公开(公告)号：US20180286752A1

公开(公告)日：2018-10-04

申请号：US16000603

申请日：2018-06-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasuhito YONETA ,  Ryoto TAKISAWA ,  Shingo ISHIHARA ,  Hisanori SUZUKI ,  Masaharu MURAMATSU

IPC: H01L21/77 ,  H01L27/146 ,  H04N5/369

Abstract: A method for manufacturing a solid-state imaging device comprises a first step of preparing an imaging element having a second principal surface having an electrode arranged thereon, and a photoelectric converter part configured to photoelectrically convert the incident energy line so as to generate a signal charge; a second step of preparing a support substrate, provided with a through hole extending in a thickness direction thereof, having a third principal surface; a third step of aligning the imaging element and the support substrate with each other so that the electrode is exposed out of the through hole while the second and third principal surfaces oppose each other and joining the imaging element and the support substrate to each other; and a fourth step of arranging a conductive ball-shaped member in the through hole and electrically connecting the ball-shaped member to the electrode after the third step.

公开(公告)号：US20150340398A1

公开(公告)日：2015-11-26

申请号：US14760258

申请日：2013-09-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shin-ichiro TAKAGI ,  Shingo ISHIHARA ,  Masaharu MURAMATSU

IPC: H01L27/146 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85207 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/48455

Abstract: An electronic component device includes a first electronic component on which a first electrode pad is disposed, a second electronic component on which a second electrode pad having a first pad portion and a second pad portion is disposed, a first bonding wire having one end connected to the first electrode pad and the other end connected to the first pad portion, and a second bonding wire having one end connected to a connection portion between the first pad portion and the first bonding wire and the other end connected to the second pad portion. The second electrode pad is disposed on the second electronic component so that the first pad portion and the second pad portion are laid along a direction intersecting with an extending direction of the first bonding wire. The extending direction of the first bonding wire intersects with an extending direction of the second bonding wire.

Abstract translation: 电子部件装置包括：第一电子部件，配置有第一电极焊盘;第二电子部件，具有第一焊盘部和第二焊盘部的第二电极焊盘，第一焊接线的一端连接到 第一电极焊盘和另一端连接到第一焊盘部分，以及第二接合线，其一端连接到第一焊盘部分和第一焊接线之间的连接部分，而另一端连接到第二焊盘部分。 第二电极焊盘设置在第二电子部件上，使得第一焊盘部分和第二焊盘部分沿着与第一焊接线的延伸方向交叉的方向放置。 第一接合线的延伸方向与第二接合线的延伸方向相交。