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公开(公告)号:US20200212098A1
公开(公告)日:2020-07-02
申请号:US16643110
申请日:2018-07-19
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Mitsuhito MASE , Jun HIRAMITSU , Yasuhito YONETA , Masaharu MURAMATSU
IPC: H01L27/148
Abstract: The photosensitive region includes a first impurity region and a second impurity region having a higher impurity concentration than that of the first impurity region. The photosensitive region includes one end positioned away from the transfer section in the second direction and another end positioned closer to the transfer section in the second direction. A shape of the second impurity region in plan view is line-symmetric with respect to a center line of the photosensitive region along the second direction. A width of the second impurity region in the first direction increases in a transfer direction from the one end to the other end. An increase rate of the width of the second impurity region in each of sections, obtained by dividing the photosensitive region into n sections in the second direction, becomes gradually higher in the transfer direction. Here, n is an integer of two or more.
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公开(公告)号:US20210305312A1
公开(公告)日:2021-09-30
申请号:US17344228
申请日:2021-06-10
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Yasuhito YONETA , Masaharu MURAMATSU
IPC: H01L27/148 , H04N5/372
Abstract: A first region includes a plurality of first transfer column regions distributed in a first direction. A second region includes a plurality of second transfer column regions distributed in the first direction. The second region is positioned downstream of the first region in a charge transfer direction in the second transfer section. Lengths in a second direction of the plurality of first transfer column regions are equal. Lengths in the second direction of the plurality of second transfer column regions are longer than the length of the first transfer column region, and increase as the second transfer column region is positioned downstream in the charge transfer direction. A third region is disposed to correspond to the first region and extends along the first direction. A fourth region is disposed to correspond to the second region and extends such that an interval between the fourth region and a pixel region in the second direction increases in the charge transfer direction in response to a change in the lengths of the plurality of second transfer column regions.
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公开(公告)号:US20200212097A1
公开(公告)日:2020-07-02
申请号:US16643102
申请日:2018-07-19
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Yasuhito YONETA , Masaharu MURAMATSU
IPC: H01L27/148 , H04N5/372
Abstract: A first region includes first transfer column regions distributed in a first direction. A second region includes second transfer column regions distributed in the first direction. The second region is positioned downstream of the first region in a charge transfer direction. Lengths in a second direction of the first transfer column regions are equal. Lengths in the second direction of the second transfer column regions are longer than the length of the first transfer column region, and increase as the second transfer column region is positioned downstream in the charge transfer direction. A third region is disposed to correspond to the first region and extends along the first direction. A fourth region is disposed to correspond to the second region and extends such that an interval between the fourth region and a pixel region increases in response to a change in the lengths of the second transfer column regions.
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公开(公告)号:US20250160027A1
公开(公告)日:2025-05-15
申请号:US18839132
申请日:2022-12-09
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Fumiya TANAKA , Atsunori YAMADA , Shin-ichiro TAKAGI , Yasuhito YONETA
IPC: H10F39/00 , H04N25/71 , H04N25/772 , H04N25/778
Abstract: A solid-state imaging element includes a semiconductor substrate, a first element unit, and a second element unit. The first element unit includes a light receiving part that generates charges, and a transfer part that transfers a charges. The transfer part includes a first transfer electrode and a second transfer electrode aligned in a transfer direction of the charges, and a discharge gate electrode disposed over a charge discharge region of the semiconductor substrate along the charge transfer region. The first transfer electrode is formed as a first layer, and the second transfer electrode and the discharge gate electrode are formed as second layers. The first transfer electrode includes a portion overlapping a part of the second transfer electrode and a portion overlapping a part of the discharge gate electrode. The second transfer electrode is spaced apart from the discharge gate electrode.
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公开(公告)号:US20210057477A1
公开(公告)日:2021-02-25
申请号:US16963291
申请日:2018-11-27
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Yasuhito YONETA , Masaharu MURAMATSU , Nao INOUE , Hirokazu YAMAMOTO , Shinichi NAKATA , Takuo KOYAMA
IPC: H01L27/146 , H01L23/00 , H01L23/31 , H01L21/56
Abstract: A semiconductor device includes a support body including a mount region, a semiconductor chip disposed on the mount region with a predetermined distance therebetween, a bump disposed between the support body and the semiconductor chip, a wall portion disposed between the support body and the semiconductor chip along a part of an outer edge of the semiconductor chip, and an underfill resin layer disposed between the support body and the semiconductor chip. The underfill resin layer covers an outer side surface of the wall portion.
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公开(公告)号:US20170301722A1
公开(公告)日:2017-10-19
申请号:US15505993
申请日:2015-08-04
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Kentaro MAETA , Yasuhito YONETA , Hisanori SUZUKI , Masaharu MURAMATSU
IPC: H01L27/148 , H01L27/146
Abstract: A back-illuminated solid-state imaging device includes a semiconductor substrate, a shift register, and a light-shielding film. The semiconductor substrate includes a light incident surface on the back side and a light receiving portion generating a charge in accordance with light incidence. The shift register is disposed on the side of a light-detective surface opposite to the light incident surface of the semiconductor substrate. The light-shielding film is disposed on the side of the light-detective surface of the semiconductor substrate. The light-shielding film includes an uneven surface opposing the light-detective surface.
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公开(公告)号:US20240170528A1
公开(公告)日:2024-05-23
申请号:US18428396
申请日:2024-01-31
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Mitsuhito Mase , Jun Hiramitsu , Yasuhito Yoneta , Masaharu Muramatsu
IPC: H01L27/148 , H01L27/146 , H04N25/71 , H04N25/73
CPC classification number: H01L27/14843 , H01L27/14603 , H01L27/14607 , H01L27/14812 , H04N25/71 , H01L27/14831 , H04N25/73
Abstract: The photosensitive region includes a first impurity region and a second impurity region having a higher impurity concentration than that of the first impurity region. The photosensitive region includes one end positioned away from the transfer section in the second direction and another end positioned closer to the transfer section in the second direction. A shape of the second impurity region in plan view is line-symmetric with respect to a center line of the photosensitive region along the second direction. A width of the second impurity region in the first direction increases in a transfer direction from the one end to the other end. An increase rate of the width of the second impurity region in each of sections, obtained by dividing the photosensitive region into n sections in the second direction, becomes gradually higher in the transfer direction. Here, n is an integer of two or more.
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公开(公告)号:US20240030270A1
公开(公告)日:2024-01-25
申请号:US18039797
申请日:2021-10-14
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Atsunori YAMADA
IPC: H01L27/148 , H01L27/146
CPC classification number: H01L27/14818 , H01L27/1464
Abstract: A transfer part of a photoelectric conversion device includes a first transfer region configured to transfer electric charge along a first line, a second transfer region configured to transfer the electric charge along a second line, a third transfer region configured to transfer the electric charge along a third line, a first transfer electrode, and a second transfer electrode. The third line is deviated from at least one of the first line and the second line. The third transfer region includes a first semiconductor region having a first impurity concentration, and a second semiconductor region having a second impurity concentration higher than the first impurity concentration. The second semiconductor region extends along the third line to be widened on the second transfer region side. The first semiconductor region is disposed on both sides of the second semiconductor region.
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公开(公告)号:US20230387149A1
公开(公告)日:2023-11-30
申请号:US18027730
申请日:2021-10-08
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Mitsuhito MASE , Ryo TAKIGUCHI , Hiroaki ISHII , Masaru NAKANO , Shin-ichiro TAKAGI
IPC: H01L27/146 , H01L31/107 , H01L31/0224
CPC classification number: H01L27/14609 , H01L27/14643 , H01L31/107 , H01L31/022408
Abstract: Provided is an optical sensor including: a charge generation region that generates charges in response to incident light; a charge collection region to which charges generated in the charge generation region are transferred; and at least one transfer gate electrode disposed on a transfer region between the charge generation region and the charge collection region. The charge generation region includes an avalanche multiplication region that causes avalanche multiplication, and a gradient potential energy formation region that forms gradient potential energy that is gradient so that potential energy becomes lower as approaching the transfer region in the charge generation region.
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公开(公告)号:US20150340398A1
公开(公告)日:2015-11-26
申请号:US14760258
申请日:2013-09-24
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Shin-ichiro TAKAGI , Shingo ISHIHARA , Masaharu MURAMATSU
IPC: H01L27/146 , H01L23/498 , H01L23/00
CPC classification number: H01L27/14636 , H01L23/49838 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L27/14618 , H01L27/14634 , H01L2224/05553 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48997 , H01L2224/4911 , H01L2224/49175 , H01L2224/49429 , H01L2224/78301 , H01L2224/85181 , H01L2224/85207 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/10161 , H01L2924/15787 , H01L2924/19107 , H01L2924/00 , H01L2224/85399 , H01L2224/05599 , H01L2224/48455
Abstract: An electronic component device includes a first electronic component on which a first electrode pad is disposed, a second electronic component on which a second electrode pad having a first pad portion and a second pad portion is disposed, a first bonding wire having one end connected to the first electrode pad and the other end connected to the first pad portion, and a second bonding wire having one end connected to a connection portion between the first pad portion and the first bonding wire and the other end connected to the second pad portion. The second electrode pad is disposed on the second electronic component so that the first pad portion and the second pad portion are laid along a direction intersecting with an extending direction of the first bonding wire. The extending direction of the first bonding wire intersects with an extending direction of the second bonding wire.
Abstract translation: 电子部件装置包括:第一电子部件,配置有第一电极焊盘;第二电子部件,具有第一焊盘部和第二焊盘部的第二电极焊盘,第一焊接线的一端连接到 第一电极焊盘和另一端连接到第一焊盘部分,以及第二接合线,其一端连接到第一焊盘部分和第一焊接线之间的连接部分,而另一端连接到第二焊盘部分。 第二电极焊盘设置在第二电子部件上,使得第一焊盘部分和第二焊盘部分沿着与第一焊接线的延伸方向交叉的方向放置。 第一接合线的延伸方向与第二接合线的延伸方向相交。
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