发明申请
US20100248451A1 Method for Laser Singulation of Chip Scale Packages on Glass Substrates
失效
玻璃基板上芯片尺寸封装的激光切割方法
- 专利标题： Method for Laser Singulation of Chip Scale Packages on Glass Substrates
- 专利标题（中）： 玻璃基板上芯片尺寸封装的激光切割方法
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申请号： US12413068申请日： 2009-03-27
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公开(公告)号： US20100248451A1公开(公告)日： 2010-09-30
- 发明人: Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
- 申请人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
- 申请人地址： US OR Portland
- 专利权人： Electro Sceintific Industries, Inc.
- 当前专利权人： Electro Sceintific Industries, Inc.
- 当前专利权人地址： US OR Portland
- 主分类号： H01L21/78
- IPC分类号： H01L21/78
摘要：
An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
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