CIRCUIT BOARD
    1.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号:US20230240005A1

    公开(公告)日:2023-07-27

    申请号:US17928703

    申请日:2021-06-10

    CPC classification number: H05K1/0296 H05K1/115

    Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

    PRESSURE SENSING CHAIR
    4.
    发明申请

    公开(公告)号:US20190021504A1

    公开(公告)日:2019-01-24

    申请号:US15757494

    申请日:2016-09-02

    Abstract: The present invention relates to a pressure sensing chair capable of wireless charging, detecting body pressure, and measuring the distribution of body pressure. A pressure sensing chair according to one embodiment of the present invention comprises: at least one sensor unit including a first electrode layer having a plurality of first electrode patterns arranged in a first direction, a second electrode layer having a plurality of second electrode patterns arranged in a second direction crossing the first direction, and a dielectric layer arranged between the first electrode layer and the second electrode layer; and a module unit connected to the sensor unit and including a communication unit and a wireless charging unit.

    CIRCUIT BOARD
    6.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号:US20230269872A1

    公开(公告)日:2023-08-24

    申请号:US18011293

    申请日:2021-06-17

    CPC classification number: H05K1/0306 H05K1/056 H05K1/115

    Abstract: A circuit board according to an embodiment includes: an insulating portion including a plurality of insulating layers; a circuit pattern disposed on surfaces of the plurality of insulating layers; and a via passing through at least one insulating layer among the plurality of insulating layers; wherein the insulating portion includes: a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including a plurality of insulating layers; and a third insulating portion disposed under the first insulating portion and including a plurality of insulating layers; wherein the first insulating portion is formed of prepreg containing glass fibers, wherein at least one of the second insulating portion and the third insulating portion includes a resin coated copper (RCC) and a solder resist disposed on the RCC, wherein the circuit pattern is disposed on a surface of the solder resist, and wherein the via is formed passing through the solder resist.

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

    公开(公告)号:US20240414844A1

    公开(公告)日:2024-12-12

    申请号:US18699444

    申请日:2022-09-30

    Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, the coating layer includes a first functional group, and the first insulating layer includes a reactive group bonded to the first functional group.

    PRESSURE SENSING INSOLE
    9.
    发明申请

    公开(公告)号:US20200260815A1

    公开(公告)日:2020-08-20

    申请号:US15774523

    申请日:2016-11-08

    Abstract: A pressure sensing insole according to an embodiment of the present invention includes: a first electrode layer including a first conductive region; a first adhesive layer disposed on the first electrode layer and including an insulating region; an intermediate layer disposed on the first adhesive layer; a second adhesive layer disposed on the intermediate layer and including an insulating region; and a second electrode layer disposed on the second adhesive layer and including a second conductive region.

    DIRECTION DETECTION DEVICE
    10.
    发明申请

    公开(公告)号:US20180202840A1

    公开(公告)日:2018-07-19

    申请号:US15744240

    申请日:2016-03-15

    CPC classification number: G01D5/2405 G01D5/24 G06F3/044 G08B13/10 G08B21/18

    Abstract: A direction detection device, according to one embodiment of the present invention, comprises: a dielectric layer; a first electrode layer which is arranged on a first surface of the dielectric layer, and which comprises a plurality of first electrode patterns arranged in a first direction; a second direction arranged on a second surface of the dielectric layer, which faces the first surface; a capacitance detection unit which detects changes in capacitance due to time difference between a first region and a second region, wherein in the first region, at least one selected among the plurality of first electrode patterns overlaps the second electrode layer, and in the second region, at least one selected from the plurality of the remaining first electrode patterns overlaps the second electrode layer; and a direction detection unit which connects to the capacitance detection unit, and detects a movement direction on the basis of the time difference between the first region and the second region

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