日：2025-05-06

    申请号：US18322795

    申请日：2023-05-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaehyun Lim ,  Kwangjin Lee ,  Hyunjong Moon ,  Inho Choi

    IPC: G06K19/073 ,  G06V40/13 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/18

    Abstract: A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.

    Semiconductor device including standard cells
    5.
    发明授权
    Semiconductor device including standard cells 有权

    公开(公告)号：US12165701B2

    公开(公告)日：2024-12-10

    申请号：US17824464

    申请日：2022-05-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jaehyun Lim ,  Taehyung Kim ,  Sangshin Han

    IPC: G11C11/41 ,  G11C11/419 ,  H01L27/02 ,  H10B10/00

    Abstract: A semiconductor device includes a first memory column group including a plurality of memory columns in which a plurality of bit cells are disposed; and a first peripheral column group including a plurality of peripheral columns in which a plurality of standard cells are disposed, wherein the plurality of standard cells are configured to perform an operation of reading/writing data from/to the plurality of bit cells through a plurality of bit lines, wherein the first memory column group and the first peripheral column group correspond to each other in a column direction, and wherein at least one of the plurality of peripheral columns has a cell height different from cell heights of the other peripheral columns, the cell height being measured in a row direction in which a gate line is extended.

    Fingerprint sensor package and smart card including fingerprint sensor package
    6.
    发明授权
    Fingerprint sensor package and smart card including fingerprint sensor package 有权

    公开(公告)号：US11954938B2

    公开(公告)日：2024-04-09

    申请号：US18131133

    申请日：2023-04-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Gwangjin Lee ,  Jaehyun Lim ,  Heeyoub Kang ,  Hyunjong Moon ,  Yun Seok Choi ,  Inho Choi

    IPC: G06V40/13 ,  G06K19/073 ,  G06K19/077

    CPC classification number: G06V40/1306 ,  G06K19/07354 ,  G06K19/07747

    Abstract: A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

    FINGERPRINT SENSOR PACKAGE AND FINGERPRINT AUTHENTICATION CARD INCLUDING THE SAME
    8.
    发明申请
    FINGERPRINT SENSOR PACKAGE AND FINGERPRINT AUTHENTICATION CARD INCLUDING THE SAME 有权

    公开(公告)号：US20250166408A1

    公开(公告)日：2025-05-22

    申请号：US18790331

    申请日：2024-07-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yechung Chung ,  Yoon-Seok Seo ,  Jaehyun Lim ,  Inho Choi

    IPC: G06V40/13 ,  G06Q20/34

    Abstract: A fingerprint sensor package includes: a substrate including an insulating layer and a wiring layer; a fingerprint sensor chip on the substrate; a molding material to mold the fingerprint sensor chip on the substrate and including a first region and a second region surrounding the first region; and a buffer member on the second region of the molding material; the wiring layer includes a wiring pattern extending from an inside to an outside of the molding material; a vertical level of an upper surface of the second region of the molding material is lower than a vertical level of an upper surface of the first region of the molding material.

    Semiconductor package including multiple semiconductor chips
    9.
    发明授权
    Semiconductor package including multiple semiconductor chips 有权

    公开(公告)号：US11205631B2

    公开(公告)日：2021-12-21

    申请号：US16822300

    申请日：2020-03-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yonghoon Kim ,  Jaehyun Lim ,  Yuntae Lee ,  Sayoon Kang

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065

    Abstract: Provided is a semiconductor package including a package structure including a base connection member including a redistribution layer, a first semiconductor chip including a plurality of first connection pads connected to the redistribution layer, an encapsulant disposed on the base connection member and covering at least a portion of the first semiconductor chip, and a backside connection member disposed on the encapsulant and including a backside wiring layer electrically connected to the redistribution layer, and a second semiconductor chip disposed on the base connection member or the backside connection member, the second semiconductor chip including a plurality of second connection pads connected to the redistribution layer or the backside wiring layer, the second semiconductor chip including a logic circuit, the first semiconductor chip including a logic input and output terminals that are connected to the logic circuit through at least one of the redistribution layer and the backside wiring layer.

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