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    SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF
    4.
    发明申请
    SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF 有权
    太阳能电池模块及其制造方法

    公开(公告)号：US20130340813A1

    公开(公告)日：2013-12-26

    申请号：US13981540

    申请日：2012-01-11

    申请人： Aya Momozaki ,  Shigeki Katogi ,  Hiroki Hayashi ,  Michiko Natori ,  Shinichirou Sukata

    发明人： Aya Momozaki ,  Shigeki Katogi ,  Hiroki Hayashi ,  Michiko Natori ,  Shinichirou Sukata

    IPC分类号： H01L31/18 ,  H01L31/02

    CPC分类号： H01L31/18 ,  B32B17/10018 ,  B32B17/10091 ,  B32B17/10788 ,  B32B17/10807 ,  H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H01L24/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/30 ,  H01L31/022425 ,  H01L31/048 ,  H01L31/0512 ,  Y02E10/50

    摘要： Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).

    摘要翻译： 本发明提供一种太阳能电池模块的制造方法，其特征在于，包括：涂布导电性粘合剂组合物的工序（A），其包含具有金属的导电性粒子等; 布置配线构件以使介于其间的所施加的导电粘合剂组合物与太阳能电池单元的电极相对的步骤（B）; 利用在步骤（B）中获得的布线构件加热太阳能电池单元的步骤（C）; 以及将步骤（C）中获得的布线构件将密封树脂层压到太阳能电池单元的两个表面上的步骤（D），将保护玻璃层压到太阳能电池单元的光接收表面上，并将保护膜层压到 并且进行加热，其中导电粒子中的金属的熔点低于步骤（C）中的加热温度。

    Process for producing printed wiring board and photosensitive resin composition used in the same
    6.
    发明授权
    Process for producing printed wiring board and photosensitive resin composition used in the same 有权
    用于制造印刷线路板的方法和用于其中的感光性树脂组合物

    公开(公告)号：US07338751B2

    公开(公告)日：2008-03-04

    申请号：US10473466

    申请日：2002-03-29

    申请人： Toshihiko Akahori ,  Ken Sawabe ,  Michiko Natori ,  Tomoaki Aoki ,  Takuya Kajiwara

    发明人： Toshihiko Akahori ,  Ken Sawabe ,  Michiko Natori ,  Tomoaki Aoki ,  Takuya Kajiwara

    IPC分类号： G03F7/20 ,  G03F7/30 ,  G03F7/42 ,  G03F7/26 ,  G03F7/032

    CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K2203/0571 ,  H05K2203/0574 ,  H05K2203/0588 ,  H05K2203/072

    摘要： An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.

    摘要翻译： 本发明的目的是提供一种制造印刷电路板的方法，其优点在于不仅能够实现电路板的尺寸减小和密度的增加，而且还简化了步骤，而且也在于 安装部件的连接可靠性和产量提高，并且在该方法中使用感光性树脂组合物。 本发明涉及印刷电路板的制造方法，其特征在于包括以下步骤：（i）在具有电路的布线板上形成阻焊剂; （ii）在阻焊剂上层叠感光性树脂组合物的预成型层; （iii）将感光性树脂组合物的层进行曝光和显影以形成感光性树脂组合物的抗蚀剂图案; （iv）使所得板的整个表面进行无电镀，和（v）剥离感光性树脂组合物层，其中依次进行所述步骤，以及光敏树脂组合物及其用于 的过程。

    Resist pattern, process for producing same, and utilization thereof
    7.
    发明授权
    Resist pattern, process for producing same, and utilization thereof 有权
    抗蚀剂图案，其制造方法及其利用

    公开(公告)号：US07309559B2

    公开(公告)日：2007-12-18

    申请号：US10381671

    申请日：2001-09-26

    申请人： Michiko Natori ,  Takahiro Hidaka

    发明人： Michiko Natori ,  Takahiro Hidaka

    IPC分类号： G03F7/00 ,  G03F7/004

    CPC分类号： G03F7/027 ,  G03F7/0045 ,  G03F7/031 ,  G03F7/091 ,  H05K3/064

    摘要： A resist pattern having a film thickness of 1 to 100 μm and an aspect ratio (ratio of the line width to the film thickness of the resist pattern) of 3.5 or higher is provided in accordance with the present invention, the resist pattern being useful for increasing the density of a semiconductor package substrate circuit, and use of the resist pattern enabling a low conductor resistance to be maintained in fine wiring.This resist pattern can be produced using, for example, a photosensitive resin composition that includes (A) a binder polymer, (B1) a photopolymerizable compound having three ethylenically unsaturated bonds per molecule, (C) a photopolymerization initiator, and (D) either or both of a compound represented by general formula (I): (in the formula, m is an integer of 2 to 6) or a compound represented by general formula (II).

    摘要翻译： 根据本发明，提供了膜厚度为1〜100μm的抗蚀剂图案和宽高比（线宽与抗蚀剂图案的膜厚度的比率）为3.5以上的抗蚀剂图案，抗蚀剂图案可用于 提高半导体封装基板电路的密度，并且使用能够在精细布线中保持低导体电阻的抗蚀剂图案。 该抗蚀剂图案可以使用例如包含（A）粘合剂聚合物，（B1）每分子具有三个烯键式不饱和键的光聚合性化合物，（C）光聚合引发剂的光敏树脂组合物和（D） 或由通式（I）表示的化合物（式中，m为2〜6的整数）或通式（II）表示的化合物两者。