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公开(公告)号：US20170288330A1
公开(公告)日：2017-10-05
申请号：US15084682
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Anthony P. Valpiani , Jonathon Robert Carstens
Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.
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公开(公告)号：US10260961B2
公开(公告)日：2019-04-16
申请号：US14975938
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Shelby Ferguson , Rashelle Yee , Russell S. Aoki , Michael Hui , Jonathon Robert Carstens , Joseph J. Jasniewski
IPC: G01K7/00 , G01K1/00 , G01K7/16 , H01L23/34 , H01L23/00 , H01L23/31 , H01L23/473 , H01L25/065
Abstract: Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.
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公开(公告)号：US20170181271A1
公开(公告)日：2017-06-22
申请号：US14975941
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Rashelle Yee , Russell S. Aoki , Shelby Ferguson , Michael Hui , Jonathon Robert Carstens , Joseph J. Jasniewski , Kevin J. Ceurter
CPC classification number: H05K1/0271 , B23K1/0016 , B23K2101/42 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L2224/16225 , H01L2924/15311 , H05B1/0233 , H05K1/0212 , H05K1/141 , H05K2201/041 , H05K2201/10378
Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.
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公开(公告)号：US09825387B2
公开(公告)日：2017-11-21
申请号：US15084726
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Jonathon Robert Carstens
IPC: H01R13/62 , H01R12/75 , H01R12/70 , H01R13/639
CPC classification number: H01R12/75 , H01R12/7023 , H01R12/774 , H01R13/639
Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.
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Patent Agency Ranking
公开(公告)号：US20170178994A1
公开(公告)日：2017-06-22
申请号：US14975943
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Michael Hui , Rashelle Yee , Jonathan Thibado , Daniel P. Carter , Shelby Ferguson , Anthony P. Valpiani , Russell S. Aoki , Jonathon Robert Carstens , Joseph J. Jasniewski , Harvey R. Kofstad , Michael Brazel , Tracy Clack , Viktor Vogman , Penny Woodcock , Kevin J. Ceurter , Hongfei Yan
IPC: H01L23/34 , H01L21/48 , H01L23/498
CPC classification number: H01L23/345 , H01L21/4853 , H01L21/4871 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/50 , H01L23/5385 , H01L23/5386 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0655 , H01L2223/6677 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/81193 , H01L2224/81234 , H01L2224/81815 , H01L2224/81908 , H01L2224/92125 , H01L2924/00014 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/1579 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2224/45099 , H01L2924/00
Abstract: Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled to the first heater trace in the IC package support structure.
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公开(公告)号：US10680367B2
公开(公告)日：2020-06-09
申请号：US15084682
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Anthony P. Valpiani , Jonathon Robert Carstens
IPC: H01R12/75 , H01R12/77 , H01R13/62 , H01R13/639 , H01R12/70
Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.
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公开(公告)号：US10178763B2
公开(公告)日：2019-01-08
申请号：US14975941
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Rashelle Yee , Russell S. Aoki , Shelby Ferguson , Michael Hui , Jonathon Robert Carstens , Joseph J. Jasniewski , Kevin J. Ceurter
IPC: H05K1/02 , H01L23/498 , H05B1/02 , B23K1/00 , H05K1/14 , B23K101/42
Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.
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公开(公告)号：US20170288331A1
公开(公告)日：2017-10-05
申请号：US15084726
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Jonathon Robert Carstens
CPC classification number: H01R12/75 , H01R12/7023 , H01R12/774 , H01R13/639
Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.
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公开(公告)号：US20170176260A1
公开(公告)日：2017-06-22
申请号：US14975938
申请日：2015-12-21
Applicant: INTEL CORPORATION
Inventor： Shelby Ferguson , Rashelle Yee , Russell S. Aoki , Michael Hui , Jonathon Robert Carstens , Joseph J. Jasniewski
CPC classification number: G01K7/16 , H01L23/3128 , H01L23/34 , H01L23/345 , H01L23/473 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0655 , H01L2223/6677 , H01L2224/0401 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/81139 , H01L2224/81193 , H01L2224/81234 , H01L2224/81815 , H01L2224/81908 , H01L2224/92125 , H01L2924/00014 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/1579 , H01L2924/16251 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/014 , H01L2224/45099
Abstract: Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.
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