公开(公告)号：US20210057477A1

公开(公告)日：2021-02-25

申请号：US16963291

申请日：2018-11-27

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shin-ichiro TAKAGI ,  Yasuhito YONETA ,  Masaharu MURAMATSU ,  Nao INOUE ,  Hirokazu YAMAMOTO ,  Shinichi NAKATA ,  Takuo KOYAMA

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor device includes a support body including a mount region, a semiconductor chip disposed on the mount region with a predetermined distance therebetween, a bump disposed between the support body and the semiconductor chip, a wall portion disposed between the support body and the semiconductor chip along a part of an outer edge of the semiconductor chip, and an underfill resin layer disposed between the support body and the semiconductor chip. The underfill resin layer covers an outer side surface of the wall portion.