公开(公告)号：US20230393085A1

公开(公告)日：2023-12-07

申请号：US18326051

申请日：2023-05-31

Applicant: EBARA CORPORATION

Inventor： Kenji WATANABE ,  Takeshi MURAKAMI ,  Yasushi TOMA ,  Ryo TAJIMA ,  Tsutomu KARIMATA

IPC: G01N23/2251

CPC classification number: G01N23/2251 ,  G01N2223/20 ,  G01N2223/418

Abstract: Provided is a method of evaluating a deviation of a trajectory of a primary electron beam in a primary optical system in an electron beam observation device including the primary optical system that irradiates a sample with the primary electron beam including a plurality of primary electrons and a secondary optical system that detects, by a detector, a secondary electron beam including a plurality of secondary electrons emitted from the sample irradiated with the primary electron beam.

公开(公告)号：US20140091215A1

公开(公告)日：2014-04-03

申请号：US14096361

申请日：2013-12-04

Applicant: Ebara Corporation

Inventor： Kenji WATANABE ,  Masahiro HATAKEYAMA ,  Yoshihiko NAITO ,  Tatsuya KOHAMA ,  Kenji TERAO ,  Takeshi MURAKAMI ,  Takehide HAYASHI ,  Kiwamu TSUKAMOTO ,  Hiroshi SOBUKAWA ,  Norio KIMURA

IPC: H01J37/22

CPC classification number: H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate (124) having a through hole (124a) at the center above the sample (200) and the dust collecting electrode (122).

Abstract translation: 提供一种电光检查装置，其能够尽可能地防止灰尘或颗粒附着到样品表面。 将其上放置有样品（200）的载物台（100）设置在能够抽真空的真空室（112）的内部，并且设置集尘电极（122）以包围样品（200）的周围， 。 集尘电极（122）施加与施加到样品（200）的电压相同极性的电压和与电压的绝对值相同或更大的绝对值。 因此，由于灰尘或颗粒例如颗粒附着在集尘电极122上，所以可以降低灰尘或颗粒对样品表面的粘附。 代替使用集尘电极，可以在包含载物台的真空室的壁上形成凹部，或者在壁上配置具有施加了预定电压的网状结构的金属板。 此外，通过在样品（200）上方的中心和集尘电极（122）设置具有通孔（124a）的间隙控制板（124），可以进一步减少灰尘或颗粒的附着。

公开(公告)号：US20200273658A1

公开(公告)日：2020-08-27

申请号：US16794948

申请日：2020-02-19

Applicant: EBARA CORPORATION

Inventor： Kenji WATANABE ,  Shinichi OKADA ,  Ryo TAJIMA ,  Tsutomu KARIMATA

IPC: H01J37/147 ,  H01J37/244

Abstract: Provided is an electron beam irradiation apparatus including: an aligner configured to perform an alignment of an electron beam by deflecting the electron beam; a deflector having a plurality of electrodes and configured to deflect the electron beam after passing through the aligner; and an adjuster configured to adjust deflection caused by the aligner, wherein the adjuster is configured to perform, on each of the plurality of electrodes, detecting an image of the electron beam by applying a test voltage to one of the plurality of electrodes and applying a reference voltage to the other electrodes, determine a position shift of the electron beam based on each position of the image of the electron beam corresponding to each electrode, and adjust deflection of the aligner so as to cancel the position shift of the electron beam.

公开(公告)号：US20180040452A1

公开(公告)日：2018-02-08

申请号：US15667040

申请日：2017-08-02

Applicant: EBARA CORPORATION

Inventor： Masahiro HATAKEYAMA ,  Ryo TAJIMA ,  Kenichi SUEMATSU ,  Kenji WATANABE ,  Yasushi TOMA ,  Kenji TERAO ,  Takeshi MURAKAMI

IPC: H01J37/05 ,  H01J37/147 ,  H01J37/141

CPC classification number: H01J37/05 ,  H01J37/141 ,  H01J37/147 ,  H01J37/244 ,  H01J37/26 ,  H01J37/29

Abstract: An electron beam inspection device includes: a primary electron optical system that irradiates the surface of a sample with an electron beam; and a secondary electron optical system that gathers secondary electrons emitted from the sample and forms an image on the sensor surface of a detector. An electron image of the surface of the sample is obtained from a signal detected by the detector, and the sample is inspected. A cylindrical member that is formed with conductors stacked as an inner layer and an outer layer, and an insulator stacked as an intermediate layer is provided inside a lens tube into which the secondary electron optical system is incorporated. An electron orbital path is formed inside the cylindrical member, and the members constituting the secondary electron optical system are arranged outside the cylindrical member.

公开(公告)号：US20210012997A1

公开(公告)日：2021-01-14

申请号：US16879151

申请日：2020-05-20

Applicant: EBARA CORPORATION

Inventor： Takehide HAYASHI ,  Ryo TAJIMA ,  Tatsuya KOHAMA ,  Kenji WATANABE ,  Tsutomu KARIMATA

IPC: H01J37/147 ,  H01J37/244 ,  H01J37/14 ,  H01J37/32

Abstract: An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.

公开(公告)号：US20180233374A1

公开(公告)日：2018-08-16

申请号：US15873108

申请日：2018-01-17

Applicant: EBARA CORPORATION

Inventor： Ryo TAJIMA ,  Masahiro HATAKEYAMA ,  Kenichi SUEMATSU ,  Kiwamu TSUKAMOTO ,  Kenji WATANABE ,  Shoji YOSHIKAWA ,  Shinichi OKADA ,  Kenji TERAO

IPC: H01L21/3065 ,  H01J37/302 ,  H01J37/305 ,  H01J37/147

CPC classification number: H01L21/3065 ,  H01J37/073 ,  H01J37/1474 ,  H01J37/20 ,  H01J37/244 ,  H01J37/3023 ,  H01J37/304 ,  H01J37/3053 ,  H01J37/317 ,  H01J2237/043 ,  H01J2237/061 ,  H01J2237/06333 ,  H01J2237/06375 ,  H01J2237/083 ,  H01J2237/1205 ,  H01J2237/1516 ,  H01J2237/166 ,  H01J2237/204 ,  H01J2237/24514 ,  H01J2237/30455 ,  H01J2237/30483 ,  H01L21/0273

Abstract: Provided is a method of adjusting an electron-beam irradiated area in an electron beam irradiation apparatus that deflects an electron beam with a deflector to irradiate an object with the electron beam, the method including: emitting an electron beam while changing an irradiation position on an adjustment plate by controlling the deflector in accordance with an electron beam irradiation recipe, the adjustment plate detecting a current corresponding to the emitted electron beam; acquiring a current value detected from the adjustment plate; forming image data corresponding to the acquired current value; determining whether the electron-beam irradiated area is appropriate based on the formed image data; and updating the electron beam irradiation recipe when the electron-beam irradiated area is determined not to be appropriate.