公开(公告)号：US12077849B2

公开(公告)日：2024-09-03

申请号：US17737061

申请日：2022-05-05

申请人： IonQuest Corp.

发明人： Bassam Hanna Abraham ,  Roman Chistyakov

IPC分类号： C23C14/35 ,  C23C14/34 ,  H01J37/34 ,  H01L21/285

CPC分类号： C23C14/35 ,  C23C14/3407 ,  C23C14/3485 ,  H01J37/3405 ,  H01J37/3423 ,  H01J37/3458 ,  H01L21/2855

摘要： A method of depositing a layer on a substrate includes applying a first magnetic field to a cathode target, electrically coupling the cathode target to a first high power pulse resonance alternating current (AC) power supply, positioning an additional cylindrical cathode target electrode around the cathode, applying a second magnetic field to the additional cylindrical cathode target electrode, electrically coupling the additional cylindrical cathode target electrode to a second high power pulse resonance AC power supply, generating magnetic coupling between the cathode target and an anode, providing a feed gas, and selecting a time shift between negative voltage peaks associated with AC voltage waveforms generated by the first high power pulse resonance AC power supply and the second high power pulse resonance AC power supply. An apparatus includes a vacuum chamber, cathode target magnet assembly, first high power pulse resonance AC power supply, additional electrode, additional electrode magnet assembly, second high power pulse resonance AC power supply, and feed gas.

公开(公告)号：US20240258087A1

公开(公告)日：2024-08-01

申请号：US18535774

申请日：2023-12-11

申请人： INTEVAC, INC.

发明人： Samuel D. Harkness, IV ,  Thomas P. Nolan ,  Jae Ha Choi ,  Alexander Vassilievich Demtchouk ,  Terry Bluck

IPC分类号： H01J37/34 ,  C23C14/35 ,  C23C14/50

CPC分类号： H01J37/3452 ,  C23C14/35 ,  C23C14/50 ,  H01J37/3423 ,  H01J2237/002 ,  H01J2237/332

摘要： Sputtering system having cylindrical target with sputtering material on exterior surface; magnet arrangement inside the cylindrical target, having first set of magnets arranged on straight row, each having first pole facing interior wall of the target and second pole facing away from the interior wall, second set having plurality of magnets arranged in obround shape around the first set, each magnet having first pole facing away from the interior wall and second pole facing the interior wall; a keeper plate between the first set of magnets and the second set of magnets, such that straight line passing through an axis connecting the first pole and the second pole of a magnet from the second set intercepts the keeper plate prior to reaching the interior wall; and a cover.

公开(公告)号：US20180245212A1

公开(公告)日：2018-08-30

申请号：US15758459

申请日：2016-09-05

申请人： Evatec AG

发明人： Silvia Schwyn-Thony ,  Romeo Good ,  Michael Cheseaux ,  Marco Padrun

IPC分类号： C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

CPC分类号： C23C14/35 ,  C23C14/505 ,  H01J37/32715 ,  H01J37/32779 ,  H01J37/3408 ,  H01J37/3423 ,  H01J37/3452

摘要： A vacuum treatment apparatus includes a vacuum treatment recipient with a circular opening between an inside and exterior of the recipient. The recipient houses a turntable, which defines a plane (P) along its table surface, is drivingly rotatable around a central axis perpendicular to plane (P), and exhibits a plurality of circular substrates supports. The opening is arranged such that during a turn of the turntable the area of each of the substrate supports and the opening are fully aligned and completely face each other. The vacuum treatment apparatus also includes a PVD deposition source attached to the opening. The PVD source has a a circular material target and a static magnet arrangement. The magnet arrangement is arranged in a plane (M) in parallel to plane (P) and is not rotationally symmetric around a central axis running centrally through the magnet arrangement and being perpendicular to the plane (M).

公开(公告)号：US20180019108A1

公开(公告)日：2018-01-18

申请号：US15715859

申请日：2017-09-26

申请人： Applied Materials, Inc.

发明人： Brian T. WEST ,  Michael S. COX ,  Jeonghoon OH

IPC分类号： H01J37/34 ,  C23C14/35 ,  C23C14/34

CPC分类号： H01J37/3405 ,  C23C14/3407 ,  C23C14/35 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3429 ,  H01J37/3435 ,  H01J37/347 ,  H01J37/3491 ,  H01J37/3497

摘要： Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

公开(公告)号：US20170350001A1

公开(公告)日：2017-12-07

申请号：US15679480

申请日：2017-08-17

申请人： Applied Materials, Inc.

发明人： Zhendong Liu ,  Rongjun Wang ,  Xianmin Tang ,  Srinivas Gandikota ,  Tza-Jing Gung ,  Muhammad M. Rasheed

IPC分类号： C23C14/34 ,  H01J37/34

CPC分类号： C23C14/3407 ,  H01J37/342 ,  H01J37/3423

摘要： Target assemblies and PVD chambers including target assemblies are disclosed. The target assembly includes a target that has a concave shaped target. When used in a PVD chamber, the concave target provides more radially uniform deposition on a substrate disposed in the sputtering chamber.

公开(公告)号：US20170329200A1

公开(公告)日：2017-11-16

申请号：US15612928

申请日：2017-06-02

申请人： View, Inc.

发明人： Zhongchun Wang ,  Anshu A. Pradhan ,  Robert T. Rozbicki

IPC分类号： G02F1/15 ,  C23C14/00 ,  C23C14/08 ,  G02F1/155

CPC分类号： G02F1/1525 ,  C23C14/0036 ,  C23C14/083 ,  C23C14/5806 ,  G02F1/1508 ,  G02F1/1523 ,  G02F1/153 ,  G02F1/155 ,  G02F2001/1555 ,  H01J37/3405 ,  H01J37/3408 ,  H01J37/3417 ,  H01J37/3423 ,  H01J37/3429 ,  H01J37/3435 ,  H01J37/347

摘要： Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically-insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically-insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. In various embodiments, a counter electrode is fabricated to include a base anodically coloring material and one or more additives.

公开(公告)号：US20170327941A1

公开(公告)日：2017-11-16

申请号：US15395016

申请日：2016-12-30

申请人： Samsung Electronics Co., Ltd.

发明人： Woo-Jin KIM ,  Ki-Woong KIM ,  Joon-Myoung LEE

IPC分类号： C23C14/34 ,  C23C14/08 ,  C23C14/35

CPC分类号： C23C14/3464 ,  C23C14/081 ,  C23C14/225 ,  C23C14/3407 ,  C23C14/345 ,  C23C14/352 ,  H01J37/3405 ,  H01J37/3423

摘要： A sputtering apparatus includes a chamber configured to provide a space where a deposition process is performed on a substrate, a substrate holder configured to support the substrate within the chamber, and at least one turret-type target assembly located over the substrate, including a plurality of targets mounted thereon and adapted to operatively rotate by a predetermined angle about its longitudinal axis such that any one of the targets is off-axis aligned with respect to a film-deposited surface of the substrate.

公开(公告)号：US20170283941A1

公开(公告)日：2017-10-05

申请号：US15507816

申请日：2016-03-15

申请人： ULVAC, INC.

发明人： Shinya Nakamura ,  Hiroki Yamamoto

IPC分类号： C23C14/34 ,  H01J37/34

CPC分类号： C23C14/3407 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3491

摘要： A cathode assembly is provided in which, while preventing the occurrence of abnormal electric discharging between a projected portion of a backing plate and a side surface of a target, particles can be prevented from being generated. The cathode assembly for a sputtering apparatus of this invention has: a target made of an insulating material; a backing plate bonded to one surface of the target; and, where such a side of the backing plate as is on the side of the target is defined as a lower side, an annular shield plate disposed to lie opposite to the lower side of that projected portion of the backing plate which is projected outward beyond an outer peripheral end of the target. The cathode assembly has a bonding portion arranged to be protruded relative to the projected portion. An inner peripheral edge portion of the shield plate is positioned in a clearance between that extended portion of the target which is extended outward beyond the bonding portion in a state in which the target is kept bonded to the bonding portion, and the projected portion of the backing plate.

公开(公告)号：US20170275762A1

公开(公告)日：2017-09-28

申请号：US14882401

申请日：2015-10-13

申请人： ASCEN TOOL INC

发明人： George Xinsheng Guo

IPC分类号： C23C16/54 ,  C23C14/34 ,  C23C14/35 ,  H01J37/32

CPC分类号： C23C16/54 ,  C23C14/3407 ,  C23C14/3464 ,  C23C14/35 ,  C23C14/352 ,  H01J37/3244 ,  H01J37/32743 ,  H01J37/3402 ,  H01J37/3417 ,  H01J37/3423 ,  H01J37/3438

摘要： The present application discloses a new type of deposition source, where individual sources are placed in a substantial closed loop. The closed polygon deposition sources have no end in circumference and enable better deposition uniformity. A closed loop deposition sources minimize the edge effects in sputtering, chemical vapor deposition (CVD) and plasma enhanced chemical vapor deposition (PECVD) and increase deposition material utilization.

公开(公告)号：US09758856B2

公开(公告)日：2017-09-12

申请号：US14765873

申请日：2014-02-04

申请人： SOLERAS ADVANCED COATINGS BVBA

发明人： Jorg Oberste Berghaus ,  Wilmert De Bosscher

IPC分类号： C23C14/00 ,  C23C14/08 ,  C04B35/453 ,  C04B35/457 ,  C04B37/02 ,  C23C14/34 ,  H01J37/34

CPC分类号： C23C14/086 ,  C04B35/453 ,  C04B35/457 ,  C04B37/026 ,  C04B2235/3284 ,  C04B2235/3286 ,  C04B2235/3293 ,  C04B2235/77 ,  C04B2235/95 ,  C04B2237/124 ,  C04B2237/34 ,  C04B2237/40 ,  C23C14/34 ,  C23C14/3414 ,  H01J37/3423 ,  H01J37/3429 ,  H01J2237/3322

摘要： A sputtering target having a one-piece top coat comprising a mixture of oxides of zinc, tin, and optionally gallium, characterized in that said one-piece top coat has a length of at least 80 cm; a method for forming such a sputtering target and the use of such a target for forming films.