- 专利标题： INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
-
申请号： US14975943申请日： 2015-12-21
-
公开(公告)号： US20170178994A1公开(公告)日： 2017-06-22
- 发明人: Michael Hui , Rashelle Yee , Jonathan Thibado , Daniel P. Carter , Shelby Ferguson , Anthony P. Valpiani , Russell S. Aoki , Jonathon Robert Carstens , Joseph J. Jasniewski , Harvey R. Kofstad , Michael Brazel , Tracy Clack , Viktor Vogman , Penny Woodcock , Kevin J. Ceurter , Hongfei Yan
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/48 ; H01L23/498
摘要：
Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled to the first heater trace in the IC package support structure.
信息查询
IPC分类:
