公开(公告)号：US20240105703A1

公开(公告)日：2024-03-28

申请号：US18322795

申请日：2023-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Kwangjin Lee ,  Hyunjong Moon ,  Inho Choi

IPC: H01L25/18 ,  G06K19/073 ,  G06V40/13 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/18 ,  G06K19/07354 ,  G06V40/1306 ,  G06V40/1329 ,  H01L23/5388 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/50 ,  H01L24/16 ,  H01L24/73 ,  H01L24/84 ,  H01L2224/16145 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40101 ,  H01L2224/40106 ,  H01L2224/40157 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/41176 ,  H01L2224/73205 ,  H01L2224/84005 ,  H01L2924/01039 ,  H01L2924/0665

Abstract: A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.

公开(公告)号：US20240169756A1

公开(公告)日：2024-05-23

申请号：US18223853

申请日：2023-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAEHYUN LIM ,  Inho Choi ,  Hyunjong Moon ,  Kwangjin Lee

IPC: G06V40/13

CPC classification number: G06V40/1306

Abstract: A fingerprint sensor package, including a package substrate which includes a cavity; a sensing substrate on the package substrate, the sensing substrate comprising a first surface and a second surface opposite to each other; a controller chip on the first surface of the sensing substrate; and a molding layer on the controller chip and the first surface of the sensing substrate, wherein the second surface of the sensing substrate is exposed by the cavity

公开(公告)号：US12294000B2

公开(公告)日：2025-05-06

申请号：US18322795

申请日：2023-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Kwangjin Lee ,  Hyunjong Moon ,  Inho Choi

IPC: G06K19/073 ,  G06V40/13 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/18

Abstract: A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.

公开(公告)号：US11954938B2

公开(公告)日：2024-04-09

申请号：US18131133

申请日：2023-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gwangjin Lee ,  Jaehyun Lim ,  Heeyoub Kang ,  Hyunjong Moon ,  Yun Seok Choi ,  Inho Choi

IPC: G06V40/13 ,  G06K19/073 ,  G06K19/077

CPC classification number: G06V40/1306 ,  G06K19/07354 ,  G06K19/07747

Abstract: A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.