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公开(公告)号：US07554136B2
公开(公告)日：2009-06-30
申请号：US11078687
申请日：2005-03-11
IPC分类号： G01C19/56
CPC分类号： B81B7/007 , H01L2224/01
摘要： A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided on the circuit board, a lead substrate being provided substantially parallel to the circuit board, and a lead of conductive member being electrically connected to the electrode pad by being bent in a direction away from a surface of the lead substrate, one end of the lead being adhered to the lead substrate and the other end being a free end.
摘要翻译： 一种微型器件，其通过半导体工艺制造并且电连接到外部用于其操作。 微型装置包括电路板，电路板设置在电路板上，引线基板大致平行于电路板设置，导电部件的引线通过沿着方向弯曲而与电极焊盘电连接 从引线基板的表面，引线的一端粘附到引线基板，另一端是自由端。
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公开(公告)号：US20050218530A1
公开(公告)日：2005-10-06
申请号：US11078687
申请日：2005-03-11
IPC分类号： H01L23/48
CPC分类号： B81B7/007 , H01L2224/01
摘要： A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided on the circuit board, a lead substrate being provided substantially parallel to the circuit board, and a lead of conductive member being electrically connected to the electrode pad by being bent in a direction away from a surface of the lead substrate, one end of the lead being adhered to the lead substrate and the other end being a free end.
摘要翻译： 一种微型器件，其通过半导体工艺制造并且电连接到外部用于其操作。 微型装置包括电路板，电路板设置在电路板上，引线基板大致平行于电路板设置，导电部件的引线通过沿着方向弯曲而与电极焊盘电连接 从引线基板的表面，引线的一端粘附到引线基板，另一端是自由端。
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公开(公告)号：US20090184728A1
公开(公告)日：2009-07-23
申请号：US12174645
申请日：2008-07-17
CPC分类号： B81C1/00674 , B81B3/0005 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81C1/0096 , G01R1/06761 , G01R3/00 , H01H1/0036 , H01H2001/0052 , Y10T428/12493
摘要： Provided is a method for producing a contact device, including a step of forming a first conductive film; a step of forming a second conductive film containing a metal or an alloy of the metal on the first conductive film; a step of forming a third conductive film on the second conductive film; and a step of forming a surface layer on the third conductive film, the surface layer containing an oxidative product of the metal in the second conductive film, which metal has been diffused to be precipitated out from the surface of the third conductive film and oxidized.
摘要翻译： 提供一种接触装置的制造方法，包括形成第一导电膜的工序; 在第一导电膜上形成含有金属或金属合金的第二导电膜的步骤; 在第二导电膜上形成第三导电膜的步骤; 以及在所述第三导电膜上形成表面层的步骤，所述表面层含有所述金属在所述第二导电膜中的氧化产物，所述金属已被扩散以从所述第三导电膜的表面析出并被氧化。
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4.发明申请Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权偏转器，偏转器制造方法和带电粒子束曝光装置公开(公告)号：US20050263713A1
公开(公告)日：2005-12-01
申请号：US11196262
申请日：2005-08-04
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/147 , H01J3/14
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.
摘要翻译： 偏转带电粒子束的偏转器包括具有带电粒子束应穿过的开口的基板和设置在开口中以偏转带电粒子束的偏转电极，并具有第一导电部件和第二导电部件， 通过电镀形成。 第二导电构件形成在第一导电构件的表面上，并且基本上由比第一导电构件更难氧化的材料制成。
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5.发明授权Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权偏转器，偏转器制造方法和带电粒子束曝光装置公开(公告)号：US06953938B2
公开(公告)日：2005-10-11
申请号：US10670328
申请日：2003-09-26
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/147 , H01J37/304
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.
摘要翻译： 使带电粒子束偏转的偏转器包括具有带电粒子束应通过的开口的基板和布置在开口中以偏转带电粒子束并具有第一导电构件和第二导电构件的偏转电极， 它们通过电镀形成。 第二导电构件形成在第一导电构件的表面上，并且由比第一导电构件更难氧化的材料制成。 第一导电部件由残留应力小于第二导电部件的材料制成。
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公开(公告)号：US07800386B2
公开(公告)日：2010-09-21
申请号：US12174645
申请日：2008-07-17
CPC分类号： B81C1/00674 , B81B3/0005 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81C1/0096 , G01R1/06761 , G01R3/00 , H01H1/0036 , H01H2001/0052 , Y10T428/12493
摘要： Provided is a method for producing a contact device, including a step of forming a first conductive film; a step of forming a second conductive film containing a metal or an alloy of the metal on the first conductive film; a step of forming a third conductive film on the second conductive film; and a step of forming a surface layer on the third conductive film, the surface layer containing an oxidative product of the metal in the second conductive film, which metal has been diffused to be precipitated out from the surface of the third conductive film and oxidized.
摘要翻译： 提供一种接触装置的制造方法，包括形成第一导电膜的工序; 在第一导电膜上形成含有金属或金属合金的第二导电膜的步骤; 在第二导电膜上形成第三导电膜的步骤; 以及在所述第三导电膜上形成表面层的步骤，所述表面层含有所述金属在所述第二导电膜中的氧化产物，所述金属已被扩散以从所述第三导电膜的表面析出并被氧化。
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7.发明授权Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权偏转器，偏转器制造方法和带电粒子束曝光装置公开(公告)号：US07276707B2
公开(公告)日：2007-10-02
申请号：US11196262
申请日：2005-08-04
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/30
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.
摘要翻译： 偏转带电粒子束的偏转器包括具有带电粒子束应穿过的开口的基板和设置在开口中以偏转带电粒子束的偏转电极，并具有第一导电部件和第二导电部件， 通过电镀形成。 第二导电构件形成在第一导电构件的表面上，并且基本上由比第一导电构件更难氧化的材料制成。
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8.发明申请公开(公告)号：US20050035300A1
公开(公告)日：2005-02-17
申请号：US10670328
申请日：2003-09-26
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/147
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.
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9.发明授权公开(公告)号：US06818911B2
公开(公告)日：2004-11-16
申请号：US10406274
申请日：2003-04-04
申请人： Kenji Tamamori , Masato Muraki , Yuichi Iwasaki , Yoshinori Nakayama , Kouji Asano , Yoshiaki Moro , Masayoshi Esashi
发明人： Kenji Tamamori , Masato Muraki , Yuichi Iwasaki , Yoshinori Nakayama , Kouji Asano , Yoshiaki Moro , Masayoshi Esashi
IPC分类号： G21G500
CPC分类号： B82Y10/00 , B82Y40/00 , H01J37/045 , H01J37/3177 , H01J2237/0435
摘要： This invention provides a reliable blanking aperture array. An insulating layer and conductive layer are sequentially formed on the lower surface of a substrate. Then, a plurality of pairs of opposing trenches are formed in the substrate, and an insulating layer is formed on each of the side surfaces of the trenches by thermal oxidation. The conductive layer is exposed by etching the bottom of each trench. A conductive member is selectively grown in each trench using the conductive layer as a plating electrode to form a blanking electrode. An opening is formed between the opposing blanking electrodes.
摘要翻译： 本发明提供了可靠的消隐孔径阵列。 绝缘层和导电层依次形成在基板的下表面上。 然后，在衬底中形成多对相对的沟槽，并且通过热氧化在沟槽的每个侧表面上形成绝缘层。 通过蚀刻每个沟槽的底部来暴露导电层。 使用导电层作为电镀电极，在每个沟槽中选择性地生长导电构件以形成消隐电极。 在相对的消隐电极之间形成开口。
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