公开(公告)号：US20190219460A1

公开(公告)日：2019-07-18

申请号：US16313110

申请日：2016-07-11

申请人： LG INNOTEK CO., LTD.

发明人： Won Keun CHO ,  Eun Jin KIM ,  Soo Min LEE ,  Jina LEE ,  In Hee CHO ,  Hyun Jin JO ,  Sanga JU

IPC分类号： G01L1/20

CPC分类号： G01L1/20 ,  G01L1/18 ,  H01B1/02

摘要： A pressure sensor according to an embodiment of the present invention comprises: a first electrode layer; a second electrode layer; and an intermediate layer disposed between the first electrode layer and the second electrode layer, wherein the intermediate layer changes in resistance, depending on a change in at least one of thickness and volume thereof. In addition, the intermediate layer comprises: a foam having porous regions dispersed in a non-porous region thereof; and a conductive material being dispersed in the foam and greater in conductivity rate than the foam.

公开(公告)号：US20240282685A1

公开(公告)日：2024-08-22

申请号：US18682829

申请日：2022-08-10

申请人： LG INNOTEK CO., LTD.

发明人： Jae Hun JEONG ,  Jong Bae SHIN ,  Soo Min LEE

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49822 ,  H01L21/481 ,  H01L23/49838 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/13101 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1316 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2916 ,  H01L2224/32227 ,  H01L2924/01048 ,  H01L2924/014

摘要： A circuit board according to an embodiment includes a first insulating layer, a first circuit pattern layer disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and the first circuit pattern layer, wherein the second insulating layer includes a first region including a cavity and a second region excluding the first region, wherein the first region of the second insulating layer includes a first portion concave toward a lower surface of the second insulating layer, and a second portion convex toward an upper surface of the second insulating layer.

公开(公告)号：US20230328886A1

公开(公告)日：2023-10-12

申请号：US18026917

申请日：2021-09-17

申请人： LG INNOTEK CO., LTD.

发明人： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K1/111 ,  H05K1/185 ,  H05K1/183 ,  H05K3/4697

摘要： A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity, wherein an upper surface of the first insulating layer includes a first region that does not vertically overlap the cavity; a second region vertically overlapping the cavity; and a boundary region between the first region and the second region, the first circuit pattern includes a first-first circuit pattern disposed on the boundary region of the first insulating layer, the first-first circuit pattern includes a first portion that does not vertically overlap the cavity; and a second portion connected to the first portion and vertically overlapping the cavity, and a thickness of the first portion of the first-first circuit pattern is different from a thickness of the second portion of the first-first circuit pattern.

公开(公告)号：US20240237233A9

公开(公告)日：2024-07-11

申请号：US18271544

申请日：2021-04-26

申请人： LG INNOTEK CO., LTD.

发明人： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/00

CPC分类号： H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

摘要： A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

公开(公告)号：US20240120243A1

公开(公告)日：2024-04-11

申请号：US18263603

申请日：2021-04-26

申请人： LG INNOTEK CO., LTD.

发明人： Jong Bae SHIN ,  Moo Seong KIM ,  Soo Min LEE ,  Jae Hun JEONG

IPC分类号： H01L23/13 ,  H01L21/48 ,  H01L23/498 ,  H05K1/18 ,  H05K3/46

CPC分类号： H01L23/13 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/183 ,  H05K3/4644 ,  H05K2203/0195

摘要： A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.

公开(公告)号：US20190289951A1

公开(公告)日：2019-09-26

申请号：US16302589

申请日：2017-05-23

申请人： LG INNOTEK CO., LTD.

发明人： Hyun Jin JO ,  Won Keun CHO ,  Jeong Han KIM ,  Soo Min LEE ,  Ji Na LEE ,  In Hee CHO ,  Sang A JU

IPC分类号： A43B3/00 ,  A43B17/00 ,  G01L1/20 ,  B32B3/26 ,  B32B7/12

摘要： Disclosed in an embodiment is a pressure detection sensor comprising: an elastic layer including a hole; and an electrode layer including a plurality of electrodes arranged on the elastic layer so as to be spaced apart, wherein the elastic layer includes a variable member arranged in the hole, the plurality of electrodes are electrically connected to each other by outside pressure, and at least one of the plurality of electrodes covers a part of the hole.

公开(公告)号：US20240138077A1

公开(公告)日：2024-04-25

申请号：US18271544

申请日：2021-04-25

申请人： LG INNOTEK CO., LTD.

发明人： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/00

CPC分类号： H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

摘要： A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

公开(公告)号：US20230290716A1

公开(公告)日：2023-09-14

申请号：US18013624

申请日：2021-06-29

申请人： LG INNOTEK CO., LTD

发明人： Jae Hun JEONG ,  Jong Bae SHIN ,  Soo Min LEE

IPC分类号： H01L23/498 ,  H05K1/02 ,  H05K3/46 ,  H01L21/48 ,  H05K3/00 ,  H05K1/03 ,  H01L23/13

CPC分类号： H01L23/49838 ,  H05K1/0298 ,  H05K3/4688 ,  H01L21/4857 ,  H05K3/0032 ,  H05K1/036 ,  H01L23/49894 ,  H01L23/49822 ,  H05K3/4697 ,  H01L23/13 ,  H05K1/186

摘要： A printed circuit board according to an embodiment comprises: a first insulation layer; a first circuit pattern disposed on one surface of the first insulation layer and including a pad; and a second insulation layer disposed on one surface of the first insulation layer and including a cavity exposing the pad, wherein the first circuit pattern includes a 1-1 metal layer disposed on one surface of the first insulation layer, and a 1-2 metal layer disposed on one surface of the 1-1 metal layer, wherein the area of the 1-1 metal layer is greater than the area of the 1-2 metal layer, and at least a portion of a side surface of the 1-1 metal layer is exposed through the cavity.

公开(公告)号：US20220377902A1

公开(公告)日：2022-11-24

申请号：US17770757

申请日：2020-10-21

申请人： LG INNOTEK CO., LTD.

发明人： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC分类号： H05K1/18 ,  H05K1/11

摘要： A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.