公开(公告)号：US20170178994A1

公开(公告)日：2017-06-22

申请号：US14975943

申请日：2015-12-21

申请人： Intel Corporation

发明人： Michael Hui ,  Rashelle Yee ,  Jonathan Thibado ,  Daniel P. Carter ,  Shelby Ferguson ,  Anthony P. Valpiani ,  Russell S. Aoki ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Harvey R. Kofstad ,  Michael Brazel ,  Tracy Clack ,  Viktor Vogman ,  Penny Woodcock ,  Kevin J. Ceurter ,  Hongfei Yan

IPC分类号： H01L23/34 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/345 ,  H01L21/4853 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00

摘要： Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled to the first heater trace in the IC package support structure.

公开(公告)号：US10481643B2

公开(公告)日：2019-11-19

申请号：US15689404

申请日：2017-08-29

申请人： Intel Corporation

发明人： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC分类号： G06F1/16

摘要： Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US20200218314A1

公开(公告)日：2020-07-09

申请号：US16683814

申请日：2019-11-14

申请人： Intel Corporation

发明人： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC分类号： G06F1/16

摘要： Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US10178763B2

公开(公告)日：2019-01-08

申请号：US14975941

申请日：2015-12-21

申请人： Intel Corporation

发明人： Rashelle Yee ,  Russell S. Aoki ,  Shelby Ferguson ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Kevin J. Ceurter

IPC分类号： H05K1/02 ,  H01L23/498 ,  H05B1/02 ,  B23K1/00 ,  H05K1/14 ,  B23K101/42

摘要： Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

公开(公告)号：US09766661B2

公开(公告)日：2017-09-19

申请号：US14126242

申请日：2013-07-30

申请人： Intel Corporation

发明人： Michael Hui ,  Russell Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC分类号： G06F1/16

CPC分类号： G06F1/1654 ,  G06F1/1643 ,  G06F1/166 ,  G06F1/1683

摘要： Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US20170176260A1

公开(公告)日：2017-06-22

申请号：US14975938

申请日：2015-12-21

申请人： INTEL CORPORATION

发明人： Shelby Ferguson ,  Rashelle Yee ,  Russell S. Aoki ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski

IPC分类号： G01K7/16 ,  H01L23/34

CPC分类号： G01K7/16 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/345 ,  H01L23/473 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2224/45099

摘要： Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.

公开(公告)号：US10260961B2

公开(公告)日：2019-04-16

申请号：US14975938

申请日：2015-12-21

申请人： Intel Corporation

发明人： Shelby Ferguson ,  Rashelle Yee ,  Russell S. Aoki ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski

IPC分类号： G01K7/00 ,  G01K1/00 ,  G01K7/16 ,  H01L23/34 ,  H01L23/00 ,  H01L23/31 ,  H01L23/473 ,  H01L25/065

摘要： Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.

公开(公告)号：US20180210506A1

公开(公告)日：2018-07-26

申请号：US15689404

申请日：2017-08-29

申请人： Intel Corporation

发明人： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC分类号： G06F1/16

CPC分类号： G06F1/1654 ,  G06F1/1643 ,  G06F1/166 ,  G06F1/1683

摘要： Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US20170181271A1

公开(公告)日：2017-06-22

申请号：US14975941

申请日：2015-12-21

申请人： Intel Corporation

发明人： Rashelle Yee ,  Russell S. Aoki ,  Shelby Ferguson ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Kevin J. Ceurter

IPC分类号： H05K1/02 ,  H01L23/498 ,  G06F1/16 ,  B23K1/00 ,  B23K31/02 ,  H05K1/14 ,  H05B1/02

CPC分类号： H05K1/0271 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05B1/0233 ,  H05K1/0212 ,  H05K1/141 ,  H05K2201/041 ,  H05K2201/10378

摘要： Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

公开(公告)号：US09348363B2

公开(公告)日：2016-05-24

申请号：US14142826

申请日：2013-12-28

申请人： Intel Corporation

发明人： Michael Hui ,  Russell Aoki ,  Anthony Valpiani ,  Ralph Miele

IPC分类号： G06F1/16 ,  F16L3/00 ,  A47F5/00

CPC分类号： G06F1/1624 ,  G06F1/1616 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/1633 ,  G06F1/1654 ,  G06F1/1656

摘要： A computer assembly comprising a computer assembly base for the computer assembly, a rotatable display screen support coupled to the computer assembly base configured to receive a display screen and an base stabilizer of the computer assembly base configured to extend from a back side of the computer assembly base, wherein upon extension is configured to provide counterbalance support to the computer assembly base to inhibit tipping.

摘要翻译： 一种计算机组件，包括用于计算机组件的计算机组件基座，可旋转的显示屏幕支撑件，其联接到被配置为接收显示屏幕的计算机组件基座和计算机组件基座的基座稳定器， 底座，其中在延伸部被构造成为计算机组件基座提供平衡支撑以抑制倾翻。