公开(公告)号：US08592997B2

公开(公告)日：2013-11-26

申请号：US12916677

申请日：2010-11-01

申请人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

发明人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

IPC分类号： H01L23/28

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/1225 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316

摘要： A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

摘要翻译： 模制底部填充倒装芯片封装可以包括印刷电路板，安装在印刷电路板上的半导体芯片和密封剂。 印刷电路板具有穿过印刷电路板的至少一个树脂通孔和印刷电路板的底表面上的至少一个树脂通道，所述至少一个树脂通道从至少一个树脂通道孔延伸通过 印刷电路板。 密封剂密封印刷电路板，半导体芯片，至少一个树脂通孔和至少一个树脂通道的顶表面。

公开(公告)号：US20110193228A1

公开(公告)日：2011-08-11

申请号：US12916677

申请日：2010-11-01

申请人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

发明人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

IPC分类号： H01L23/50

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/1225 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316

摘要： A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

摘要翻译： 模制底部填充倒装芯片封装可以包括印刷电路板，安装在印刷电路板上的半导体芯片和密封剂。 印刷电路板具有穿过印刷电路板的至少一个树脂通孔和印刷电路板的底表面上的至少一个树脂通道，所述至少一个树脂通道从至少一个树脂通道孔延伸通过 印刷电路板。 密封剂密封印刷电路板，半导体芯片，至少一个树脂通孔和至少一个树脂通道的顶表面。

公开(公告)号：US09015347B2

公开(公告)日：2015-04-21

申请号：US13438889

申请日：2012-04-04

申请人： Min-kyoung Kang ,  Sung-wook Ahn ,  Eun Namgung ,  Jong-ho Lee

发明人： Min-kyoung Kang ,  Sung-wook Ahn ,  Eun Namgung ,  Jong-ho Lee

IPC分类号： G06F15/16 ,  H04L12/58

CPC分类号： H04L51/38 ,  H04L51/066

摘要： A message to be transmitted is converted into an image file. The image file is stored and location information about a location where the image file is stored, is generated. The image file is transmitted to at least one device based on the location information.

摘要翻译： 要发送的消息被转换为图像文件。 存储图像文件，并生成有关存储图像文件的位置的位置信息。 基于位置信息将图像文件发送到至少一个设备。

公开(公告)号：US20130009286A1

公开(公告)日：2013-01-10

申请号：US13471735

申请日：2012-05-15

申请人： Young-lyong Kim ,  Jong-ho Lee ,  Moon-gi Cho ,  Hwan-sik Lim ,  Sun-hee Park

发明人： Young-lyong Kim ,  Jong-ho Lee ,  Moon-gi Cho ,  Hwan-sik Lim ,  Sun-hee Park

IPC分类号： H01L23/58

CPC分类号： H01L24/11 ,  H01L23/3128 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/02123 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05019 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05166 ,  H01L2224/0519 ,  H01L2224/05191 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/0556 ,  H01L2224/05562 ,  H01L2224/05568 ,  H01L2224/05666 ,  H01L2224/0569 ,  H01L2224/05691 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/14131 ,  H01L2224/1416 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/1435 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor chip includes stress-relief to mitigate the effects of differences in coefficients of thermal expansion (CTE) between a printed circuit board (PCB) and a semiconductor chip and a flip-chip package including the semiconductor chip. The semiconductor chip includes a stress-relief buffer coupling a bump and a semiconductor chip pad.

摘要翻译： 半导体芯片包括减轻压力以减轻印刷电路板（PCB）和半导体芯片之间的热膨胀系数（CTE）的差异以及包括半导体芯片的倒装芯片封装的影响。 半导体芯片包括耦合凸块的应力消除缓冲器和半导体芯片焊盘。

公开(公告)号：US08046709B2

公开(公告)日：2011-10-25

申请号：US11496481

申请日：2006-08-01

申请人： Jong-ho Lee ,  Kwang-kee Lee ,  Un-gyo Jung ,  Glenn A. Adams

发明人： Jong-ho Lee ,  Kwang-kee Lee ,  Un-gyo Jung ,  Glenn A. Adams

IPC分类号： G06F3/048

CPC分类号： G09G5/14 ,  G09G2340/0407 ,  G09G2340/0464 ,  G09G2340/10 ,  G09G2340/12 ,  G09G2340/125 ,  H04N5/445 ,  H04N5/44591 ,  H04N5/45 ,  H04N21/4312 ,  H04N21/4314 ,  H04N21/4316 ,  H04N21/443 ,  H04N21/4622

摘要： An apparatus for providing multiple screens and a method of dynamically configuring multiple screens are provided. The apparatus for providing multiple screens includes a digital signal processing module which receives predetermined information and restores a service based on the predetermined information, a service processing module which displays one or more logical screens associated with the service, and an output module which arranges the logical screens provided by the service processing module at different locations on a display screen.

摘要翻译： 提供了一种用于提供多个屏幕的装置和一种动态配置多个屏幕的方法。 用于提供多个屏幕的装置包括数字信号处理模块，其接收预定信息并基于预定信息恢复服务;服务处理模块，其显示与服务相关联的一个或多个逻辑屏幕;以及输出模块，其布置逻辑 由服务处理模块在显示屏幕上的不同位置提供的屏幕。

公开(公告)号：US07898600B2

公开(公告)日：2011-03-01

申请号：US11496454

申请日：2006-08-01

申请人： Jong-ho Lee ,  Kwang-kee Lee ,  Un-gyo Jung ,  Glenn A. Adams

发明人： Jong-ho Lee ,  Kwang-kee Lee ,  Un-gyo Jung ,  Glenn A. Adams

IPC分类号： H04N5/45

CPC分类号： G09G5/14 ,  G09G2340/0407 ,  G09G2340/0464 ,  G09G2340/10 ,  G09G2340/12 ,  G09G2340/125 ,  H04N5/445 ,  H04N5/44591 ,  H04N5/45 ,  H04N21/4312 ,  H04N21/4314 ,  H04N21/4316 ,  H04N21/443 ,  H04N21/4622

摘要： An apparatus and method for providing multiple screens is disclosed. The apparatus includes a user/application interface module receiving a PiP service providing mode, and an output module displaying a video component of a service on a main screen if the PiP service providing mode is a first mode and displaying a background video or the video component of the service on a PiP screen if the PiP service providing mode in a second mode.

摘要翻译： 公开了一种用于提供多个屏幕的装置和方法。 该装置包括接收PiP服务提供模式的用户/应用程序接口模块，以及如果PiP服务提供模式是第一模式并且显示背景视频或视频组件，则在主屏幕上显示服务的视频组件的输出模块 如果在第二模式中的PiP服务提供模式，则在PiP屏幕上的服务。

公开(公告)号：US20080092196A1

公开(公告)日：2008-04-17

申请号：US11699457

申请日：2007-01-30

申请人： Kwang-hyun Koh ,  Jong-ho Lee ,  Kwang-hyuk Kim

发明人： Kwang-hyun Koh ,  Jong-ho Lee ,  Kwang-hyuk Kim

IPC分类号： H04N7/16 ,  H04N7/173

CPC分类号： H04N7/163 ,  H04N21/4349 ,  H04N21/8173

摘要： Provided are a method and apparatus for receiving, storing, and executing a data broadcast application. The apparatus includes an application controller that determines whether receiving of application data needed to execute an application is completed before storing of a data broadcast is completed, allows the received application data to be stored when receiving of the application is completed, and determines whether the application will be executed together with audio/video data when the stored data broadcast is reproduced; and a storage unit that stores the completely received application data together with the audio/video data. Accordingly, it is possible to prevent the occurrence of errors in executing an application.

摘要翻译： 提供了一种用于接收，存储和执行数据广播应用的方法和装置。 该装置包括：应用控制器，在完成数据广播的存储之前，确定是否完成了执行应用所需的应用数据的接收，允许在接收到应用完成时存储接收的应用数据，并且确定应用 将在再现存储的数据广播时与音频/视频数据一起执行; 以及存储单元，其将完整接收的应用数据与音频/视频数据一起存储。 因此，可以防止在执行应用时发生错误。

公开(公告)号：US20070178637A1

公开(公告)日：2007-08-02

申请号：US11699784

申请日：2007-01-30

申请人： Hyung-suk Jung ,  Cheol-kyu Lee ,  Jong-ho Lee ,  Sung-kee Han ,  Yun-seok Kim

发明人： Hyung-suk Jung ,  Cheol-kyu Lee ,  Jong-ho Lee ,  Sung-kee Han ,  Yun-seok Kim

IPC分类号： H01L21/8238

CPC分类号： H01L21/823857 ,  H01L21/823842

摘要： A method of fabricating a gate of a semiconductor device using an oxygen-free ashing process is disclosed. The method includes forming a high-k dielectric film, having a dielectric constant higher than a silicon oxide film, on a semiconductor substrate including an NMOS region and a PMOS region, forming an etching target film on the high-k dielectric film, forming a photoresist pattern to expose any one region of the two regions, on the etching target film, etching the etching target film using the photoresist pattern as an etching mask, and removing the photoresist pattern using plasma formed in the presence of an oxygen-free reactive gas.

摘要翻译： 公开了一种使用无氧灰化工艺制造半导体器件的栅极的方法。 该方法包括在包括NMOS区域和PMOS区域的半导体衬底上形成具有高于氧化硅膜的介电常数的高k电介质膜，在高k电介质膜上形成蚀刻靶膜，形成 光致抗蚀剂图案以暴露两个区域的任何一个区域，在蚀刻目标膜上，使用光刻胶图案蚀刻蚀刻目标膜作为蚀刻掩模，以及使用在无氧反应气体存在下形成的等离子体去除光致抗蚀剂图案 。

公开(公告)号：US20070035469A1

公开(公告)日：2007-02-15

申请号：US11496404

申请日：2006-08-01

申请人： Jong-ho Lee ,  Kwang-kee Lee ,  Un-gyo Jung ,  Glenn Adams

发明人： Jong-ho Lee ,  Kwang-kee Lee ,  Un-gyo Jung ,  Glenn Adams

IPC分类号： H04N5/445 ,  H04N5/45 ,  G09G5/00

CPC分类号： G09G5/14 ,  G09G2340/0407 ,  G09G2340/0464 ,  G09G2340/10 ,  G09G2340/12 ,  G09G2340/125 ,  H04N5/445 ,  H04N5/44591 ,  H04N5/45 ,  H04N21/4312 ,  H04N21/4314 ,  H04N21/4316 ,  H04N21/443 ,  H04N21/4622

摘要： An apparatus for providing multiple screens and a method of dynamically configuring multiple screens are provided. The apparatus for providing multiple screens includes a screen generating module which generates a screen for displaying a service and a service selecting module which connects the service to the screen generated by the service generating module.

摘要翻译： 提供了一种用于提供多个屏幕的装置和一种动态配置多个屏幕的方法。 用于提供多个屏幕的设备包括生成用于显示服务的屏幕的屏幕生成模块和将服务连接到由服务生成模块生成的屏幕的服务选择模块。

公开(公告)号：US06563151B1

公开(公告)日：2003-05-13

申请号：US09654859

申请日：2000-09-05

申请人： Hyung-cheol Shin ,  Jong-ho Lee ,  Sang-yeon Han

发明人： Hyung-cheol Shin ,  Jong-ho Lee ,  Sang-yeon Han

IPC分类号： H01L2976

CPC分类号： H01L29/66643 ,  H01L21/2807 ,  H01L21/28105 ,  H01L29/1083 ,  H01L29/4983 ,  H01L29/7831 ,  H01L29/7836

摘要： Field effect transistors include a semiconductor substrate having a channel region of first conductivity type therein extending adjacent a surface thereof. Source and drain regions of second conductivity type are also provided at opposite ends of the channel region. The source and drain regions extend in the semiconductor substrate and form P-N rectifying junctions with the channel region. A gate electrode extends on the channel region and comprises a first electrically conductive material having a first work function. A first sub-gate electrode extends on the channel region and comprises a second electrically conductive material having a second work function that is unequal to the first work function. The second electrically conductive material is preferably selected so that a difference between the second work function and a work function of the channel region is sufficient to form an inversion-layer in a portion of the channel region extending opposite the first sub-gate electrode when the first sub-gate electrode is at a zero potential bias relative to the channel region.