公开(公告)号：US20180040452A1

公开(公告)日：2018-02-08

申请号：US15667040

申请日：2017-08-02

Applicant: EBARA CORPORATION

Inventor： Masahiro HATAKEYAMA ,  Ryo TAJIMA ,  Kenichi SUEMATSU ,  Kenji WATANABE ,  Yasushi TOMA ,  Kenji TERAO ,  Takeshi MURAKAMI

IPC: H01J37/05 ,  H01J37/147 ,  H01J37/141

CPC classification number: H01J37/05 ,  H01J37/141 ,  H01J37/147 ,  H01J37/244 ,  H01J37/26 ,  H01J37/29

Abstract: An electron beam inspection device includes: a primary electron optical system that irradiates the surface of a sample with an electron beam; and a secondary electron optical system that gathers secondary electrons emitted from the sample and forms an image on the sensor surface of a detector. An electron image of the surface of the sample is obtained from a signal detected by the detector, and the sample is inspected. A cylindrical member that is formed with conductors stacked as an inner layer and an outer layer, and an insulator stacked as an intermediate layer is provided inside a lens tube into which the secondary electron optical system is incorporated. An electron orbital path is formed inside the cylindrical member, and the members constituting the secondary electron optical system are arranged outside the cylindrical member.

公开(公告)号：US20150371813A1

公开(公告)日：2015-12-24

申请号：US14747488

申请日：2015-06-23

Applicant: EBARA CORPORATION

Inventor： Masahiro HATAKEYAMA ,  Kenichi SUEMATSU ,  Ryo TAJIMA ,  Kiwamu TSUKAMOTO ,  Kenji TERAO ,  Shoji YOSHIKAWA

IPC: H01J37/20 ,  H01J37/305 ,  H01J37/22 ,  H01J37/073 ,  H01J37/10

CPC classification number: H01J37/20 ,  H01J37/226 ,  H01J37/3005 ,  H01J37/3023 ,  H01J37/3056 ,  H01J37/3177 ,  H01J2237/24535

Abstract: A surface processing apparatus is an apparatus which performs surface processing on an inspection object 20 by irradiating the inspection object with an electron beam. A surface processing apparatus includes: an electron source 10 (including lens system that controls beam shape of electron beam) which generates an electron beam; a stage 30 on which an inspection object 20 to be irradiated with the electron beam is set; and an optical microscope 110 for checking a position to be irradiated with the electron beam. The current value of the electron beam which irradiates the inspection object 20 is set at 10 nA to 100 A.

Abstract translation: 表面处理装置是通过用电子束照射检查对象对检查对象物20进行表面处理的装置。 表面处理装置包括：产生电子束的电子源10（包括控制电子束的光束形状的透镜系统）; 设置有用电子束照射的检查对象物20的台架30; 以及用于检查用电子束照射的位置的光学显微镜110。 将检查对象物20照射的电子束的当前值设定为10nA〜100A。

公开(公告)号：US20140091215A1

公开(公告)日：2014-04-03

申请号：US14096361

申请日：2013-12-04

Applicant: Ebara Corporation

Inventor： Kenji WATANABE ,  Masahiro HATAKEYAMA ,  Yoshihiko NAITO ,  Tatsuya KOHAMA ,  Kenji TERAO ,  Takeshi MURAKAMI ,  Takehide HAYASHI ,  Kiwamu TSUKAMOTO ,  Hiroshi SOBUKAWA ,  Norio KIMURA

IPC: H01J37/22

CPC classification number: H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate (124) having a through hole (124a) at the center above the sample (200) and the dust collecting electrode (122).

Abstract translation: 提供一种电光检查装置，其能够尽可能地防止灰尘或颗粒附着到样品表面。 将其上放置有样品（200）的载物台（100）设置在能够抽真空的真空室（112）的内部，并且设置集尘电极（122）以包围样品（200）的周围， 。 集尘电极（122）施加与施加到样品（200）的电压相同极性的电压和与电压的绝对值相同或更大的绝对值。 因此，由于灰尘或颗粒例如颗粒附着在集尘电极122上，所以可以降低灰尘或颗粒对样品表面的粘附。 代替使用集尘电极，可以在包含载物台的真空室的壁上形成凹部，或者在壁上配置具有施加了预定电压的网状结构的金属板。 此外，通过在样品（200）上方的中心和集尘电极（122）设置具有通孔（124a）的间隙控制板（124），可以进一步减少灰尘或颗粒的附着。

公开(公告)号：US20180233374A1

公开(公告)日：2018-08-16

申请号：US15873108

申请日：2018-01-17

Applicant: EBARA CORPORATION

Inventor： Ryo TAJIMA ,  Masahiro HATAKEYAMA ,  Kenichi SUEMATSU ,  Kiwamu TSUKAMOTO ,  Kenji WATANABE ,  Shoji YOSHIKAWA ,  Shinichi OKADA ,  Kenji TERAO

IPC: H01L21/3065 ,  H01J37/302 ,  H01J37/305 ,  H01J37/147

CPC classification number: H01L21/3065 ,  H01J37/073 ,  H01J37/1474 ,  H01J37/20 ,  H01J37/244 ,  H01J37/3023 ,  H01J37/304 ,  H01J37/3053 ,  H01J37/317 ,  H01J2237/043 ,  H01J2237/061 ,  H01J2237/06333 ,  H01J2237/06375 ,  H01J2237/083 ,  H01J2237/1205 ,  H01J2237/1516 ,  H01J2237/166 ,  H01J2237/204 ,  H01J2237/24514 ,  H01J2237/30455 ,  H01J2237/30483 ,  H01L21/0273

Abstract: Provided is a method of adjusting an electron-beam irradiated area in an electron beam irradiation apparatus that deflects an electron beam with a deflector to irradiate an object with the electron beam, the method including: emitting an electron beam while changing an irradiation position on an adjustment plate by controlling the deflector in accordance with an electron beam irradiation recipe, the adjustment plate detecting a current corresponding to the emitted electron beam; acquiring a current value detected from the adjustment plate; forming image data corresponding to the acquired current value; determining whether the electron-beam irradiated area is appropriate based on the formed image data; and updating the electron beam irradiation recipe when the electron-beam irradiated area is determined not to be appropriate.