Abstract:
A nonvolatile memory device includes: a pair of first wirings extending in a first direction; a second wiring extending in a second direction crossing the first direction; a pair of third wirings extending in the second direction; and a fourth wiring located between the pair of the third wirings. The nonvolatile memory device has four resistance-change elements each which is provided adjacent to respective four crossing areas in which each of the pair of first wirings intersects with each of the pair of third wirings, and a first contact plug disposed at an intersection of two diagonals of a virtual tetragon defined by the four resistance-change elements. Two transistors arranged in the second direction, among four transistors, share each one first main terminal located between the pair of the first wirings, the shared each one first main terminal being connected to the second wiring.
Abstract:
The nonvolatile memory device includes a control circuit that controls a sense amplification circuit and a writing circuit. The control circuit changes a value of at least one of (a) a load current and (b) a forming pulse current or a forming pulse voltage, according to a total number of sneak current paths formed by memory cells each including a variable resistance element in a second resistance state having a low resistance value except a selected memory cell in a memory cell array.
Abstract:
A variable resistance nonvolatile memory device includes: a nonvolatile memory element; an NMOS transistor connected to the nonvolatile memory element; a source line connected to the NMOS transistor; a bit line connected to the nonvolatile memory element. When a control circuit causes the nonvolatile memory element to be in the low resistance state, the control circuit controls to flow a first current from a first voltage source to a reference potential point, and applies a first gate voltage to a gate of a NMOS transistor, and when the control circuit causes the nonvolatile memory element to be in the high resistance state, the control circuit controls to flow a second current from a second voltage source to the reference potential point, and applies a second gate voltage to the gate of the NMOS transistor, the second gate voltage being lower than the first gate voltage.
Abstract:
A write method for writing to a variable resistance nonvolatile memory element, comprising applying a set of strong recovery-voltage pulses at least once to the variable resistance nonvolatile memory element when it is determined that the resistance state of the variable resistance nonvolatile memory element fails to change to a second resistance state, remaining in a first resistance state, the set of strong recovery-voltage pulses including pulses: (1) a first strong recovery-voltage pulse which has a greater amplitude than a normal second voltage for changing the resistance state to the first resistance state, and has the same polarity as the second voltage; and (2) a second strong recovery-voltage pulse which follows the first strong recovery-voltage pulse and has a longer pulse width than the pulse width of the normal first voltage for changing the resistance state to the second resistance state, and has the same polarity as the first voltage.
Abstract:
A cross-point memory device including memory cells each includes: a variable resistance element that reversibly changes at least between a low resistance state and a high resistance state; and a current steering element that has nonlinear current-voltage characteristics, and the cross-point memory device comprises a read circuit which includes: a reference voltage generation circuit which comprises at least the current steering element; a differential amplifier circuit which performs current amplification on an output voltage in the reference voltage generation circuit; a feedback controlled bit line voltage clamp circuit which sets the low voltage side reference voltage to increase with an output of the differential amplifier circuit; and a sense amplifier circuit which determines a resistance state of a selected memory cell according to an amount of current flowing through the selected memory cell.
Abstract:
Provided is a method of writing to a variable resistance nonvolatile memory element which is capable of both improving retention characteristics and enlarging a window of operation. In the method of writing, to write “1” data (LR), first a weak HR writing process is performed in which a weak HR writing voltage pulse set for changing the variable resistance nonvolatile memory element to an intermediate resistance state is applied and, subsequently, a LR writing process is performed in which a LR writing voltage pulse set for changing the variable resistance nonvolatile memory element from the intermediate resistance state to a LR state is applied.
Abstract:
A selection circuit that selects a memory cell from a memory cell array and a read circuit for reading a resistance state of a resistance change element in the selected memory cell are provided. In memory cells of odd-numbered-layer and even-numbered-layer memory cell arrays that constitute a multilayer memory cell array, each memory cell in any of the layers has a selection element, a first electrode, a first resistance change layer, a second resistance change layer, and a second electrode that are disposed in the same order. Whether the selected memory cell is located in any layer of the multilayer memory cell array, the read circuit applies a voltage to the selected memory cell to perform the reading operation. The voltage applied to the selected memory cell causes the second electrode to become positive with reference to the first electrode in the selected memory cell.