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公开(公告)号：US20200282471A1
公开(公告)日：2020-09-10
申请号：US16883703
申请日：2020-05-26
摘要： Provided are a hole formation method enabling the formation of a high-quality hole even when a workpiece material is a difficult-to-machining metal material or a fiber-reinforced composite material and a drill bit used in the method. A drill bit includes at least one cutting edge and a face (a leading flank and a trailing flank) positioned in the vicinity of the cutting edge, and on the face, a recess exhibiting a prescribed planar shape (groove) is provided. A hole formation method includes a hole formation step of machining a portion to be processed of a workpiece material by means of drilling to form a hole while a lubricant material for assisting machining process is in contact with the portion to be processed, and in the hole formation step, the drill bit is used.
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2.发明公开公开(公告)号：US20240254360A1
公开(公告)日：2024-08-01
申请号：US18561932
申请日：2022-05-23
发明人： Tatsuro TAKAMURA , Naoki KASHIMA , Sayaka ITO , Narihiro URAHAMA , Kazuki SUNAKAWA , Tetsuro MIYAHIRA , Takaaki OGASHIWA
CPC分类号： C09D161/28 , C08G73/1035 , C08J5/18 , C08J5/246 , C08K3/22 , C08K9/02 , C08K9/04 , C08L61/28 , C08J2361/28 , C08K2003/2237 , C08L2203/206
摘要： A resin composition is provided having a high permittivity and a low dissipation factor, and having excellent moisture absorption and heat resistance, a high glass transition temperature, a low coefficient of thermal expansion, and good coatability and appearance, and used for producing an insulation layer of a printed wiring board; and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board. The resin composition contains: (A) a cyanate ester compound, (B) a maleimide compound, and (C) a surface-coated titanium oxide, wherein a content of the cyanate ester compound (A) is 1 to 65 parts by mass, based on 100 parts by mass of a total resin solid content in the resin composition, and a content of the maleimide compound (B) is 15 to 85 parts by mass, based on 100 parts by mass of a total resin solid content in the resin composition.
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公开(公告)号：US20190184472A1
公开(公告)日：2019-06-20
申请号：US16309411
申请日：2017-05-19
CPC分类号： B23B35/00 , B23B51/00 , B23B51/06 , B23B2215/04 , B23B2222/04 , B23B2222/52 , B23B2222/80 , B23B2222/84 , B23B2222/88 , B23B2226/275 , B23B2250/12 , B23B2251/18
摘要： Provided are a hole formation method enabling the formation of a high-quality hole even when a workpiece material is a difficult-to-machining metal material or a fiber-reinforced composite material and a drill bit used in the method. A drill bit includes at least one cutting edge and a leading flank adjacent to the cutting edge, and the leading flank is set to have a surface roughness Ra of 2.0 μm or more and 3.0 μm or less. A hole formation method includes a hole formation step of machining a portion to be processed of a workpiece material by means of drilling to form a hole while a lubricant material for assisting machining process is in contact with a drill bit and/or the portion to be processed, and in the hole formation step, the drill bit is used.
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4.发明申请公开(公告)号：US20170213745A1
公开(公告)日：2017-07-27
申请号：US15326831
申请日：2015-07-15
IPC分类号： H01L21/48 , H01L21/683 , H01L23/544 , B32B15/20 , B32B37/02 , B32B37/00 , B32B3/26 , B32B38/10 , H01L23/498 , B32B38/04
CPC分类号： H01L21/4846 , B32B3/266 , B32B15/20 , B32B37/02 , B32B37/187 , B32B38/04 , B32B38/10 , B32B2260/021 , B32B2305/076 , B32B2307/202 , B32B2307/206 , B32B2311/12 , B32B2457/14 , H01L21/4857 , H01L21/486 , H01L21/4864 , H01L21/6835 , H01L23/12 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/544 , H01L2221/68345 , H01L2221/68359 , H01L2223/54426 , H01L2924/0002 , H05K3/46 , H01L2924/00
摘要： A laminate including at least providing a first intermediate laminate provided with a carrier substrate including a support and a peelable metal layer formed on at least one surface of the carrier substrate, forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support from the surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole, stacking and disposing on the surface where the first hole is formed, an insulating material and a metal foil in this order when viewed from the surface, and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material, and performing treatment with a chemical agent on the third intermediate laminate.
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公开(公告)号：US20210257207A1
公开(公告)日：2021-08-19
申请号：US17226766
申请日：2021-04-09
IPC分类号： H01L21/02 , H01L23/12 , H01L21/48 , H01L23/538 , H05K3/00 , H01L23/498 , H01L23/522 , H01L23/528 , H05K3/46
摘要： A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.
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公开(公告)号：US20200015363A1
公开(公告)日：2020-01-09
申请号：US16495259
申请日：2018-03-29
摘要： The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).
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公开(公告)号：US20180257148A1
公开(公告)日：2018-09-13
申请号：US15756899
申请日：2016-08-31
IPC分类号： B23B41/14 , B23B47/28 , B26F1/16 , C10M107/28
CPC分类号： B23B41/14 , B23B35/00 , B23B47/28 , B26F1/16 , C10M107/04 , C10M107/28 , C10M107/34 , C10M107/36 , C10M111/04 , C10M2201/066 , C10M2205/0206 , C10M2207/283 , C10M2207/289 , C10M2209/0845 , C10M2209/103 , C10M2209/104 , C10M2209/105 , C10M2209/108 , C10M2209/123 , C10M2217/024 , C10N2220/021 , C10N2240/401 , C10N2250/121 , H05K3/0047 , H05K2203/0214 , C10M2205/0225
摘要： An entry sheet for drilling comprising: a metallic foil; and a layer of a resin composition on at least one surface of the metallic foil, the resin composition comprising a polyolefin resin (A) and a water-soluble resin (B), wherein a content of the polyolefin resin (A) is 25 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of the total of the polyolefin resin (A) and the water-soluble resin (B), a content of the water-soluble resin (B) is 50 parts by mass or more and 75 parts by mass or less based on 100 parts by mass of the total of the polyolefin resin (A) and the water-soluble resin (B), and the water-soluble resin (B) comprises a high-molecular-weight water-soluble resin (B-1) having a weight average molecular weight of 2×105 or higher and 1.5×106 or lower.
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公开(公告)号：US20180050462A1
公开(公告)日：2018-02-22
申请号：US15553795
申请日：2016-02-24
CPC分类号： B26F1/16 , B23B35/00 , B23B41/16 , B23B2250/12 , B26F2210/02 , H05K3/0047 , H05K3/007 , H05K2203/0156 , H05K2203/0214
摘要： Entry sheet for drilling including a metallic foil and a layer of a resin composition, the layer formed on the metallic foil without interposing an adhesion layer, in which the layer of the resin composition has a peak attributable to a carbon atom-oxygen atom double bond appearing at 1700 to 1750 cm−1 and a peak attributable to a carbon atom-oxygen atom single bond appearing at 1080 to 1300 cm−1 in infrared spectroscopy, and when the absorbance at the peak attributable to the carbon atom-oxygen atom double bond appearing at 1700 to 1750 cm−1 is represented by Abs(C═O)L, and the absorbance at the peak of the carbon atom-oxygen atom single bond appearing at 1080 to 1300 cm−1 is represented by Abs(C—O)L, the layer of the resin composition has an absorbance ratio (C) of 0.12 to 1.80, the absorbance ratio (C) represented by the following expression (1). Absorbance ratio(C)=Abs(C═O)L/Abs(C—O)L Expression (1)
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公开(公告)号：US20170111997A1
公开(公告)日：2017-04-20
申请号：US15300629
申请日：2015-03-30
摘要： The present invention provides an entry sheet for drilling which provides higher hole position accuracy than that of a conventional entry sheet for drilling. The present invention provides an entry sheet for drilling, including a metal foil, and a layer including a resin composition and formed on at least one surface of the metal foil, wherein the resin composition includes a resin and tungsten disulfide as a solid lubricant, and the content of the tungsten disulfide included in the resin composition is 10 parts by mass to 200 parts by mass based on 100 parts by mass of the resin included in the resin composition.
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10.发明公开公开(公告)号：US20240043687A1
公开(公告)日：2024-02-08
申请号：US18276539
申请日：2022-01-26
CPC分类号： C08L79/08 , C08K7/18 , C08K3/22 , C08J5/244 , C08J5/249 , C08J5/18 , H05K1/0373 , C08L2203/20 , C08K2201/005 , C08K2003/2237 , C08J2379/08 , C08J2463/00 , H05K2201/0209
摘要： An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTi4O9; (B) a filler different from the BaTi4O9 (A); and (C) a thermosetting resin; wherein a median particle size of the BaTi4O9 (A) is 0.10 to 1.00 μm, and a volume ratio of the BaTi4O9 (A) to the filler (B), the BaTi4O9(A):the filler (B), ranges from 15:85 to 80:20.
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