公开(公告)号：US09247652B2

公开(公告)日：2016-01-26

申请号：US12680923

申请日：2008-10-02

Applicant: Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

Inventor： Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

IPC: B32B15/02 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  B22F1/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  B23K35/365 ,  C09J9/02 ,  C09J11/04 ,  H01L23/00 ,  C08K3/00 ,  C08K3/08 ,  H05K1/14

CPC classification number: H01L24/16 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/20107 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31511 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/05599

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Abstract translation: 提供了一种粘合剂组合物，其保持储存稳定性，并进一步得到固化产物，其中在固化产物润湿其组分并令人满意地在组分（或部分）之间铺展的状态下形成金属粘合剂，由此转变粘合性能优异 ，导电性和安装的可靠性，如TCT电阻或耐高温电阻; 使用该基板的电子元件安装基板; 和半导体器件。 粘合剂组合物包括导电颗粒（A）和粘合剂组分（B），其中导电颗粒（A）包括熔点等于或高于回流温度并且不含铅的金属（a1）和金属 （a2），其熔点低于回流温度，不含铅，粘合剂成分（B）含有热固性树脂组合物（b1）和脂肪族二羟基羧酸（b2）。

公开(公告)号：US20100221559A1

公开(公告)日：2010-09-02

申请号：US12680923

申请日：2008-10-02

Applicant: Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

Inventor： Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

IPC: B32B15/02 ,  H01B1/02 ,  H01B1/22

CPC classification number: H01L24/16 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/20107 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31511 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/05599

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Abstract translation: 提供了一种粘合剂组合物，其保持储存稳定性，并且进一步得到固化产物，其中在固化产物润湿其组分并令人满意地在组分（或部分）之间铺展的状态下形成金属粘合剂，由此转变优异的粘合性能 ，导电性和安装的可靠性，如TCT电阻或耐高温电阻; 使用该基板的电子元件安装基板; 和半导体器件。 粘合剂组合物包括导电颗粒（A）和粘合剂组分（B），其中导电颗粒（A）包括熔点等于或高于回流温度并且不含铅的金属（a1）和金属 （a2），其熔点低于回流温度，不含铅，粘合剂成分（B）含有热固性树脂组合物（b1）和脂肪族二羟基羧酸（b2）。

公开(公告)号：US20130302603A1

公开(公告)日：2013-11-14

申请号：US13981612

申请日：2012-01-24

Applicant: Kaoru Konno ,  Hiroki Hayashi ,  Michiko Natori

Inventor： Kaoru Konno ,  Hiroki Hayashi ,  Michiko Natori

IPC: H01L23/00

CPC classification number: H01L24/28 ,  C08K3/08 ,  C08K5/04 ,  C08K7/06 ,  C08K2003/0806 ,  C09J9/00 ,  C09J11/04 ,  H01B1/02 ,  H01B1/22 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04026 ,  H01L2224/05147 ,  H01L2224/05655 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The adhesive composition of the present invention includes (A) flake silver particles wherein an oxygen state ratio derived from silver oxide measured by X-ray photoelectron spectroscopy is less than 15% and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or more.

Abstract translation: 本发明的粘合剂组合物包括（A）通过X射线光电子能谱测定的氧化银得到的氧状态比小于15％的片状银粒子，（B）沸点为300的醇或羧酸 °C以上。

公开(公告)号：US20130183535A1

公开(公告)日：2013-07-18

申请号：US13823278

申请日：2011-09-27

Applicant: Kaoru Konno ,  Hiroki Hayashi

Inventor： Kaoru Konno ,  Hiroki Hayashi

IPC: H01L23/00

CPC classification number: H01L24/83 ,  C08K2003/0806 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/04026 ,  H01L2224/05644 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/31678 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An adhesive composition having high electrical conductibility and thermal conductivity under no load and even at a curing temperature of 200° C. or lower, and having a high adhesive force even at 260° C., and a semiconductor device produced by using the adhesive composition are provided. Disclosed is an adhesive composition comprising (A) silver particles having a state ratio of oxygen derived from silver oxide of less than 15% as measured by X-ray photoelectron spectroscopy, and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or higher.

Abstract translation: 一种粘合剂组合物，其在无负载下甚至在200℃或更低的固化温度下具有高导电性和导热性，并且即使在260℃也具有高的粘合力，以及通过使用粘合剂组合物制备的半导体器件 被提供。 公开了一种粘合剂组合物，其包含（A）通过X射线光电子能谱法测量的，氧化银衍生自氧化银的氧的状态比例小于15％的银颗粒，（B）沸点为300的醇或羧酸 ℃以上。

公开(公告)号：US08421247B2

公开(公告)日：2013-04-16

申请号：US12990082

申请日：2009-04-28

Applicant: Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

Inventor： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC: H01L23/488 ,  B32B5/16 ,  C09K5/00 ,  C22C5/06

CPC classification number: H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: A connecting material that includes metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy and a mean particle size between 0.1 μm and 50 μm; and especially a connecting material that includes metallic particles that have been subjected to treatment for removal of a surface oxide film and subjected to surface treatment with a surface protective material, so as to provide a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C.; as well as a semiconductor device employing the connecting material to bond a semiconductor element to a support member.

Abstract translation: 一种连接材料，其包含通过X射线光电子能谱测定的氧状态比小于15％的金属颗粒，平均粒径为0.1μm至50μm; 特别是包含金属粒子的连接材料，该金属粒子已被处理去除表面氧化膜并用表面保护材料进行表面处理，从而即使在连接时也提供具有高导热系数的连接材料 在高达200℃的固化温度下，不施加负载，并且即使当固化产物在260℃下被加热时也具有足够的粘合强度; 以及使用连接材料将半导体元件结合到支撑构件的半导体器件。

公开(公告)号：US20110101543A1

公开(公告)日：2011-05-05

申请号：US12990082

申请日：2009-04-28

Applicant: Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

Inventor： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC: H01L23/488 ,  C09K5/00 ,  C22C5/06 ,  B32B5/16

CPC classification number: H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: The invention provides a connecting material comprising metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy, and especially a connecting material comprising metallic particles that have been subjected to treatment for removal of the surface oxide film and to surface treatment with a surface protective material, for the purpose of providing a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C., as well as a semiconductor device employing it.

Abstract translation: 本发明提供了一种连接材料，其包括通过X射线光电子能谱法测量的氧状态比小于15％的金属颗粒，特别是包括已经经过去除表面氧化膜的处理的金属颗粒的连接材料， 为了提供具有高导热系数的连接材料的目的，即使在高达200℃的固化温度下接合而不施加负载，并且具有足够的接合强度 即使固化产物已经在260℃加热，以及使用它的半导体器件也是如此。