Abstract:
Methods and apparatus for generating a reference for use with a magnetic tunnel junction are provided. In an example, provided is a magnetoresistive read only memory including a magnetic tunnel junction (MTJ) storage element, a sense amplifier having a first input coupled to the MTJ storage element, and a reference resistance device coupled to a second input of the sense amplifier. The reference resistance device includes a plurality of groups of at least two reference MTJ devices. Each reference MTJ device in a respective group is coupled in parallel with each other reference MTJ device in the respective group. Each group is coupled in series with the other groups. This arrangement advantageously mitigates read disturbances and reference level variations, while saving power, reducing reference resistance device area, and increasing read speed.
Abstract:
Error detection and correction decoding apparatus performs single error correction-double error detection (SEC-DED) or double error correction-triple error detection (DEC-TED) depending on whether the data input contains a single-bit error or a multiple-bit error, to reduce power consumption and latency in case of single-bit errors and to provide powerful error correction in case of multiple-bit errors.
Abstract:
Aspects of the present disclosure relate to protecting the contents of memory in an electronic device, and in particular to systems and methods for transferring data between memories of an electronic device in the presence of strong magnetic fields. In one embodiment, a method of protecting data in a memory in an electronic device includes storing data in a first memory in the electronic device; determining, via a magnetic sensor, a strength of an ambient magnetic field; comparing the strength of the ambient magnetic field to a threshold; transferring the data in the first memory to a second memory in the electronic device upon determining that the strength of the ambient magnetic field exceeds the threshold; and transferring the data from the second memory to the first memory upon determining that the strength of the ambient magnetic field no longer exceeds the threshold.
Abstract:
Error detection and correction decoding apparatus performs single error correction-double error detection (SEC-DED) or double error correction-triple error detection (DEC-TED) depending on whether the data input contains a single-bit error or a multiple-bit error, to reduce power consumption and latency in case of single-bit errors and to provide powerful error correction in case of multiple-bit errors.
Abstract:
A device includes a first power rail and a second power rail. A second voltage of the second power rail is derived from a first voltage of the first power rail. The device includes a power gating circuit that includes a switching device connected between the first power rail and the second power rail. The power gating circuit further includes a clamping diode connected in parallel to the switching device between the first power rail and the second power rail. The device further includes a logic circuit including a first inverter and a second inverter. The first inverter includes a first transistor and the second inverter includes a first transistor. A source/drain terminal of the first transistor of the first inverter is directly coupled to the first power rail, and a source/drain terminal of the first transistor of the second inverter is directly coupled to the second power rail.
Abstract:
A magnetic random access memory (MRAM) array including several bit cells is described. Each of the bit cells may include a perpendicular magnetic tunnel junction (pMTJ) including a reference layer, a barrier layer supporting the reference layer, and a free layer supporting the barrier layer. A spin-hall conductive material layer may support the free layer. A driver may be operable to set a state of at least one of the bit cells using an increased spin-transfer torque (STT) current and a spin-hall effect from the spin-hall conductive material layer. The increased STT current may be driven through the spin-hall conductive material layer and the pMTJ so that a spin current is generated from the reference layer and the spin-hall conductive material layer.
Abstract:
In a memory having a first memory cell array, a second memory cell array, an address is received on an address port. Based on the address, an internal address is transmitted, and it is latched and held for a first interval as a first array address. The first memory cell array is accessed over the first interval, based on the first array address. Another address is received at the address port, during the first interval, and another internal address is transmitted, and latched and held for a second interval that overlaps the first interval, as a second array address. The second memory cell array is accessed during the second interval, based on the second array address.
Abstract:
Methods and systems for an in-system repair process that repairs or attempts to repair random bit failures in a memory device are provided. In some examples, an in-system repair process may select alternative steps depending on whether the failure is correctable or uncorrectable. In these examples, the process uses communications between a system on chip and the memory to fix the failures during normal operation.
Abstract:
Systems and methods for correcting bit failures in a resistive memory device include dividing the memory device into a first memory bank and a second memory bank. A first single bit repair (SBR) array is stored in the second memory bank, wherein the first SBR array is configured to store a first indication of a failure in a first failed bit in a first row of the first memory bank. The first memory bank and the first SBR array are configured to be accessed in parallel during a memory access operation. Similarly, a second SBR array stored in the first memory bank can store indications of failures of bits in the second memory bank, wherein the second SBR array and the second memory bank can be accessed in parallel. Thus, bit failures in the first and second memory banks can be corrected in real time.
Abstract:
A resistive memory array includes a controller, a test reset driver coupled to the controller, a test write driver also coupled to the controller, and a test read sense amplifier also coupled to the controller. The resistive memory array also includes a set of test resistive memory elements representing a resistive memory macro. The test resistive memory elements are coupled to the test reset driver, the test write driver and the test read sense amplifier. A change in the state of one of the test resistive memory elements represents a change in the state of a set of corresponding elements in the resistive memory macro.