METHOD FOR PRODUCING AMORPHOUS OXIDE THIN FILM AND THIN FILM TRANSISTOR
    2.
    发明申请
    METHOD FOR PRODUCING AMORPHOUS OXIDE THIN FILM AND THIN FILM TRANSISTOR 有权
    生产无定形氧化物薄膜和薄膜晶体管的方法

    公开(公告)号:US20140103341A1

    公开(公告)日:2014-04-17

    申请号:US14104714

    申请日:2013-12-12

    摘要: A method for producing an amorphous oxide thin film includes: a pre-treatment process of selectively changing a binding state of an organic component, at a temperature lower than a pyrolysis temperature of the organic component, in a first oxide precursor film containing the organic component and In, to obtain a second oxide precursor film in which, when an infrared wave number range of from 1380 cm−1 to 1520 cm−1 in an infrared absorption spectrum obtained by performing a measurement by Fourier transform infrared spectroscopy is divided into an infrared wave number range of from 1380 cm−1 to 1450 cm−1 and an infrared wave number range of from more than 1450 cm−1 to 1520 cm−1, a peak positioned within the infrared wave number range of from 1380 cm−1 to 1450 cm−1 exhibits the maximum value in the infrared absorption spectrum within an infrared wave number range of from 1350 cm−1 to 1750 cm−1; and a post-treatment process of removing the organic component remaining in the second oxide precursor film, to transform the second oxide precursor film into an amorphous oxide thin film containing In.

    摘要翻译: 无定形氧化物薄膜的制造方法包括:在含有有机成分的第一氧化物前体膜中,在低于有机成分的热解温度的温度下选择性地改变有机成分的结合状态的预处理工序 和In,以获得第二氧化物前体膜,其中当通过利用傅立叶变换红外光谱进行测量而获得的红外吸收光谱中的1380cm -1至1520cm -1的红外波数范围被分为红外 波数范围为1380cm -1至1450cm -1,红外波数范围为1450cm -1以上1520cm -1以上,红外波数范围为1380cm -1〜 1450cm -1表现出红外吸收光谱的最大值,红外波数范围为1350cm-1至1750cm -1; 以及去除残留在第二氧化物前体膜中的有机成分的后处理工艺,将第二氧化物前体膜转变为含有In的无定形氧化物薄膜。

    METHOD OF MANUFACTURING THIN-FILM TRANSISTOR, THIN-FILM TRANSISTOR, DISPLAY APPARATUS, SENSOR, AND DIGITAL X-RAY IMAGE-CAPTURING APPARATUS
    4.
    发明申请
    METHOD OF MANUFACTURING THIN-FILM TRANSISTOR, THIN-FILM TRANSISTOR, DISPLAY APPARATUS, SENSOR, AND DIGITAL X-RAY IMAGE-CAPTURING APPARATUS 有权
    制造薄膜晶体管,薄膜晶体管,显示器,传感器和数字X射线图像捕获装置的方法

    公开(公告)号:US20130320338A1

    公开(公告)日:2013-12-05

    申请号:US13963061

    申请日:2013-08-09

    IPC分类号: H01L29/66 H01L29/786

    摘要: A method of fabricating a thin-film transistor, the method including: film-forming an active layer, that contains as a main component thereof an oxide semiconductor structured by O and at least two elements among In, Ga and Zn, in a film formation chamber into which at least oxygen is introduced, and b) heat treating the active layer at less than 300° C. in a dry atmosphere, wherein the film-forming a) and the heat treating are carried out such that, given that an oxygen partial pressure with respect to an entire pressure of an atmosphere within the film formation chamber in the film-forming is PO2depo (%), and an oxygen partial pressure with respect to an entire pressure of an atmosphere during the heat treating is PO2anneal (%), the oxygen partial pressure PO2anneal (%) at the time of the heat treating b) satisfies a relationship: −20/3PO2depo+40/3≦PO2anneal≦−800/43PO2depo+5900/43.

    摘要翻译: 一种制造薄膜晶体管的方法,所述方法包括:成膜有源层,其以膜形成方式包含由O构成的氧化物半导体和In,Ga和Zn中的至少两种元素作为其主要成分 至少引入氧的室,以及b)在干燥气氛中在低于300℃下热处理活性层,其中成膜a)和热处理进行,使得如果氧气 相对于膜成膜室内的气氛的全部压力,成膜时的分压为PO2depo(%),相对于热处理时的气氛的整个压力的氧分压为PO 2·去甲(%) ,热处理时的氧分压PO 2·去ann(%)b)满足关系:-20 / 3PO2depo + 40/3 @ PO2anneal @ -800 / 43PO2depo + 5900/43。

    METAL OXIDE SEMICONDUCTOR FILM, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR
    6.
    发明申请
    METAL OXIDE SEMICONDUCTOR FILM, THIN FILM TRANSISTOR, DISPLAY APPARATUS, IMAGE SENSOR, AND X-RAY SENSOR 审中-公开
    金属氧化物半导体膜,薄膜晶体管,显示设备,图像传感器和X射线传感器

    公开(公告)号:US20160225859A1

    公开(公告)日:2016-08-04

    申请号:US15095168

    申请日:2016-04-11

    IPC分类号: H01L29/24 H01L29/786

    摘要: Provided are a metal oxide semiconductor film and a device including the same, the metal oxide semiconductor film including at least indium as a metal component, in which when an indium concentration in the metal oxide semiconductor film is represented by DI (atoms/cm3), and when a hydrogen concentration in the metal oxide semiconductor film is represented by DH (atoms/cm3), the following relational expression (1) is satisfied: 0.1≦DH/DI≦1.8  (1).

    摘要翻译: 提供一种金属氧化物半导体膜及其制造方法,其中,金属氧化物半导体膜至少包含作为金属成分的铟,当金属氧化物半导体膜中的铟浓度以DI(原子/ cm 3)表示时, 当金属氧化物半导体膜中的氢浓度以DH(原子/ cm 3)表示时,满足以下关系式(1):0.1≤DH/DI≤1.8(1)。