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1.发明授权公开(公告)号：US11037768B2
公开(公告)日：2021-06-15
申请号：US15448996
申请日：2017-03-03
发明人： Xiaodong Wang , Joung Joo Lee , Fuhong Zhang , Martin Lee Riker , Keith A. Miller , William Fruchterman , Rongjun Wang , Adolph Miller Allen , Shouyin Zhang , Xianmin Tang
IPC分类号： H01J37/34 , C23C14/35 , C23C14/54 , H01L21/768 , H01L21/285
摘要： Methods and apparatus for controlling the ion fraction in physical vapor deposition processes are disclosed. In some embodiments, a process chamber for processing a substrate having a given diameter includes: an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a rotatable magnetron above the target to form an annular plasma in the peripheral portion; a substrate support disposed in the interior volume to support a substrate having the given diameter; a first set of magnets disposed about the body to form substantially vertical magnetic field lines in the peripheral portion; a second set of magnets disposed about the body and above the substrate support to form magnetic field lines directed toward a center of the support surface; a first power source to electrically bias the target; and a second power source to electrically bias the substrate support.
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2.发明授权公开(公告)号：US12094699B2
公开(公告)日：2024-09-17
申请号：US18237934
申请日：2023-08-25
发明人： Xiaodong Wang , Joung Joo Lee , Fuhong Zhang , Martin Lee Riker , Keith A. Miller , William Fruchterman , Rongjun Wang , Adolph Miller Allen , Shouyin Zhang , Xianmin Tang
CPC分类号： H01J37/3458 , C23C14/345 , C23C14/351 , C23C14/54 , H01J37/3402 , H01J37/3405 , H01J37/3411 , H01J37/3441 , H01J37/3447 , H01J37/345 , H01J37/3452 , H01J37/3455
摘要： Methods and apparatus for processing substrates are disclosed. In some embodiments, a process chamber for processing a substrate includes: a body having an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support the substrate; a collimator disposed in the interior volume between the target and the substrate support; a first magnet disposed about the body proximate the collimator; a second magnet disposed about the body above the support surface and entirely below the collimator and spaced vertically below the first magnet; and a third magnet disposed about the body and spaced vertically between the first magnet and the second magnet. The first, second, and third magnets are configured to generate respective magnetic fields to redistribute ions over the substrate.
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公开(公告)号：USD937329S1
公开(公告)日：2021-11-30
申请号：US29728957
申请日：2020-03-23
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公开(公告)号：US11842890B2
公开(公告)日：2023-12-12
申请号：US16994616
申请日：2020-08-16
CPC分类号： H01J37/3441 , C23C14/34 , H01J37/3447
摘要： Methods and apparatus for reducing burn-in time of a physical vapor deposition shield, including: sputtering a dielectric target having a first dielectric constant to form a dielectric layer upon an inner surface of a shield, wherein the shield includes an aluminum oxide coating having a second dielectric constant in an amount sufficient to reduce the burn-in time, and wherein the first dielectric constant and second dielectric constant are substantially similar.
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公开(公告)号：USD970566S1
公开(公告)日：2022-11-22
申请号：US29813065
申请日：2021-10-26
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6.发明授权公开(公告)号：US11810770B2
公开(公告)日：2023-11-07
申请号：US17490840
申请日：2021-09-30
发明人： Xiaodong Wang , Joung Joo Lee , Fuhong Zhang , Martin Lee Riker , Keith A. Miller , William Fruchterman , Rongjun Wang , Adolph Miller Allen , Shouyin Zhang , Xianmin Tang
CPC分类号： H01J37/3458 , C23C14/345 , C23C14/351 , C23C14/54 , H01J37/3402 , H01J37/345 , H01J37/3405 , H01J37/3411 , H01J37/3441 , H01J37/3447 , H01J37/3452 , H01J37/3455
摘要： Methods and apparatus for processing substrates are disclosed. In some embodiments, a process chamber for processing a substrate includes: a body having an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support the substrate; a collimator disposed in the interior volume between the target and the substrate support; a first magnet disposed about the body proximate the collimator; a second magnet disposed about the body above the support surface and entirely below the collimator and spaced vertically below the first magnet; and a third magnet disposed about the body and spaced vertically between the first magnet and the second magnet. The first, second, and third magnets are configured to generate respective magnetic fields to redistribute ions over the substrate.
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公开(公告)号：US20200035527A1
公开(公告)日：2020-01-30
申请号：US16592084
申请日：2019-10-03
发明人： Fuhong Zhang , Sunil Kumar Garg , Paul Kiely , Martin Lee Riker , William Fruchterman , Zheng Wang , Xiaodong Wang
IPC分类号： H01L21/67 , G05B19/418 , G05B15/02
摘要： Methods and apparatus to minimize electromagnetic interference between adjacent process chambers of a cluster tool are described. The start time of the subject recipe is controlled based on the electromagnetic process window of the subject process chamber, the electromagnetic window of the first adjacent process chamber and of an optional second adjacent process chamber. The start time of the subject process chamber is controlled to prevent temporal overlap of the electromagnetic window of the subject chamber with the electromagnetic window of an adjacent chamber.
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公开(公告)号：US09960021B2
公开(公告)日：2018-05-01
申请号：US14182831
申请日：2014-02-18
发明人： Martin Lee Riker , Uday Pai , William Fruchterman , Keith A. Miller , Muhammad M. Rasheed , Thanh X. Nguyen , Kirankumar Savandaiah
CPC分类号： H01J37/3414 , C23C14/3407 , H01J37/3411 , H01J37/3423 , H01J37/3435
摘要： Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
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公开(公告)号：US11335577B2
公开(公告)日：2022-05-17
申请号：US16592084
申请日：2019-10-03
发明人： Fuhong Zhang , Sunil Kumar Garg , Paul Kiely , Martin Lee Riker , William Fruchterman , Zheng Wang , Xiaodong Wang
IPC分类号： H01L21/67 , G05B15/02 , G05B19/418
摘要： Methods and apparatus to minimize electromagnetic interference between adjacent process chambers of a cluster tool are described. The start time of the subject recipe is controlled based on the electromagnetic process window of the subject process chamber, the electromagnetic window of the first adjacent process chamber and of an optional second adjacent process chamber. The start time of the subject process chamber is controlled to prevent temporal overlap of the electromagnetic window of the subject chamber with the electromagnetic window of an adjacent chamber.
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公开(公告)号：US10438828B2
公开(公告)日：2019-10-08
申请号：US15718336
申请日：2017-09-28
发明人： Fuhong Zhang , Sunil Kumar Garg , Paul Kiely , Martin Lee Riker , William Fruchterman , Zheng Wang , Xiaodong Wang
IPC分类号： H01L21/67 , G05B15/02 , G05B19/418
摘要： Methods and apparatus to minimize electromagnetic interference between adjacent process chambers of a cluster tool are described. The start time of the subject recipe is controlled based on the electromagnetic process window of the subject process chamber, the electromagnetic window of the first adjacent process chamber and of an optional second adjacent process chamber. The start time of the subject process chamber is controlled to prevent temporal overlap of the electromagnetic window of the subject chamber with the electromagnetic window of an adjacent chamber.
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