发明授权
- 专利标题： Process for producing a circuit substrate
- 专利标题（中）： 电路基板的制造方法
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申请号： US97120申请日： 1993-07-27
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公开(公告)号： US5470412A公开(公告)日： 1995-11-28
- 发明人: Junzo Fukuta , Masashi Fukaya , Hideaki Araki
- 申请人： Junzo Fukuta , Masashi Fukaya , Hideaki Araki
- 申请人地址： JPX Yamaguchi
- 专利权人： Sumitomo Metal Ceramics Inc.
- 当前专利权人： Sumitomo Metal Ceramics Inc.
- 当前专利权人地址： JPX Yamaguchi
- 优先权： JPX4-223190 19920730; JPX4-269577 19920911
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K1/03 ; H05K1/09 ; H05K3/20 ; H05K3/46 ; B32B31/04 ; B32B31/20 ; B32B31/26 ; C04B33/32
摘要：
A process for producing circuit substrate is prepared by preparing at least one ceramic greensheet containing glass and sinterable at a low temperature for forming the circuit substrate, and at least one unsintered transfer sheet unsinterable at a sintering temperature of the ceramic greensheet, printing a wiring pattern on the unsintered transfer sheet, stacking the unsintered transfer sheet on the ceramic greensheet to form a laminated body and thermocompressing the laminated body to form a compressed body, firing the compressed body at a sintering temperature of the ceramic greensheet to form a ceramic substrate, thereby preparing a fired body by transferring the wiring pattern on the unsintered transfer sheet to the ceramic substrate, and removing the unsintered transfer sheet from the fired body to prepare a circuit substrate.
公开/授权文献
- USD427845S Tray saving device 公开/授权日：2000-07-11
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