公开(公告)号：US5597644A

公开(公告)日：1997-01-28

申请号：US555402

申请日：1995-11-09

申请人： Hideaki Araki ,  Junzo Fukuta ,  Masashi Fukaya

发明人： Hideaki Araki ,  Junzo Fukuta ,  Masashi Fukaya

IPC分类号： C03C17/02 ,  G01R33/09 ,  G11B5/31 ,  G11B5/39 ,  H01F10/26 ,  H01F41/16 ,  H01L21/48 ,  H01L23/12 ,  H01L23/13 ,  H01L43/06 ,  H05K1/03 ,  H05K3/12 ,  B32B9/00

CPC分类号： B82Y25/00 ,  C03C17/02 ,  G01R33/093 ,  G11B5/3903 ,  H01F10/26 ,  H01F41/16 ,  H01L21/4807 ,  H01L23/13 ,  H01L24/24 ,  H05K1/0306 ,  G11B5/3103 ,  G11B5/3113 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3511 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A ceramic circuit board comprises a ceramic substrate having a glaze film formed thereon, the glaze film being overlaid with a functional thin film such as a ferromagnetic film serving as a magnetic sensor, for example. The ceramic substrate is made of a low-firing ceramic material such as a glass ceramic material which can be sintered at a temperature below 1000.degree. C. by co-firing with the glaze film. Preferably, the ceramic substrate has a recess on its top surface, and the glaze film is embedded in the recess such that the difference in level between the ceramic substrate and the glaze film is 20 .mu.m or less. The ceramic circuit board can be produced by preparing a plurality of ceramic green sheets from a low-firing ceramic material, laminating the ceramic green sheets after a through-hole or indentation is formed in the uppermost sheet, thereby forming a multilayer ceramic green substrate having a recess on its top surface, filling the recess with a glaze-forming glass material to such a height that the difference in level between the ceramic substrate and the glaze film formed after firing is 20 .mu.m or less, and co-firing the ceramic green substrate and the glaze-forming glass material at a temperature below 1000.degree. C.

摘要翻译： 陶瓷电路板包括具有形成在其上的釉膜的陶瓷基板，该釉膜覆盖有功能薄膜，例如用作磁性传感器的铁磁膜。 陶瓷基板由低烧陶瓷材料制成，例如玻璃陶瓷材料，可通过与釉膜共烧而在低于1000℃的温度下烧结。 优选地，陶瓷基板在其顶表面上具有凹部，并且将釉膜嵌入凹部中，使得陶瓷基板和釉膜之间的水平差为20μm以下。 陶瓷电路板可以通过从低烧陶瓷材料制备多个陶瓷生片，在最上面的片材中形成通孔或压痕之后层叠陶瓷生片，从而形成多层陶瓷生坯基板，该多层陶瓷生坯基板具有 在其顶表面上的凹部，用釉料形成的玻璃材料填充凹部到陶瓷基板和烧制后形成的釉膜之间的水平差为20μm以下的高度，并共烧烧陶瓷 绿色基材和釉料形成玻璃材料，温度低于1000℃

公开(公告)号：US5879788A

公开(公告)日：1999-03-09

申请号：US816032

申请日：1997-03-11

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H05K1/09 ,  H01B1/00 ,  H01B1/22 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B7/00

CPC分类号： H01L23/49883 ,  H05K3/4061 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K3/245 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A low-temperature fired ceramic circuit substrate fired at a temperature ranging between 800.degree. and 1,000.degree. C. includes a plurality of insulating layers each formed of a low-temperature fired ceramic, an Ag conductor layer formed internally of the substrate, an Au conductor layer formed on a surface of the substrate, and an Ag-Pd layer formed between the Ag and the Au conductor layers, the Ag-Pd layer being composed of 100 parts metal composition consisting of 70 to 95 parts Ag and 5 to 30 part Pd by weight, and 2 to 10 parts lead borosilicate glass by weight. As the result of the above composition of the ceramic circuit substrate, its fabrication process can be simplified, and a defect rate in a connection between the Ag and Au layers after repeated firing is rendered approximately zero, which ensures high reliability for the connection.

摘要翻译： 在800〜1000℃的温度范围内烧制的低温烧制陶瓷电路基板包括多个绝缘层，各绝缘层由低温烧制陶瓷，由衬底内部形成的Ag导体层，Au导体 在Ag和Au导体层之间形成的Ag-Pd层，Ag-Pd层由100份由70〜95份Ag和5〜30份Pd组成的金属组合物构成， 和2至10重量份的硼硅酸铅玻璃。 作为陶瓷电路基板的上述组成的结果，可以简化其制造工艺，并且在反复烧制之后Ag和Au层之间的连接中的缺陷率大致为零，这确保了连接的高可靠性。

公开(公告)号：US5456778A

公开(公告)日：1995-10-10

申请号：US109040

申请日：1993-08-17

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H01L21/48 ,  H05K1/00

CPC分类号： H01L21/4867 ,  H01L21/486 ,  Y10T29/49155 ,  Y10T29/49158

摘要： A ceramic circuit substrate is fabricated by preparing ceramic greensheets for the fabrication of the ceramic circuit substrate, and unsintered ceramic sheets unsinterable at a sintering temperature of said ceramic greensheets, forming via holes in said ceramic greensheets and filling the via holes with via hole conductor paste, printing conductive patterns on the ceramic greensheets, stacking and laminating the ceramic greensheets to prepare a laminated body, placing said unsintered ceramic sheets on the uppermost layer and-on the lowermost layer of the laminated body, bonding the sheets together by thermocompression to prepare a compressed body, firing the compressed body at the sintering temperature of ceramic greensheets, and removing the unsintered ceramic greensheets, wherein said via hole conductors are only in connection with the conductive patterns at the upper and/or lower ends of each via hole conductor.

摘要翻译： 通过制备用于制造陶瓷电路基板的陶瓷片材和在所述陶瓷片材的烧结温度下不可烧结的未烧结的陶瓷片来制造陶瓷电路基板，在所述陶瓷片材中形成通孔并用通孔导体膏填充通孔 在陶瓷刮板上印刷导电图案，堆叠和层叠陶瓷刮板以制备层压体，将未烧结的陶瓷片放置在层压体的最上层和最下层上，通过热压将片材粘合在一起，以制备 压缩体，在陶瓷刮板的烧结温度下烧制压缩体，除去未烧结的陶瓷刮板，其中所述通孔导体仅与每个通孔导体的上端和/或下端处的导电图案相连。

公开(公告)号：US5665459A

公开(公告)日：1997-09-09

申请号：US606798

申请日：1996-02-26

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H05K1/09 ,  H01B1/00 ,  H01B1/22 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC分类号： H01L23/49883 ,  H05K3/4061 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K3/245 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A low-temperature fired ceramic circuit substrate fired at a temperature ranging between 800.degree. and 1,000.degree. C. includes a plurality of insulating layers each formed of a low-temperature fired ceramic, an Ag conductor layer formed internally of the substrate, an Au conductor layer formed on a surface of the substrate, and an Ag--Pd layer formed between the Ag and the Au conductor layers, the Ag--Pd layer being composed of 100 parts metal composition consisting of 70 to 95 parts Ag and 5 to 30 part Pd by weight, and 2 to 10 parts lead borosilicate glass by weight. As the result of the above composition of the ceramic circuit substrate, its fabrication process can be simplified, and a defect rate in a connection between the Ag and Au layers after repeated firing is rendered approximately zero, which ensures high reliability for the connection.

摘要翻译： 在800〜1000℃的温度范围内烧制的低温烧制陶瓷电路基板包括多个绝缘层，各绝缘层由低温烧制陶瓷，由衬底内部形成的Ag导体层，Au导体 在Ag和Au导体层之间形成的Ag-Pd层，Ag-Pd层由100份由70〜95份Ag和5〜30份Pd组成的金属组合物构成， 和2至10重量份的硼硅酸铅玻璃。 作为陶瓷电路基板的上述组成的结果，可以简化其制造工艺，并且在重复点火之后Ag和Au层之间的连接中的缺陷率大致为零，这确保了连接的高可靠性。

公开(公告)号：US5470412A

公开(公告)日：1995-11-28

申请号：US97120

申请日：1993-07-27

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/46 ,  B32B31/04 ,  B32B31/20 ,  B32B31/26 ,  C04B33/32

CPC分类号： H05K3/207 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/016 ,  H05K3/4611 ,  H05K3/4629

摘要： A process for producing circuit substrate is prepared by preparing at least one ceramic greensheet containing glass and sinterable at a low temperature for forming the circuit substrate, and at least one unsintered transfer sheet unsinterable at a sintering temperature of the ceramic greensheet, printing a wiring pattern on the unsintered transfer sheet, stacking the unsintered transfer sheet on the ceramic greensheet to form a laminated body and thermocompressing the laminated body to form a compressed body, firing the compressed body at a sintering temperature of the ceramic greensheet to form a ceramic substrate, thereby preparing a fired body by transferring the wiring pattern on the unsintered transfer sheet to the ceramic substrate, and removing the unsintered transfer sheet from the fired body to prepare a circuit substrate.

摘要翻译： 制备电路基板的方法是通过制备至少一种含有玻璃的陶瓷毛坯，并在低温下烧结以形成电路基板，以及至少一种未烧结的转印片，其在陶瓷毛坯的烧结温度下不能反应，印刷布线图案 在未烧结的转印片上，将未烧结的转印片层叠在陶瓷毛坯上，形成层叠体，热压层叠体，形成压缩体，在陶瓷毛坯的烧结温度下烧成压缩体，形成陶瓷基板 通过将未烧结的转印片上的布线图案转印到陶瓷基片上，从烧结体除去未烧结的转印片，制备电路基板。

公开(公告)号：US5855711A

公开(公告)日：1999-01-05

申请号：US824095

申请日：1997-03-25

申请人： Hideaki Araki ,  Masashi Fukaya

发明人： Hideaki Araki ,  Masashi Fukaya

IPC分类号： C04B41/80 ,  C04B35/111 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K3/12 ,  H05K3/38 ,  H05K3/46 ,  B32B31/26

CPC分类号： H01L23/5383 ,  C04B35/111 ,  H01L23/49894 ,  H05K1/0306 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629 ,  H05K3/4676 ,  Y10T29/49163

摘要： A ceramic circuit substrate providing a circuit pattern with a fine line as well as high accuracy for positioning the circuit pattern and a method of producing the ceramic circuit substrate. An alumina layer that is green containing an alumina that is not sintered at a temperature ranging from 800.degree. to 1000.degree. C. is applied on a surface of a ceramic green sheet containing glass and then fired at a temperature ranging from 800.degree. to 1000.degree. C. The ceramic green sheet is sintered into a sintered ceramic substrate. A porous alumina layer is formed on a surface of the sintered ceramic substrate. The glass contained in the sintered ceramic substrate is caused to flow to the inside of the porous alumina layer so that the part of the porous alumina layer filled with the glass is bonded to the sintered ceramic substrate. The part of the porous alumina layer not filled with the glass is removed, wherein the porous alumina layer remaining on the sintered ceramic substrate after the removing has a thickness of 10 .mu.m or less. A paste for forming the circuit pattern is printed on a surface of the part of the porous alumina layer that has been bonded to the sintered ceramic substrate for heating.

摘要翻译： 提供具有细线的电路图案以及用于定位电路图案的高精度的陶瓷电路基板和制造陶瓷电路基板的方法。 在含有玻璃的陶瓷生片的表面上涂布绿色的含有不在800〜1000℃温度下烧结的氧化铝的氧化铝层，然后在800〜1000℃的温度下烧成。 将陶瓷生片烧结成烧结陶瓷基片。 在烧结陶瓷基板的表面上形成多孔氧化铝层。 使包含在烧结陶瓷基板中的玻璃流到多孔氧化铝层的内部，使得填充有玻璃的多孔氧化铝层的一部分结合到烧结陶瓷基板。 未填充玻璃的多孔氧化铝层的一部分被除去，除去后残留在烧结陶瓷基板上的多孔氧化铝层的厚度为10μm以下。 用于形成电路图案的糊料印刷在已经结合到烧结陶瓷基板上以加热的多孔氧化铝层的一部分的表面上。

公开(公告)号：US06544654B1

公开(公告)日：2003-04-08

申请号：US09697150

申请日：2000-10-27

申请人： Masashi Fukaya ,  Koji Shibata ,  Chiaki Higuchi ,  Yoshinobu Watanabe

发明人： Masashi Fukaya ,  Koji Shibata ,  Chiaki Higuchi ,  Yoshinobu Watanabe

IPC分类号： B32B1504

CPC分类号： C03C3/089 ,  C03C3/091 ,  H01C7/003 ,  H01C17/06533

摘要： A thick-film resistor contains RuO2 and an SiO2—B2O3—K2O glass having a composition of 60 wt %≦SiO2≦85 wt %, 15 wt %≦B2O3≦40 wt %, 0.1 wt %≦K2O≦10 wt %, and impurity ≦3 wt %. A ceramic circuit board includes a thick-film resistor printed on it, the thick-film resistor containing RuO2 and an SiO2—B2O3—K2O glass having the above composition.

摘要翻译： 厚膜电阻器包含RuO 2和SiO 2-B 2 O 3 -K 2 O玻璃，其组成为60重量％<= SiO 2 = 85重量％，15重量％≤B2 O 3≤40重量％，0.1重量％K 2 O = = 10重量％，杂质<= 3重量％。 陶瓷电路板包括印刷在其上的厚膜电阻器，含有RuO 2的厚膜电阻器和具有上述组成的SiO 2 -B 2 O 3 -K 2 O玻璃。

公开(公告)号：US6037045A

公开(公告)日：2000-03-14

申请号：US980179

申请日：1997-11-26

申请人： Masashi Fukaya

发明人： Masashi Fukaya

IPC分类号： H05K1/16 ,  C03C8/14 ,  C03C17/34 ,  H01C7/00 ,  H01C17/065 ,  H01L23/498 ,  B32B9/00

CPC分类号： C03C8/14 ,  C03C17/3411 ,  H01C17/06533 ,  H01C17/0654 ,  H01C7/003 ,  H01L23/49883 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T428/24926

摘要： A ceramic circuit element comprising a ceramic substrate having co-fired resistor and glass overcoat thereon in which the resistor is formed from a resistor paste consisting essentially of RuO.sub.2 powder, glass powder and a vehicle comprising an organic polymer and a solvent, the RuO.sub.2 powder and the glass powder having specific surface areas of 10 to 20 m.sup.2 /g and 4 to 14 m.sup.2 /g, respectively; the glass overcoat is formed from a glass overcoat paste consisting essentially of a glass composition and a vehicle comprising an organic polymer and a solvent, the glass composition having a specific surface area of 2 to 6 m.sup.2 /g; and the ceramic circuit substrate comprises a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 system or MgO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 system glass and alumina. The use of the foregoing resistor and glass overcoat pastes minimizes the bubbles remaining in the resistor and realizes the exertion of resistance performance ensuring excellent weather resistance and stability, even after the resistor is subjected to trimming.

摘要翻译： 一种陶瓷电路元件，包括具有共烧电阻器和玻璃外涂层的陶瓷基板，其中电阻器由基本上由RuO 2粉末，玻璃粉末和包含有机聚合物和溶剂的载体组成的电阻浆料形成，RuO 2粉末和 比表面积分别为10〜20m2 / g和4〜14m2 / g的玻璃粉末; 玻璃外涂层由玻璃组合物和包含有机聚合物和溶剂的载体组成的玻璃外涂糊形成，该玻璃组合物的比表面积为2-6m2 / g; 陶瓷电路基板包括CaO-Al2O3-SiO2-B2O3体系或MgO-Al2O3-SiO2-B2O3系玻璃和氧化铝。 使用上述电阻器和玻璃外涂层糊剂使得电阻中剩余的气泡最小化，并且实现了电阻性能的发挥，确保了优异的耐候性和稳定性，即使在电阻器进行修整之后。

公开(公告)号：US4650923A

公开(公告)日：1987-03-17

申请号：US740184

申请日：1985-05-31

申请人： Susumu Nishigaki ,  Junzo Fukuda ,  Masashi Fukaya ,  Shinsuke Yano

发明人： Susumu Nishigaki ,  Junzo Fukuda ,  Masashi Fukaya ,  Shinsuke Yano

IPC分类号： C04B35/111 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03

CPC分类号： H01L23/5383 ,  C04B35/111 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49866 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/15192

摘要： In an article comprising a ceramic body fired at a comparatively low temperature and a circuit pattern attached to the body, the ceramic body is produced from a preselected composition comprising first powder of alumina and second powder of a vitreous material which comprises any one of MgO-Al.sub.2 O.sub.3 -SiO.sub.2, CaO-MgO-Al.sub.2 O.sub.3 -SiO.sub.2, CaO-Al.sub.2 O.sub.3 -SiO.sub.2 glass, CaO-Al.sub.2 O.sub.3 -SiO.sub.2 -B.sub.2 O.sub.3 glass, MgO-Al.sub.2 O.sub.3 -SiO.sub.2 -B.sub.2 O.sub.3 glass, and CaO-MgO-Al.sub.2 O.sub.3 SiO.sub.2 -B.sub.2 O.sub.3 glass. The ceramic body comprises coexistence of an alumina part, a noncrystallized part, and a crystallized part and exhibits an excellent moisture proof. The circuit pattern comprises an internal conductive pattern of Ag and an external conductive pattern of an alloy of Ag-Pd. A chromium component may be included in the internal and the external conductive patterns. External and internal resistor patterns are placed on and within the ceramic body with a high and a low precision. The internal resistor pattern can be adjusted by the use of a laser beam through a thin film included in the ceramic body.

摘要翻译： 在包含在较低温度下烧结的陶瓷体和附着在本体上的电路图案的制品中，陶瓷体由包含氧化铝的第一粉末和玻璃质材料的第二粉末的预选组合物制成，所述第二粉末包括MgO- Al2O3-SiO2，CaO-MgO-Al2O3-SiO2，CaO-Al2O3-SiO2玻璃，CaO-Al2O3-SiO2-B2O3玻璃，MgO-Al2O3-SiO2-B2O3玻璃，CaO-MgO-Al2O3SiO2-B2O3玻璃。 陶瓷体包括氧化铝部分，非结晶部分和结晶部分的共存，并且表现出优异的防湿性。 电路图案包括Ag的内部导电图案和Ag-Pd合金的外部导电图案。 内部和外部导电图案中可以包含铬成分。 外部和内部电阻器图案以高精度和低精度放置在陶瓷体内部和内部。 可以通过使用激光束通过陶瓷体中包含的薄膜来调节内部电阻器图案。

公开(公告)号：US08776565B2

公开(公告)日：2014-07-15

申请号：US13036223

申请日：2011-02-28

申请人： Hisamitu Hatou ,  Noboru Saitou ,  Kouichi Kurosawa ,  Fujio Yoshikubo ,  Yuji Matsui ,  Masashi Fukaya

发明人： Hisamitu Hatou ,  Noboru Saitou ,  Kouichi Kurosawa ,  Fujio Yoshikubo ,  Yuji Matsui ,  Masashi Fukaya

IPC分类号： C21D7/06

CPC分类号： B23P9/04 ,  C21D1/54 ,  C21D7/04 ,  C21D7/06

摘要： An evaluation method of residual stress in water jet peening includes a step of creating an analytical model including meshes according to a water jet peening (WJP) object, the shape of a nozzle, and an injection distance, a step of inputting WJP execution conditions, a step of calculating the internal pressure pBi of a cavitation bubble and a bubble number density ngi through jet flow analysis for a jet flow jetting from the nozzle, a step of calculating cavitation energy according to the internal pressure pBi of a cavitation bubble and a bubble number density ngi (S4), a step of calculating the burst energy of cavitation bubbles from the cavitation energy C, and a step of calculating the compressive residual stress of the WJP object from the collapse pressure of cavitation bubbles. Accordingly, the residual stress of the WJP object can be evaluated precisely in a shorter time.

摘要翻译： 水喷射喷丸硬化的残余应力的评价方法包括：创建包括水喷射喷丸（WJP）对象的网孔，喷嘴形状和喷射距离的分析模型的步骤，输入WJP执行条件的步骤， 通过从喷嘴喷射的喷射流的喷射流分析来计算空化气泡的内部压力pBi和气泡数密度ngi的步骤，根据空化气泡和气泡的内部压力pBi计算空化能量的步骤 数值密度ngi（S4），从空化能量C计算空化气泡的爆发能量的步骤，以及从空化气泡的塌陷压力计算WJP物体的压缩残余应力的步骤。 因此，可以在更短的时间内精确地评估WJP物体的残余应力。