METAL OXIDE SEMICONDUCTOR FILM, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR
    4.
    发明申请
    METAL OXIDE SEMICONDUCTOR FILM, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR 审中-公开
    金属氧化物半导体膜,薄膜晶体管,显示设备,图像传感器和X射线传感器

    公开(公告)号:US20160225859A1

    公开(公告)日:2016-08-04

    申请号:US15095168

    申请日:2016-04-11

    IPC分类号: H01L29/24 H01L29/786

    摘要: Provided are a metal oxide semiconductor film and a device including the same, the metal oxide semiconductor film including at least indium as a metal component, in which when an indium concentration in the metal oxide semiconductor film is represented by DI (atoms/cm3), and when a hydrogen concentration in the metal oxide semiconductor film is represented by DH (atoms/cm3), the following relational expression (1) is satisfied: 0.1≦DH/DI≦1.8  (1).

    摘要翻译: 提供一种金属氧化物半导体膜及其制造方法,其中,金属氧化物半导体膜至少包含作为金属成分的铟,当金属氧化物半导体膜中的铟浓度以DI(原子/ cm 3)表示时, 当金属氧化物半导体膜中的氢浓度以DH(原子/ cm 3)表示时,满足以下关系式(1):0.1≤DH/DI≤1.8(1)。

    METAL OXIDE FILM, METHOD FOR MANUFACTURING SAME, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR
    9.
    发明申请
    METAL OXIDE FILM, METHOD FOR MANUFACTURING SAME, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR 有权
    金属氧化物膜,其制造方法,薄膜晶体管,显示装置,图像传感器和X射线传感器

    公开(公告)号:US20160005879A1

    公开(公告)日:2016-01-07

    申请号:US14856047

    申请日:2015-09-16

    摘要: Provided is a metal oxide film, including a component having a peak position, in an XPS spectrum thereof, within a range corresponding to a binding energy of from 402 eV to 405 eV, the metal oxide film satisfying a relationship represented by Equation (1): A/(A+B)≧0.39, when an intensity of peak energy attributed to nitrogen 1s electron is obtained by peak separation, and a manufacturing method of the same, an oxide semiconductor film, a thin-film transistor, a display apparatus, an image sensor, and an X-ray sensor. In Equation (1), A represents a peak area of the component having a peak position within a range corresponding to a binding energy of from 402 eV to 405 eV, and B represents a peak area of a component having a peak position within a range corresponding to a binding energy of from 406 eV to 408 eV.

    摘要翻译: 本发明提供一种金属氧化物膜,其特征在于,具有在XPS光谱中具有峰值位置的成分在与402eV〜405eV的结合能对应的范围内,所述金属氧化物膜满足由式(1)表示的关系, :A /(A + B)≥0.39,当通过峰值分离获得归因于氮1s电子的峰值能量的强度时,其制造方法,氧化物半导体膜,薄膜晶体管,显示装置 ,图像传感器和X射线传感器。 在式(1)中,A表示在与402eV〜405eV的结合能对应的范围内具有峰值位置的成分的峰面积,B表示峰值位置在一定范围内的成分的峰面积 对应于从406eV到408eV的结合能。

    METHOD FOR PRODUCING FIELD EFFECT TRANSISTOR, FIELD EFFECT TRANSISTOR, DISPLAY DEVICE, IMAGE SENSOR, AND X-RAY SENSOR
    10.
    发明申请
    METHOD FOR PRODUCING FIELD EFFECT TRANSISTOR, FIELD EFFECT TRANSISTOR, DISPLAY DEVICE, IMAGE SENSOR, AND X-RAY SENSOR 有权
    用于产生场效应晶体管,场效应晶体管,显示器件,图像传感器和X射线传感器的方法

    公开(公告)号:US20140131696A1

    公开(公告)日:2014-05-15

    申请号:US14160730

    申请日:2014-01-22

    摘要: There is provided a method of fabricating a field effect transistor including: forming a first oxide semiconductor film on a gate insulation layer disposed on a gate electrode; forming a second oxide semiconductor film on the first oxide semiconductor film, the second oxide semiconductor film differing in cation composition from the first oxide semiconductor film and being lower in electrical conductivity than the first oxide semiconductor film; applying a heat treatment at over 300° C. in an oxidizing atmosphere; forming a third oxide semiconductor film on the second oxide semiconductor film, the third oxide semiconductor film differing in cation composition from the first oxide semiconductor film and being lower in electrical conductivity than the first oxide semiconductor film; applying a heat treatment in an oxidizing atmosphere; and, forming a source electrode and a drain electrode on the third oxide semiconductor film.

    摘要翻译: 提供一种制造场效应晶体管的方法,包括:在设置在栅电极上的栅极绝缘层上形成第一氧化物半导体膜; 在所述第一氧化物半导体膜上形成第二氧化物半导体膜,所述第二氧化物半导体膜与所述第一氧化物半导体膜的阳离子组成不同,导电性低于所述第一氧化物半导体膜; 在氧化气氛中在300℃以上进行热处理; 在所述第二氧化物半导体膜上形成第三氧化物半导体膜,所述第三氧化物半导体膜的阳离子组成与所述第一氧化物半导体膜不同,导电率低于所述第一氧化物半导体膜; 在氧化气氛中进行热处理; 以及在所述第三氧化物半导体膜上形成源电极和漏电极。