摘要:
A method and apparatus for providing total power from one transmit path. The method provides the steps of: selecting a transmit path and closing a first switch, located after a digital to analog converter. A second switch between the two transmit paths is then closed in order to provide for the use of at least one low-pass filter in each transmit path. The signal is then processed through the at least one low pass filter in each transmit path. The signal is then processed through at least one mixer in each transmit path. After the mixer, the signal is then processed through at least one driver amplifier in each transmit path, and one-half of the total power is allocated to each of two transmission paths. A third switch is then closed after the at least one power amplifier in each transmit path to force the half-power from one transmit path into one output.
摘要:
A method and apparatus for providing total power from one transmit path. The method provides the steps of: selecting a transmit path and closing a first switch, located after a digital to analog converter. A second switch between the two transmit paths is then closed in order to provide for the use of at least one low-pass filter in each transmit path. The signal is then processed through the at least one low pass filter in each transmit path. The signal is then processed through at least one mixer in each transmit path. After the mixer, the signal is then processed through at least one driver amplifier in each transmit path, and one-half of the total power is allocated to each of two transmission paths. A third switch is then closed after the at least one power amplifier in each transmit path to force the half-power from one transmit path into one output.
摘要:
In certain aspects, a chip includes a pad, and a power amplifier having a first output and a second output. The chip also includes a transformer, wherein the transformer includes a first inductor coupled between a first terminal and a second terminal of the transformer, wherein the first terminal is coupled to the first output of the power amplifier, and the second terminal is coupled to the second output of the power amplifier. The transformer also includes a second inductor coupled between a third terminal and a fourth terminal of the transformer, wherein the third terminal is coupled to the pad. The chip also includes a first switch coupled to the fourth terminal, a shunt inductor coupled in parallel with the first switch, and a low-noise amplifier coupled to the third terminal.
摘要:
An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.
摘要:
An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.
摘要:
Certain aspects of the present disclosure relate to methods and apparatus for power amplifier control. A power amplifier network includes a first path comprising a first power amplifier. The power amplifier network further includes a second path comprising a second power amplifier. The power amplifier network further includes a common input path to both the first path and the second path. The power amplifier network further includes a first power control network for controlling a first signal applied to the first power amplifier. The power amplifier network further includes a second power control network for controlling a second signal applied to the second power amplifier, wherein the first power control network is different from the second power control network.
摘要:
Exemplary embodiments are related to a tri-phase digital polar modulator. A device may include a modulator configured to generate a primary phase modulated signal including the most significant bits (MSBs) of a modulated signal, a leading phase modulated signal including a first least significant bits (LSB) of the modulated signal, and a lagging phase modulated signal including a second LSB of the modulated signal. The device may also include a combination unit configured to add the primary phase modulated signal, the leading phase modulated signal, and the lagging phase modulated signal.
摘要:
The present disclosure includes switched capacitor transmitter circuits and methods. In one embodiment, a digital data signal is thermometer encoded and a negative thermo-encoded signal is bit order reversed to control capacitors in a switched capacitor transmitter circuit. In another embodiment, the present disclosure includes a plurality of switched capacitor transmitter circuits coupled to inputs of an inductive network. The inductive network combines voltages from the switched capacitor transmitter circuits to produce a combined voltage on an output.
摘要:
Certain aspects of the present disclosure provide methods and apparatus for performing quadrature combining and adjusting. One example circuit may include first through fourth mixing circuits. The first mixing circuit may multiply a radio frequency signal with a first local oscillating signal to generate a first frequency converted signal. The second mixing circuit may multiply a radio frequency (RF) signal with a second local oscillating signal, which may be about 90° out of phase with the first local oscillating signal, to generate a second frequency converted signal. The third and fourth mixing circuits may multiply the RF signal with the second and first signals, respectively, to generate third and fourth frequency converted signals, respectively. A first combining circuit may combine the first and third frequency converted signals, and a second combining circuit may combine the second and fourth frequency converted signals.
摘要:
Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.