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39 条记录 (耗时 0.019 秒)

    LOW NOISE GEAR PUMP
    6.
    发明申请
    LOW NOISE GEAR PUMP 失效
    低噪声齿轮泵

    公开(公告)号：US20070237666A1

    公开(公告)日：2007-10-11

    申请号：US11685546

    申请日：2007-03-13

    申请人： James O'Brien

    发明人： James O'Brien

    IPC分类号： F04C2/02

    CPC分类号： F04C2/102 ,  F04C2/088 ,  F04C2/18

    摘要： A low noise gear set for use generally and preferably with a power plant having an engine driving a pump connected to a low pressure fluid source, generating high pressure fluid at an output. The idle gear meshes with the drive gear along two points of the profile of the corresponding gears. The first point being the root of one gear tooth meshing with the tip of the opposite gear tooth creating an initial first contact point and a subsequent second point along the profile when the teeth are disengaging at the first point and engaging at the second point, forming a sealed area, allowing the fluid to hydrostatically escape between the points.

    摘要翻译： 一种低噪音齿轮组，通常用于优选地具有发动机，发动机驱动连接到低压流体源的泵，在输出端产生高压流体。 空转齿轮沿着相应齿轮轮廓的两个点与驱动齿轮啮合。 第一点是与相对齿轮齿的尖端啮合的一个齿轮齿的根部，当牙齿在第一点处脱离并接合在第二点时，形成初始的第一接触点和随后的第二点，形成 密封区域，允许流体在点之间流体静力地逸出。

    Variable capacity pump/motor
    8.
    发明申请
    Variable capacity pump/motor 失效
    可变容量泵/电机

    公开(公告)号：US20050226757A1

    公开(公告)日：2005-10-13

    申请号：US11101837

    申请日：2005-04-08

    申请人： James O'Brien

    发明人： James O'Brien

    IPC分类号： F03C2/00 ,  F04C2/10 ,  F04C2/18 ,  F04C14/08 ,  F04C14/18 ,  F04C15/00 ,  F04C18/00

    CPC分类号： F04C14/08 ,  F04C2/10 ,  F04C2/102 ,  F04C2/18 ,  F04C14/185 ,  F04C15/0026

    摘要： A variable capacity pump/motor has a meshing internal and external gear set disposed between an upper mandrel and a lower mandrel, each including a flange extending towards the gears to divide a pump/motor chamber into suction and discharge chambers. The outer gear is fixed and the internal gear is axially moveable with respect thereto. The inner gear and the upper mandrel move in response to changing pressures in the casing, allowing the motor to vary displacement and the pump to vary its output based on supplied fluid pressure or based on the speed of the prime mover. An external configuration includes a pair of meshing gears mounted on separate shafts in a casing. One gear is fixed and the other is axially moveable with respect thereto and moves in response to changing pressures in the casing. Each of the gears is sealed by a seal/bushing on a free end thereof.

    摘要翻译： 可变容积泵/马达具有设置在上心轴和下心轴之间的啮合内齿轮组和外齿轮组，每个齿轮组包括朝向齿轮延伸的凸缘，以将泵/马达室分成吸入和排出腔。 外齿轮是固定的，并且内齿轮相对于其可轴向移动。 内齿轮和上心轴响应于壳体中变化的压力而移动，允许马达改变位移，并且泵基于所提供的流体压力或基于原动机的速度来改变其输出。 外部构造包括一对啮合齿轮，其安装在壳体中的分离的轴上。 一个齿轮是固定的，另一个齿轮相对于其轴向移动并响应于壳体中的变化的压力移动。 每个齿轮在其自由端上由密封件/衬套密封。

    Heat pump
    9.
    发明授权
    Heat pump 有权

    公开(公告)号：US11725857B1

    公开(公告)日：2023-08-15

    申请号：US17588346

    申请日：2022-01-31

    申请人： James O'Brien ,  Stanislaus Anthony Horvat

    发明人： James O'Brien ,  Stanislaus Anthony Horvat

    IPC分类号： F25B39/02 ,  F25B13/00

    CPC分类号： F25B39/02 ,  F25B13/00

    摘要： A system for a heat pump that allows the heat pump to work efficiently in extreme cold weathers. The system includes an evaporator influid communication with an expansion valve, the expansion valve can receive a liquid refrigerant from a condenser of the heat pump. The evaporator contains a pool of liquid refrigerant and an electric resistance heating source dipped in the pool of liquid refrigerant. The electric resistance heating source can heat the liquid refrigerant of the pool to generate vapors and thus maintaining a desired pressure within the heat pump.

    METHOD AND APPARATUS FOR IMPROVED WAFER SINGULATION
    10.
    发明申请
    METHOD AND APPARATUS FOR IMPROVED WAFER SINGULATION 审中-公开
    改进方法和装置调整方法

    公开(公告)号：US20110287607A1

    公开(公告)日：2011-11-24

    申请号：US13076238

    申请日：2011-03-30

    申请人： Yasu Osako ,  Bong Cho ,  Daragh Finn ,  Andrew Hooper ,  James O'Brien

    发明人： Yasu Osako ,  Bong Cho ,  Daragh Finn ,  Andrew Hooper ,  James O'Brien

    IPC分类号： H01L21/78 ,  B23K26/00

    CPC分类号： B23K26/364 ,  B23K26/0608 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/67092

    摘要： Laser singulation of electronic devices from semiconductor substrates including wafers is performed using up to 3 lasers from 2 wavelength ranges. Using up to 3 lasers from 2 wavelength ranges permits laser singulation of wafers held by die attach film while avoiding problems caused by single-wavelength dicing. In particular, using up to 3 lasers from 2 wavelength ranges permits efficient dicing of semiconductor wafers while avoiding debris and thermal problems associated with laser processing die attach tape.

    摘要翻译： 使用来自2个波长范围的3个激光器来执行包括晶片的半导体基板的电子器件的激光切割。 使用2个波长范围的多达3个激光器可以激光切割由芯片附着膜保持的晶片，同时避免单波长切割引起的问题。 特别地，使用2个波长范围的多达3个激光器可以有效切割半导体晶片，同时避免与激光加工芯片附着带相关的碎片和热问题。