公开(公告)号：US08304919B2

公开(公告)日：2012-11-06

申请号：US12748335

申请日：2010-03-26

Applicant: Rajendra D. Pendse ,  Chien Ouyang ,  Mukul Joshi

Inventor： Rajendra D. Pendse ,  Chien Ouyang ,  Mukul Joshi

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L23/3171 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/14153 ,  H01L2224/14155 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method of manufacture of an integrated circuit system includes: providing a substrate having a transistor and a metallization layer; forming a metal pad in direct contact with the metallization layer of the substrate; forming a passivation layer in direct contact with the metal pad and covering the substrate; forming a routing trace above the passivation layer in direct contact with the metal pad, and the routing trace is substantially larger than the metal pad, and the routing trace is not electrically insulated by a subsequent layer; and forming a bump connected to the metal pad with the routing trace.

Abstract translation: 集成电路系统的制造方法包括：提供具有晶体管和金属化层的衬底; 形成与所述基板的金属化层直接接触的金属焊盘; 形成与金属焊盘直接接触并覆盖基板的钝化层; 在与金属焊盘直接接触的钝化层之上形成布线迹线，并且路由迹线基本上大于金属焊盘，并且路由迹线不被后续层电绝缘; 以及用所述路线迹线形成连接到所述金属焊盘的凸块。

公开(公告)号：US08084297B1

公开(公告)日：2011-12-27

申请号：US12851522

申请日：2010-08-05

Applicant: Mukul Joshi ,  Kumar Nagarajan

Inventor： Mukul Joshi ,  Kumar Nagarajan

IPC: H01L21/00

CPC classification number: H01L23/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/642 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of implementing a capacitor in an integrated circuit package is disclosed. The method comprises coupling the capacitor to a first surface of a substrate of the integrated circuit package; positioning an integrated circuit die over the capacitor, wherein the integrated circuit die has a first plurality of solder bumps and a second plurality of solder bumps separated by a region having no solder bumps; coupling the integrated circuit die to the first surface of the substrate over the capacitor, wherein the region having no solder bumps is positioned over the capacitor; and encapsulating the integrated circuit die and the capacitor.

Abstract translation: 公开了一种在集成电路封装中实现电容器的方法。 该方法包括将电容器耦合到集成电路封装的衬底的第一表面; 将集成电路管芯定位在电容器上，其中集成电路管芯具有第一多个焊料凸块和由没有焊料凸块的区域分开的第二多个焊料凸块; 将所述集成电路管芯连接到所述电容器上的所述衬底的所述第一表面，其中，所述没有焊料凸点的区域位于所述电容器上方; 并封装集成电路管芯和电容器。

公开(公告)号：US20050062143A1

公开(公告)日：2005-03-24

申请号：US10979491

申请日：2004-11-02

Applicant: Mukul Joshi ,  Mohan Nagar ,  Sarathy Rajagopalan

Inventor： Mukul Joshi ,  Mohan Nagar ,  Sarathy Rajagopalan

IPC: H01L23/36 ,  H01L23/42 ,  H01L23/433 ,  H01L23/02

CPC classification number: H01L23/36 ,  H01L23/42 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2224/0401

Abstract: A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package substrate, where the stiffener has a non-orthogonal cut out in which the integrated circuit is disposed. The edges of the cut out are disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.

Abstract translation: 一种封装集成电路，包括具有用于接收集成电路的电触点的封装基板。 集成电路电连接到封装衬底的电触头。 加强件安装到封装基板上，其中加强件具有非正交切口，集成电路设置在其中。 切口的边缘设置在与集成电路的侧面不同于集成电路的角落的距离以上。

公开(公告)号：US08115304B1

公开(公告)日：2012-02-14

申请号：US12027251

申请日：2008-02-06

Applicant: Mukul Joshi ,  Venkatesan Murali

Inventor： Mukul Joshi ,  Venkatesan Murali

IPC: H01L23/34

CPC classification number: H01L23/50 ,  H01L21/563 ,  H01L23/055 ,  H01L23/10 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A method of implementing a discrete component in an integrated circuit package is described. The method includes steps of coupling the discrete component to a surface of a substrate of the integrated circuit package, coupling an integrated circuit die to the surface of the substrate, applying a first epoxy material, and applying a second epoxy material to the discrete component, where the first epoxy material is different from the second epoxy material.

Abstract translation: 描述了在集成电路封装中实现分立元件的方法。 该方法包括以下步骤：将分立组件耦合到集成电路封装的衬底的表面，将集成电路裸片耦合到衬底的表面，施加第一环氧材料，以及将第二环氧材料施加到分立组件， 其中第一环氧树脂材料与第二环氧树脂材料不同。

公开(公告)号：US20060048046A1

公开(公告)日：2006-03-02

申请号：US10924447

申请日：2004-08-24

Applicant: Mukul Joshi ,  Mukesh Mohania

Inventor： Mukul Joshi ,  Mukesh Mohania

IPC: G06F17/24

CPC classification number: G06F17/241

Abstract: A user can highlight text and provide accompanying annotations. Highlighted text, accompanying annotations, and time-stamp information are stored in a user profile that is maintained locally with a web browser, at the client side. A retrieved web page is presented to a user with annotations of some form, based upon the user profile. The retrieved web page may typically be annotated through marked or highlighted portions of text, so that the user can readily locate this information in the web page, and assess the relevance of the retrieved page.

Abstract translation: 用户可以突出显示文本并提供附带的注释。 突出显示的文本，附带的注释和时间戳信息存储在客户端使用Web浏览器在本地维护的用户配置文件中。 基于用户简档，将检索到的网页呈现给具有某种形式的注释的用户。 所检索的网页通常可以通过文本的标记或突出显示的部分进行注释，使得用户可以容易地将该信息定位在网页中，并且评估检索到的页面的相关性。

公开(公告)号：US20070277093A1

公开(公告)日：2007-11-29

申请号：US11838943

申请日：2007-08-15

Applicant: Mukul Joshi ,  Mukesh Mohania

Inventor： Mukul Joshi ,  Mukesh Mohania

IPC: G06F15/00

CPC classification number: G06F17/241

Abstract: A user can highlight text and provide accompanying annotations. Highlighted text, accompanying annotations, and time-stamp information are stored in a user profile that is maintained locally with a web browser, at the client side. A retrieved web page is presented to a user with annotations of some form, based upon the user profile. The retrieved web page may typically be annotated through marked or highlighted portions of text, so that the user can readily locate this information in the web page, and assess the relevance of the retrieved page.

Abstract translation: 用户可以突出显示文本并提供附带的注释。 突出显示的文本，附带的注释和时间戳信息存储在客户端使用Web浏览器在本地维护的用户配置文件中。 基于用户简档，将检索到的网页呈现给具有某种形式的注释的用户。 所检索的网页通常可以通过文本的标记或突出显示的部分进行注释，使得用户可以容易地将该信息定位在网页中，并且评估检索到的页面的相关性。

公开(公告)号：US20060099736A1

公开(公告)日：2006-05-11

申请号：US10984508

申请日：2004-11-09

Applicant: Mohan Nagar ,  Mukul Joshi ,  Shirish Shah

Inventor： Mohan Nagar ,  Mukul Joshi ,  Shirish Shah

IPC: H01L21/48 ,  H01L21/50 ,  H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L21/563 ,  H01L24/17 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of underfilling an integrated circuit that is mounted to a first side of a package substrate having an opposing second side. A void is provided, which extends completely through the package substrate and is disposed under the integrated circuit. The package substrate is disposed with the second side up and the first side and the integrated circuit down. An underfill material is dispensed into the void on the second side of the package substrate. The underfill material thereby flows first through the void and then between the first side of the package substrate and the integrated circuit.

Abstract translation: 一种填充集成电路的方法，该集成电路安装到具有相对的第二侧的封装衬底的第一侧。 提供了一种空隙，其完全延伸穿过封装衬底并且设置在集成电路之下。 封装基板以第二面向上，第一面和集成电路向下设置。 将底部填充材料分配到封装基板的第二侧上的空隙中。 因此，底部填充材料首先流过空隙，然后在封装衬底的第一侧和集成电路之间流动。

公开(公告)号：US20050125371A1

公开(公告)日：2005-06-09

申请号：US10729166

申请日：2003-12-05

Applicant: Manish Bhide ,  Ajay Gupta ,  Mukul Joshi ,  Mukesh Mohania

Inventor： Manish Bhide ,  Ajay Gupta ,  Mukul Joshi ,  Mukesh Mohania

IPC: G06F7/00 ,  G06F17/30

CPC classification number: G06F17/30368

Abstract: Triggers are dynamically created and destroyed on an application database. Rules are represented in active databases as ECA (event-condition-action) items, in which an action formulates a reaction to an event and is executed after the rule is triggered when the condition is evaluated to true. The event is defined as an instantaneous and atomic (that is, the event either happens completely, or not at all) point of occurrence within an application. Events can be classified as either database, temporal, or user-defined events, and their type can be either primitive or composite.

Abstract translation: 触发器在应用程序数据库上动态创建和销毁。 规则在活动数据库中表示为ECA（事件 - 条件 - 操作）项，其中动作形成对事件的反应，并且在条件被评估为true时触发规则之后执行。 该事件被定义为应用程序中的即时和原子（即事件完全发生或完全不发生）发生。 事件可以被分类为数据库，时间或用户定义的事件，它们的类型可以是原始的或复合的。

公开(公告)号：US08981577B2

公开(公告)日：2015-03-17

申请号：US12731045

申请日：2010-03-24

Applicant: Mukul Joshi

Inventor： Mukul Joshi

IPC: H01L29/40 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer first side and an interposer second side opposing the interposer first side; mounting an integrated circuit to the interposer first side, the integrated circuit having a non-active side and an active side with the non-active side facing the interposer; connecting first interconnects between the active side and the interposer first side, the first interconnects having a first density on the interposer first side; mounting the interposer over a package carrier with the interposer first side facing the package carrier; connecting second interconnects between the package carrier and the interposer second side, the second interconnects having a second density on the interposer second side, the second density that is approximately the same as the first density; and forming an encapsulation over the package carrier covering the interposer and the second interconnects.

Abstract translation: 一种集成电路封装系统的制造方法，包括：提供具有插入器第一侧和与插入件第一侧相对的插入件第二侧的插入件; 将集成电路安装到所述插入器第一侧，所述集成电路具有非活动侧和所述非活动侧面向所述插入件的有源侧; 连接所述有源侧和所述插入器第一侧之间的第一互连，所述第一互连在所述插入器第一侧上具有第一密度; 将插入器安装在封装载体上，插入器第一面朝向封装载体; 连接在所述封装载体和所述插入件第二侧之间的第二互连，所述第二互连在所述插入件第二侧具有第二密度，所述第二密度与所述第一密度大致相同; 以及在覆盖所述插入件和所述第二互连件的封装载体上形成封装。

公开(公告)号：US20110233763A1

公开(公告)日：2011-09-29

申请号：US12748335

申请日：2010-03-26

Applicant: Rajendra D. Pendse ,  Chien Ouyang ,  Mukul Joshi

Inventor： Rajendra D. Pendse ,  Chien Ouyang ,  Mukul Joshi

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/3171 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/14153 ,  H01L2224/14155 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method of manufacture of an integrated circuit system includes: providing a substrate having a transistor and a metallization layer; forming a metal pad in direct contact with the metallization layer of the substrate; forming a passivation layer in direct contact with the metal pad and covering the substrate; forming a routing trace above the passivation layer in direct contact with the metal pad, and the routing trace is substantially larger than the metal pad, and the routing trace is not electrically insulated by a subsequent layer; and forming a bump connected to the metal pad with the routing trace.

Abstract translation: 集成电路系统的制造方法包括：提供具有晶体管和金属化层的衬底; 形成与所述基板的金属化层直接接触的金属焊盘; 形成与金属焊盘直接接触并覆盖基板的钝化层; 在与金属焊盘直接接触的钝化层之上形成布线迹线，并且路由迹线基本上大于金属焊盘，并且路由迹线不被后续层电绝缘; 以及用所述路线迹线形成连接到所述金属焊盘的凸块。