公开(公告)号：US08421247B2

公开(公告)日：2013-04-16

申请号：US12990082

申请日：2009-04-28

Applicant: Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

Inventor： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC: H01L23/488 ,  B32B5/16 ,  C09K5/00 ,  C22C5/06

CPC classification number: H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: A connecting material that includes metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy and a mean particle size between 0.1 μm and 50 μm; and especially a connecting material that includes metallic particles that have been subjected to treatment for removal of a surface oxide film and subjected to surface treatment with a surface protective material, so as to provide a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C.; as well as a semiconductor device employing the connecting material to bond a semiconductor element to a support member.

Abstract translation: 一种连接材料，其包含通过X射线光电子能谱测定的氧状态比小于15％的金属颗粒，平均粒径为0.1μm至50μm; 特别是包含金属粒子的连接材料，该金属粒子已被处理去除表面氧化膜并用表面保护材料进行表面处理，从而即使在连接时也提供具有高导热系数的连接材料 在高达200℃的固化温度下，不施加负载，并且即使当固化产物在260℃下被加热时也具有足够的粘合强度; 以及使用连接材料将半导体元件结合到支撑构件的半导体器件。

公开(公告)号：US20110101543A1

公开(公告)日：2011-05-05

申请号：US12990082

申请日：2009-04-28

Applicant: Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

Inventor： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC: H01L23/488 ,  C09K5/00 ,  C22C5/06 ,  B32B5/16

CPC classification number: H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: The invention provides a connecting material comprising metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy, and especially a connecting material comprising metallic particles that have been subjected to treatment for removal of the surface oxide film and to surface treatment with a surface protective material, for the purpose of providing a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C., as well as a semiconductor device employing it.

Abstract translation: 本发明提供了一种连接材料，其包括通过X射线光电子能谱法测量的氧状态比小于15％的金属颗粒，特别是包括已经经过去除表面氧化膜的处理的金属颗粒的连接材料， 为了提供具有高导热系数的连接材料的目的，即使在高达200℃的固化温度下接合而不施加负载，并且具有足够的接合强度 即使固化产物已经在260℃加热，以及使用它的半导体器件也是如此。

公开(公告)号：US20080261049A1

公开(公告)日：2008-10-23

申请号：US11573133

申请日：2005-07-29

Applicant: Hiroki Hayashi ,  Ayako Taira ,  Satoshi Ebana

Inventor： Hiroki Hayashi ,  Ayako Taira ,  Satoshi Ebana

IPC: B32B15/092 ,  H01B1/22

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0272 ,  Y10T428/31529

Abstract: The conductive paste of the invention comprises a conductive powder and a binder component, wherein the conductive powder is composed of metal powder which is copper powder or copper alloy powder partially covered on the surface with silver, and is either a mixture of roughly spherical metal powder and flat metal powder, or roughly spherical or flat metal powder alone, and wherein the binder component contains a mixture of an epoxy resin and an imidazole compound with a hydroxyl group or a mixture of an epoxy resin and an imidazole compound with a carboxyl group.

Abstract translation: 本发明的导电膏包括导电粉末和粘合剂组分，其中导电粉末由金属粉末组成，铜粉末或铜合金粉末部分地被银表面覆盖，并且是大致球形的金属粉末 和扁平金属粉末，或单独的大致球形或扁平金属粉末，并且其中粘合剂组分含有环氧树脂和具有羟基的咪唑化合物或环氧树脂和具有羧基的咪唑化合物的混合物的混合物。