Abstract:
Aspects disclosed in the detailed description include high-k (HK)/metal gate (MG) (HK/MG) multi-time programmable (MTP) switching devices, and related systems and methods. One type of HK/MG MTP switching device is an MTP metal-oxide semiconductor (MOS) field-effect transistor (MOSFET). When the MTP MOSFET is programmed, a charge trap may build up in the MTP MOSFET due to a switching electrical current induced by a switching voltage. The charge trap reduces the switching window and endurance of the MTP MOSFET, thus reducing reliability in accessing the information stored in the MTP MOSFET. In this regard, an HK/MG MTP switching device comprising the MTP MOSFET is configured to eliminate the switching electrical current when the MTP MOSFET is programmed. By eliminating the switching electrical current, it is possible to avoid a charge trap in the MTP MOSFET, thus restoring the switching window and endurance of the MTP MOSFET for reliable information access.
Abstract:
In a particular embodiment, a method includes controlling a temperature within a chamber while applying a magnetic field. A device including a memory array is located in the chamber. The method includes applying a magnetic field to the memory array and testing the memory array during application of the magnetic field to the memory array at a target temperature.
Abstract:
Several novel features pertain to an automatic testing equipment (ATE) memory tester that includes a load board, a projected-field electromagnet, a positioning mechanism and a memory tester. The load board is for coupling to a die package that includes a magnetoresistive random access memory (MRAM) having several cells, where each cell includes a magnetic tunnel junction (MTJ). The projected-field electromagnet is for applying a portion of a magnetic field across the MRAM. The portion of the magnetic field may be substantially uniform. The positioning mechanism is coupled to the electromagnet and the load board, and is configured to position the electromagnet vertically about (above/below) the die package when the die package is coupled to the load board. The memory tester is coupled to the load board. The memory tester is for testing the MRAM when the substantially uniform portion of the magnetic field is applied across the MRAM.
Abstract:
An apparatus includes a multiple time programmable (MTP) memory device. The MTP memory device includes a metal gate, a substrate material, and an oxide structure between the metal gate and the substrate material. The oxide structure includes a hafnium oxide layer and a silicon dioxide layer. The hafnium oxide layer is in contact with the metal gate and in contact with the silicon dioxide layer. The silicon dioxide layer is in contact with the substrate material. The MTP device includes a transistor, and a non-volatile state of the MTP memory device is based on a threshold voltage of the transistor.
Abstract:
An apparatus includes a multiple time programmable (MTP) memory device. The MTP memory device includes a metal gate, a substrate material, and an oxide structure between the metal gate and the substrate material. The oxide structure includes a hafnium oxide layer and a silicon dioxide layer. The hafnium oxide layer is in contact with the metal gate and in contact with the silicon dioxide layer. The silicon dioxide layer is in contact with the substrate material. The MTP device includes a transistor, and a non-volatile state of the MTP memory device is based on a threshold voltage of the transistor.
Abstract:
A particular method includes selecting a threshold data retention time of a magnetic tunnel junction (MTJ) memory cell. A pinned layer of the MTJ memory cell has a first direction of magnetization, and a free layer of the MTJ memory cell has a second direction of magnetization. An external magnetic field that has a third direction of magnetization that is opposite to the second direction of magnetization is applied to the MTJ memory cell. A strength of the external magnetic field is determined based on the threshold data retention time. Subsequent to applying the external magnetic field, a read operation is performed on the MTJ memory cell to determine a logic value of the MTJ memory cell. The method further includes determining whether the MTJ memory cell is subject to a data retention error corresponding to the threshold data retention time based on the logic value.
Abstract:
A particular method includes selecting a threshold data retention time of a magnetic tunnel junction (MTJ) memory cell. A pinned layer of the MTJ memory cell has a first direction of magnetization, and a free layer of the MTJ memory cell has a second direction of magnetization. An external magnetic field that has a third direction of magnetization that is opposite to the second direction of magnetization is applied to the MTJ memory cell. A strength of the external magnetic field is determined based on the threshold data retention time. Subsequent to applying the external magnetic field, a read operation is performed on the MTJ memory cell to determine a logic value of the MTJ memory cell. The method further includes determining whether the MTJ memory cell is subject to a data retention error corresponding to the threshold data retention time based on the logic value.
Abstract:
A semiconductor device for a one-time programmable (OTP) memory according to some examples of the disclosure includes a gate, a dielectric region below the gate, a source terminal below the dielectric region and offset to one side, a drain terminal below the dielectric region and offset to an opposite side from the source terminal, a drain side charge trap in the dielectric region capable of programming the semiconductor device, and a source side charge trap in the dielectric region opposite the drain side charge trap and capable of programming the semiconductor device.
Abstract:
In a one-time-programming (OTP) memory cell, dual-voltage sensing is utilized to determine whether the memory cell has experienced a non/soft breakdown or a hard breakdown. The drain current of the memory cell is read when the gate voltage is at a first predetermined voltage, and if the read drain current is greater than a predetermined current level, then a hard breakdown is detected. One or more additional readings of the current may be obtained to determine that a hard breakdown has occurred. If the read drain current is less than the predetermined current level, then a non/soft breakdown is detected. The threshold voltage of the memory cell may be shifted, and a second reading of the drain current may be obtained when the gate voltage is at a second predetermined voltage in case the memory cell experiences a non/soft breakdown.
Abstract:
In a particular embodiment, a method includes controlling a temperature within a chamber while applying a magnetic field. A device including a memory array is located in the chamber. The method includes applying a magnetic field to the memory array and testing the memory array during application of the magnetic field to the memory array at a target temperature.