Method for vertical and lateral control of III-N polarity
    3.
    发明授权
    Method for vertical and lateral control of III-N polarity 有权
    III-N极性垂直和横向控制的方法

    公开(公告)号:US09396941B2

    公开(公告)日:2016-07-19

    申请号:US13235624

    申请日:2011-09-19

    IPC分类号: H01L21/28 H01L21/02

    摘要: Disclosed herein is a method of: depositing a patterned mask layer on an N-polar GaN epitaxial layer of a sapphire, silicon, or silicon carbide substrate; depositing an AlN inversion layer on the open areas; removing any remaining mask; and depositing a III-N epitaxial layer to simultaneously produce N-polar material and III-polar material. Also disclosed herein is: depositing an AlN inversion layer on an N-polar bulk III-N substrate and depositing a III-N epitaxial layer to produce III-polar material. Also disclosed herein is: depositing an inversion layer on a III-polar bulk III-N substrate and depositing a III-N epitaxial layer to produce N-polar material. Also disclosed herein is a composition having: a bulk III-N substrate; an inversion layer on portions of the substrate; and a III-N epitaxial layer on the inversion layer. The III-N epitaxial layer is of the opposite polarity of the surface of the substrate.

    摘要翻译: 本文公开了一种方法:在蓝宝石,硅或碳化硅衬底的N极GaN外延层上沉积图案化掩模层; 在开放区域上沉积AlN反转层; 去除任何剩余的面罩; 并沉积III-N外延层以同时产生N-极性材料和III-极性材料。 本文还公开的是:在N极本体III-N衬底上沉积AlN反转层并沉积III-N外延层以产生III极性材料。 本文还公开:在III极本体III-N衬底上沉积反型层并沉积III-N外延层以产生N-极性材料。 本文还公开了具有:本体III-N底物的组合物; 在基板的部分上的反转层; 和反型层上的III-N外延层。 III-N外延层具有与衬底表面相反的极性。