公开(公告)号：US11900709B2

公开(公告)日：2024-02-13

申请号：US17514088

申请日：2021-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Younghwan Park ,  Kwangjin Lee ,  Dongha Lee ,  Hyuntaek Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  G06K9/00 ,  G06V40/12 ,  G06K19/07 ,  G06K19/073 ,  G06K19/077

CPC classification number: G06V40/12 ,  G06K19/0718 ,  G06K19/07354 ,  G06K19/07747 ,  H01L23/3121 ,  H01L2224/16227

Abstract: A fingerprint sensor package includes a first substrate including a core insulating layer; a first bonding pad on the core insulating layer; and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad, a second substrate on the core insulating layer, the second substrate including: a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction intersecting with the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad, a conductive wire connecting the first bonding pad to the second bonding pad; a controller chip on the second substrate; and a molding layer covering the second substrate and the first bonding pad and spaced apart from the external connection pad.

公开(公告)号：US11846958B2

公开(公告)日：2023-12-19

申请号：US17845541

申请日：2022-06-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seki Kim ,  Sangho Kim ,  Yongjin Lee ,  Hyongmin Lee ,  Dongha Lee ,  Byeongbae Lee ,  Sungyong Lee

IPC: G05F1/575

CPC classification number: G05F1/575

Abstract: A system-on-chip according to an embodiment includes a core including a header switch circuit configured to transmit a power supply voltage applied to a first power rail as a supply voltage to a second power rail and a logic circuit configured to operate based on the supply voltage from the second power rail, and a low-dropout (LDO) regulator configured to regulate a magnitude of first current output to the second power rail based on a change in the supply voltage, wherein the LDO regulator is further configured to control on/off of a plurality of first header switches included in the header switch circuit based on an amount of the change in the supply voltage.

公开(公告)号：US20220404853A1

公开(公告)日：2022-12-22

申请号：US17845541

申请日：2022-06-21

Applicant: SAMSUNG ELECTRONICS CO., LTD,

Inventor： Seki Kim ,  Sangho Kim ,  Yongjin Lee ,  Hyongmin Lee ,  Dongha Lee ,  Byeongbae Lee ,  Sungyong Lee

IPC: G05F1/575

Abstract: A system-on-chip according to an embodiment includes a core including a header switch circuit configured to transmit a power supply voltage applied to a first power rail as a supply voltage to a second power rail and a logic circuit configured to operate based on the supply voltage from the second power rail, and a low-dropout (LDO) regulator configured to regulate a magnitude of first current output to the second power rail based on a change in the supply voltage, wherein the LDO regulator is further configured to control on/off of a plurality of first header switches included in the header switch circuit based on an amount of the change in the supply voltage.

公开(公告)号：US20240393817A1

公开(公告)日：2024-11-28

申请号：US18635835

申请日：2024-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongha Lee ,  Seki Kim ,  Takahiro Nomiyama

IPC: G05F1/59 ,  G06F1/26

Abstract: A digital low-dropout (LDO) regulator may include: an LDO core configured to select a control mode based on a state of an output voltage of the digital LDO regulator provided to a load block and to output a control code based on the control mode; and a plurality of power transistors configured to control supply current supplied to the load block based on the control code. The control mode may include a first mode and a second mode for changing the supply current faster than in the first mode. The LDO core may be configured to perform a step-back operation to re-output a previous control code output at least one cycle ago and operate in the first mode based on the state of the output voltage corresponding to the first mode being detected while operating in the second mode.

公开(公告)号：US12228955B2

公开(公告)日：2025-02-18

申请号：US18501721

申请日：2023-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seki Kim ,  Sangho Kim ,  Yongjin Lee ,  Hyongmin Lee ,  Dongha Lee ,  Byeongbae Lee ,  Sungyong Lee

IPC: G05F1/575 ,  G05F1/46

Abstract: A system-on-chip according to an embodiment includes a core including a header switch circuit configured to transmit a power supply voltage applied to a first power rail as a supply voltage to a second power rail and a logic circuit configured to operate based on the supply voltage from the second power rail, and a low-dropout (LDO) regulator configured to regulate a magnitude of first current output to the second power rail based on a change in the supply voltage, wherein the LDO regulator is further configured to control on/off of a plurality of first header switches included in the header switch circuit based on an amount of the change in the supply voltage.