Abstract:
A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.
Abstract:
An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.
Abstract:
A liquid compound dispensing apparatus for dispensing a controlled amount of liquid compound onto a workpiece is described. The apparatus comprises a cartridge system. The cartridge system may accept a liquid compound cartridge containing liquid compound. The apparatus also comprises a plate, having a threaded bore, positioned above the cartridge system that is movable in a first and second direction, at least one plunger attached to the plate at a first end and attached to a piston at a second end. The piston is dimensioned to move within the liquid compound cartridge to displace liquid compound when the plate is moved in the second direction. A driving mechanism moves the plate in the first and the second directions to dispense product and comprises a motor, a threaded rod disposed through the threaded bore of the plate that is driven by a driving belt attached to the motor.
Abstract:
A solder dross recovery module has gears and a waste collection chamber positioned within a solder pot. The gears are configured to draw in solder dross from a surface of molten solder stored in the solder pot. The gears apply pressure to the solder dross so as to separate solder from the solder dross. The recovered solder is returned to the molten solder in the solder pot. A resulting waste material is collected in the waste collection chamber.
Abstract:
A universal automation line is configured for the assembly of electronics and mechanical devices. The universal automation line includes universal cells or stations that can be programmed to perform a variety of automated assembly tasks such as glue dispensing, screw driving, pick and place, etc. The stations are interchangeable by different module design such as selective soldering, heat stacking, bottom lead trimming, bottom screwing and ultrasonic welding. Each station can also include an automated robot, which is also interchangeable, to perform different tasks and complete fully automated assemblies. The stations can be sequenced inline for a fully automated line or combined with some manual operation. The stations can communicate by standardized interfaces and local networks, and can be expanded to an intranet or the internet for remote control.
Abstract:
An energy-efficient ventilation system comprises a ventilation fan, ductwork, system controller, and a plurality of ventilation points, each comprising a damper, a differential pressure sensor, a ventilation point controller, and a fume detector. When a ventilation point does not require ventilation, a signal is sent to the system controller to reduce the ventilation fan speed thereby using only as much energy as is needed to provide service to the ventilation points that need ventilation. The fume detector, damper, and differential pressure sensor for each ventilation point are used to determine whether ventilation is needed at a ventilation point and to control the ventilation point accordingly.
Abstract:
A disconnectable snap button connection for connecting electronic devices to fabrics, the disconnectable snap button connection and a method for making the same is described herein. The disconnectable snap button connection includes a component, a piece of conductive material, a piece of non-conductive material; wherein the piece of conductive material is attached to the piece of non-conductive material, a male portion of the disconnectable snap button, wherein the male portion of the disconnectable snap button is attached to the component, and a female portion of the disconnectable snap button, wherein the female portion of the disconnectable snap button is attached to the piece of conductive material. When the male portion of the disconnectable snap button is inserted into the female portion of the disconnectable snap button, a connection is made between the component and the piece of conductive material.
Abstract:
A liquid compound dispensing apparatus for dispensing a controlled amount of liquid compound onto a workpiece is described. The apparatus comprises a cartridge system. The cartridge system may accept a liquid compound cartridge containing liquid compound. The apparatus also comprises a plate, having a threaded bore, positioned above the cartridge system that is movable in a first and second direction, at least one plunger attached to the plate at a first end and attached to a piston at a second end. The piston is dimensioned to move within the liquid compound cartridge to displace liquid compound when the plate is moved in the second direction. A driving mechanism moves the plate in the first and the second directions to dispense product and comprises a motor, a threaded rod disposed through the threaded bore of the plate that is driven by a driving belt attached to the motor.
Abstract:
A method and apparatus for generating consumer electronics using a Universal Box Build (UBB) are disclosed herein. The method may include entering specifications of a product comprised of a printed circuit board (PCB), additional components (such as Central Processing Units (CPUs), memory modules, and heatsinks) into a chassis module, inserting a set of required components in the UBB, and generating the PCB assembly based on the entered specifications, wherein a robot is operatively connected to the interface module to automatically generate a product assembly.
Abstract:
A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.