发明申请
- 专利标题： Micro device and method for manufacturing the same
- 专利标题（中）： 微型器件及其制造方法
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申请号： US11078687申请日： 2005-03-11
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公开(公告)号： US20050218530A1公开(公告)日： 2005-10-06
- 发明人: Fumikazu Takayanagi , Yoshiaki Moro , Hirokazu Sanpei
- 申请人： Fumikazu Takayanagi , Yoshiaki Moro , Hirokazu Sanpei
- 申请人地址： JP Tokyo
- 专利权人： Advantest Corporation
- 当前专利权人： Advantest Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JPJP2002-268814 20020913
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided on the circuit board, a lead substrate being provided substantially parallel to the circuit board, and a lead of conductive member being electrically connected to the electrode pad by being bent in a direction away from a surface of the lead substrate, one end of the lead being adhered to the lead substrate and the other end being a free end.
公开/授权文献
- US07554136B2 Micro-switch device and method for manufacturing the same 公开/授权日：2009-06-30
信息查询
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