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    Process for producing a circuit substrate
    2.
    发明授权
    Process for producing a circuit substrate 失效
    电路基板的制造方法

    公开(公告)号：US5470412A

    公开(公告)日：1995-11-28

    申请号：US97120

    申请日：1993-07-27

    申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

    发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

    IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/46 ,  B32B31/04 ,  B32B31/20 ,  B32B31/26 ,  C04B33/32

    CPC分类号： H05K3/207 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/016 ,  H05K3/4611 ,  H05K3/4629

    摘要： A process for producing circuit substrate is prepared by preparing at least one ceramic greensheet containing glass and sinterable at a low temperature for forming the circuit substrate, and at least one unsintered transfer sheet unsinterable at a sintering temperature of the ceramic greensheet, printing a wiring pattern on the unsintered transfer sheet, stacking the unsintered transfer sheet on the ceramic greensheet to form a laminated body and thermocompressing the laminated body to form a compressed body, firing the compressed body at a sintering temperature of the ceramic greensheet to form a ceramic substrate, thereby preparing a fired body by transferring the wiring pattern on the unsintered transfer sheet to the ceramic substrate, and removing the unsintered transfer sheet from the fired body to prepare a circuit substrate.

    摘要翻译： 制备电路基板的方法是通过制备至少一种含有玻璃的陶瓷毛坯，并在低温下烧结以形成电路基板，以及至少一种未烧结的转印片，其在陶瓷毛坯的烧结温度下不能反应，印刷布线图案 在未烧结的转印片上，将未烧结的转印片层叠在陶瓷毛坯上，形成层叠体，热压层叠体，形成压缩体，在陶瓷毛坯的烧结温度下烧成压缩体，形成陶瓷基板 通过将未烧结的转印片上的布线图案转印到陶瓷基片上，从烧结体除去未烧结的转印片，制备电路基板。

    Method of producing a ceramic circuit substrate
    3.
    发明授权
    Method of producing a ceramic circuit substrate 失效
    陶瓷电路基板的制造方法

    公开(公告)号：US5855711A

    公开(公告)日：1999-01-05

    申请号：US824095

    申请日：1997-03-25

    申请人： Hideaki Araki ,  Masashi Fukaya

    发明人： Hideaki Araki ,  Masashi Fukaya

    IPC分类号： C04B41/80 ,  C04B35/111 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K3/12 ,  H05K3/38 ,  H05K3/46 ,  B32B31/26

    CPC分类号： H01L23/5383 ,  C04B35/111 ,  H01L23/49894 ,  H05K1/0306 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629 ,  H05K3/4676 ,  Y10T29/49163

    摘要： A ceramic circuit substrate providing a circuit pattern with a fine line as well as high accuracy for positioning the circuit pattern and a method of producing the ceramic circuit substrate. An alumina layer that is green containing an alumina that is not sintered at a temperature ranging from 800.degree. to 1000.degree. C. is applied on a surface of a ceramic green sheet containing glass and then fired at a temperature ranging from 800.degree. to 1000.degree. C. The ceramic green sheet is sintered into a sintered ceramic substrate. A porous alumina layer is formed on a surface of the sintered ceramic substrate. The glass contained in the sintered ceramic substrate is caused to flow to the inside of the porous alumina layer so that the part of the porous alumina layer filled with the glass is bonded to the sintered ceramic substrate. The part of the porous alumina layer not filled with the glass is removed, wherein the porous alumina layer remaining on the sintered ceramic substrate after the removing has a thickness of 10 .mu.m or less. A paste for forming the circuit pattern is printed on a surface of the part of the porous alumina layer that has been bonded to the sintered ceramic substrate for heating.

    摘要翻译： 提供具有细线的电路图案以及用于定位电路图案的高精度的陶瓷电路基板和制造陶瓷电路基板的方法。 在含有玻璃的陶瓷生片的表面上涂布绿色的含有不在800〜1000℃温度下烧结的氧化铝的氧化铝层，然后在800〜1000℃的温度下烧成。 将陶瓷生片烧结成烧结陶瓷基片。 在烧结陶瓷基板的表面上形成多孔氧化铝层。 使包含在烧结陶瓷基板中的玻璃流到多孔氧化铝层的内部，使得填充有玻璃的多孔氧化铝层的一部分结合到烧结陶瓷基板。 未填充玻璃的多孔氧化铝层的一部分被除去，除去后残留在烧结陶瓷基板上的多孔氧化铝层的厚度为10μm以下。 用于形成电路图案的糊料印刷在已经结合到烧结陶瓷基板上以加热的多孔氧化铝层的一部分的表面上。

    Ceramic circuit board and process for producing same
    4.
    发明授权
    Ceramic circuit board and process for producing same 失效
    陶瓷电路板及其制造方法

    公开(公告)号：US5597644A

    公开(公告)日：1997-01-28

    申请号：US555402

    申请日：1995-11-09

    申请人： Hideaki Araki ,  Junzo Fukuta ,  Masashi Fukaya

    发明人： Hideaki Araki ,  Junzo Fukuta ,  Masashi Fukaya

    IPC分类号： C03C17/02 ,  G01R33/09 ,  G11B5/31 ,  G11B5/39 ,  H01F10/26 ,  H01F41/16 ,  H01L21/48 ,  H01L23/12 ,  H01L23/13 ,  H01L43/06 ,  H05K1/03 ,  H05K3/12 ,  B32B9/00

    CPC分类号： B82Y25/00 ,  C03C17/02 ,  G01R33/093 ,  G11B5/3903 ,  H01F10/26 ,  H01F41/16 ,  H01L21/4807 ,  H01L23/13 ,  H01L24/24 ,  H05K1/0306 ,  G11B5/3103 ,  G11B5/3113 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3511 ,  Y10T428/24917 ,  Y10T428/24926

    摘要： A ceramic circuit board comprises a ceramic substrate having a glaze film formed thereon, the glaze film being overlaid with a functional thin film such as a ferromagnetic film serving as a magnetic sensor, for example. The ceramic substrate is made of a low-firing ceramic material such as a glass ceramic material which can be sintered at a temperature below 1000.degree. C. by co-firing with the glaze film. Preferably, the ceramic substrate has a recess on its top surface, and the glaze film is embedded in the recess such that the difference in level between the ceramic substrate and the glaze film is 20 .mu.m or less. The ceramic circuit board can be produced by preparing a plurality of ceramic green sheets from a low-firing ceramic material, laminating the ceramic green sheets after a through-hole or indentation is formed in the uppermost sheet, thereby forming a multilayer ceramic green substrate having a recess on its top surface, filling the recess with a glaze-forming glass material to such a height that the difference in level between the ceramic substrate and the glaze film formed after firing is 20 .mu.m or less, and co-firing the ceramic green substrate and the glaze-forming glass material at a temperature below 1000.degree. C.

    摘要翻译： 陶瓷电路板包括具有形成在其上的釉膜的陶瓷基板，该釉膜覆盖有功能薄膜，例如用作磁性传感器的铁磁膜。 陶瓷基板由低烧陶瓷材料制成，例如玻璃陶瓷材料，可通过与釉膜共烧而在低于1000℃的温度下烧结。 优选地，陶瓷基板在其顶表面上具有凹部，并且将釉膜嵌入凹部中，使得陶瓷基板和釉膜之间的水平差为20μm以下。 陶瓷电路板可以通过从低烧陶瓷材料制备多个陶瓷生片，在最上面的片材中形成通孔或压痕之后层叠陶瓷生片，从而形成多层陶瓷生坯基板，该多层陶瓷生坯基板具有 在其顶表面上的凹部，用釉料形成的玻璃材料填充凹部到陶瓷基板和烧制后形成的釉膜之间的水平差为20μm以下的高度，并共烧烧陶瓷 绿色基材和釉料形成玻璃材料，温度低于1000℃

    Method of fabricating ceramic circuit substrate
    6.
    发明授权
    Method of fabricating ceramic circuit substrate 失效
    制造陶瓷电路基板的方法

    公开(公告)号：US5456778A

    公开(公告)日：1995-10-10

    申请号：US109040

    申请日：1993-08-17

    申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

    发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

    IPC分类号： H01L21/48 ,  H05K1/00

    CPC分类号： H01L21/4867 ,  H01L21/486 ,  Y10T29/49155 ,  Y10T29/49158

    摘要： A ceramic circuit substrate is fabricated by preparing ceramic greensheets for the fabrication of the ceramic circuit substrate, and unsintered ceramic sheets unsinterable at a sintering temperature of said ceramic greensheets, forming via holes in said ceramic greensheets and filling the via holes with via hole conductor paste, printing conductive patterns on the ceramic greensheets, stacking and laminating the ceramic greensheets to prepare a laminated body, placing said unsintered ceramic sheets on the uppermost layer and-on the lowermost layer of the laminated body, bonding the sheets together by thermocompression to prepare a compressed body, firing the compressed body at the sintering temperature of ceramic greensheets, and removing the unsintered ceramic greensheets, wherein said via hole conductors are only in connection with the conductive patterns at the upper and/or lower ends of each via hole conductor.

    摘要翻译： 通过制备用于制造陶瓷电路基板的陶瓷片材和在所述陶瓷片材的烧结温度下不可烧结的未烧结的陶瓷片来制造陶瓷电路基板，在所述陶瓷片材中形成通孔并用通孔导体膏填充通孔 在陶瓷刮板上印刷导电图案，堆叠和层叠陶瓷刮板以制备层压体，将未烧结的陶瓷片放置在层压体的最上层和最下层上，通过热压将片材粘合在一起，以制备 压缩体，在陶瓷刮板的烧结温度下烧制压缩体，除去未烧结的陶瓷刮板，其中所述通孔导体仅与每个通孔导体的上端和/或下端处的导电图案相连。

    Ceramic circuit substrate and method of fabricating the same
    9.
    发明授权
    Ceramic circuit substrate and method of fabricating the same 失效
    陶瓷电路基板及其制造方法

    公开(公告)号：US6103354A

    公开(公告)日：2000-08-15

    申请号：US934674

    申请日：1997-09-22

    申请人： Hideaki Araki ,  Kunihiko Mori

    发明人： Hideaki Araki ,  Kunihiko Mori

    IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K3/24 ,  H05K3/46 ,  B32B3/00 ,  B32B31/20 ,  B32B31/26

    CPC分类号： H01L23/538 ,  H01L21/4867 ,  H05K3/245 ,  H01L2924/0002 ,  H05K2201/0352 ,  H05K2203/1476 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/12347 ,  Y10T428/24926

    摘要： A ceramic circuit substrate includes an insulating layer fabricated of a ceramic, a first surface conductor layer fabricated on a surface of the insulating layer and embedded in the insulating layer except at least its surface, and a second surface conductor layer fabricated to be stacked on the first surface conductor layer. A method of fabricating the ceramic circuit substrate includes the steps of printing a first surface conductor layer on a surface of a ceramic green sheet forming an insulating layer, laminating the green sheet and another green sheet on which an inner conductor layer is printed, and co-firing the green sheets, thereby fabricating the first surface conductor layer on a surface of a multilayer substrate, and printing a second surface conductor layer on the first surface conductor layer so that the second surface conductor layer is stacked on the first surface conductor layer and firing the second surface conductor layer, thereby fabricating the two stacked surface conductor layers on the surface of the multilayer substrate.

    摘要翻译： 陶瓷电路基板包括由陶瓷制成的绝缘层，在绝缘层的表面上制造的第一表面导体层，并且绝缘层至少除了其表面之外，还包括第二表面导体层， 第一表面导体层。 制造陶瓷电路基板的方法包括以下步骤：在形成绝缘层的陶瓷生片的表面上印刷第一表面导体层，层叠生片和印有内导体层的另一生片， 从而在多层基板的表面上制造第一表面导体层，在第一表面导体层上印刷第二表面导体层，使第二表面导体层层叠在第一表面导体层上， 烧制第二表面导体层，从而在多层基板的表面上制造两层叠的表面导体层。